Microelectronics Assembly Operator Mid

Microelectronics Assembly Operator (Mid Level) Key Responsibilities -Perform die attach operations (epoxy and/or eutectic methods) on ceramic substrates and hybrid circuits, with support from senior staff on complex builds -Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards -Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects -Solder fine-pitch components, leads, and interconnects under microscope -Assist with or perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) under supervision -Conduct in-process visual inspections per IPC/MIL specifications -Read and interpret schematics, assembly drawings, and work instructions -Maintain accurate documentation/travelers for traceability -Escalate process issues to Senior Operator and support troubleshooting efforts -Maintain a clean, ESD-safe workstation and comply with all safety protocols Required Qualifications -2-5 years of hands-on experience in hybrid microelectronics assembly -Working proficiency in die attach, wire bonding, and fly wire/tack wire methods -Exposure to soldering and lid seal processes (independent proficiency not required but preferred) -Familiarity with MIL-STD-883, J-STD-001, or IPC-A-610 standards (or equivalent) -Ability to work under high magnification (microscope) for extended periods -Strong attention to detail and manual dexterity -Willingness to learn from and take direction from senior technical staff Preferred Qualifications -IPC certification(s), or working toward certification -Experience or coursework related to government/defense contract manufacturing -Prior experience in a cleanroom or controlled environment Physical Requirements -Ability to sit for extended periods while working under a microscope -Fine motor control for precision assembly work Temp to Perm and open to Direct Hire for the right candidate