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Added 2 days ago
IC
Sort Probe Card Module Engineer
Intel Corporation
NM
- $103,730 to $146,440 USD / year
New Mexico is Intel's flagship high-volume Advanced Packaging manufacturing site, providing full co-location of the Advanced Packaging line at a single site, with New Mexico Die Sort (NM…
Added 4 days ago
IC
WPM C4 Quality and Reliability Engineer
Intel Corporation
OR
- $89,010 to $125,660 USD / year
…yield improvement to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide network of manufacturing, advanced…
Added 7 days ago
I
Packaging Research and Development Engineer
Intel
Phoenix, AZ
- $133,800 to $188,890 USD / year
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of…
Added 9 days ago
Staff Engineer Microelectronics Packaging Technology
TTM Technologies, Inc.
SYRACUSE, NY
TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board ManufacturerAbout TTM TTM Technologies, Inc. is a leading global manufacturer of…
Added 13 days ago
Staff Engineer Microelectronics Packaging Technology
TTM Technologies, Inc.
SYRACUSE, NY
TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board ManufacturerAbout TTM TTM Technologies, Inc. is a leading global manufacturer of…
Added 16 days ago
IC
Sort/Test Quality & Reliability Engineer (QRE)
Intel Corporation
OR
- $120,860 to $231,670 USD / year
Advanced packaging, foundry manufacturing, supplier quality, and ODM manufacturing systems
Added 19 days ago
Staff Engineer – Microelectronics Packaging Technology
TTM Technologies, Inc.
Syracuse, NY
As a Staff Engineer – Microelectronics Packaging Technology, you will be part of a multidisciplinary advanced technology team developing highly integrated System-In-Packages (SiP) and…
Added 19 days ago
Staff Mission Systems Engineer, Electronic Assemblies, Active Clearance
Anduril Industries
Costa Mesa, CA
Anduril’s Air Dominance and Strike (AD&S) team is seeking a Mission Systems Engineer to join our team with a strong background in integration and packaging of electronics assemblies both at…
Added 19 days ago
Senior Mission Systems Engineer, Electronic Assemblies, Active Clearance
Anduril Industries
Costa Mesa, CA
Anduril’s Air Dominance and Strike (AD&S) team is seeking a Mission Systems Engineer to join our team with a strong background in integration and packaging of electronics assemblies both at…

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TTM Technologies, Inc.

Staff Engineer Microelectronics Packaging Technology

SYRACUSE, NY, United States

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Job details

Posting language: English
Posted: Oct 20, 2026

Original job description

TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board ManufacturerAbout TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.Additional information can be found at www.ttm.comPosition Summary:As a Staff Engineer - Microelectronics Packaging Technology, you will be part of a multidisciplinary advanced technology team developing highly integrated System-In-Packages (SiP) and module sub-systems for Aerospace, Defense, Industrial, medical use cases. You will be an individual contributor with subject matter expertise to design and layout heterogeneously integrated SiP packages, analyze thermal and mechanical behavior, and support development of SiP design infrastructure. This is an excellent opportunity to work across full spectrum of technology development cycle from conceptualization (early TRLs) to manufacturing readiness (mid-MRLs)This role calls for an individual to provide in-depth engineering analysis, model-based engineering problem solving, and collaborate cross-functionally. You will interface closely with teams across internal manufacturing, operations, business units, external material suppliers, and process vendors. The successful candidate will foster technology-driven thinking for differentiation, but manufacturing-informed for design packaging solutions.Role's Responsibilities: * Lead the design and development of advanced SiPs and module package solutions using 2D/3D packaging technologies with 50micron to 130micron flip-chip interconnects, WLP bumped die, and embedded die. * Provide technical leadership in support of package architecture selection by generating 3D package designs, manufacturability, and risk assessments. * Generate and optimize detailed package designs in 3D environment using SOLIDWORKS. This will be done in collaborate with RF/MW/electrical engineering teams * Perform complex physics-based mechanical and vibration simulations for SiP configurations using FEM tools (ANSYS) to analyze chip-package interaction, package-board interaction, warpage, stress, and reliability risks. * Perform SiP-level thermal simulations for microelectronics packages using FEM tools (ANSYS) * Define and assist in the buildup of SiP design infrastructure that includes package design flows, 3D modeling and simulation methodologies, generating package design rules. * Lead or assist in writing white papers, technical proposals, and conference publications. * Benchmark industry best practices and evaluate emerging technologies for package design, assembly materials, and process innovations. * Perform and collate tradeoff analysis on ambiguous problems that considers interdisciplinary nature of semiconductor packages. * Communicate complex technical concepts effectively to cross-functional project teams, operations, suppliers, business teams * Be creative in designing and developing innovative integration methods that foster the spirit of differentiation and generation of IPs * Assist in project management by providing planning inputs for defining packaging tasks, schedule, and cost.Job Knowledge, Skills, Abilities * Must possess a strong knowledge across broad spectrum of packaging technology landscape from component packaging to heterogeneously integrated SiPs. * Must possess good understanding in various packaging elements such as substrate technologies, silicon interconnects, and metallurgy, underfills, epoxies, thermal interface materials, isolating shielding, assembly processes. * Demonstrate strong understandi

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