Dry/Plasma Etch GaN Process Development Engineer - 25017639 - Sherman

Dry/Plasma Etch GaN Process Development Engineer (SM1)

Job Identification: 25017639

Posting Date: 09/10/2026, 09:32 AM

We are seeking a highly motivatedAdvanced GaN Process Development Engineerto join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation GaN semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing.

The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving.

The responsibilities of a Manufacturing Development Process Engineer in this role include:

• Process Development

•

• Develop and optimize plasma etch processes for advanced semiconductor devices.
• Design and execute experiments (DOE) to improve critical process metrics, including:

•

• Etch rate
• Selectivity
• Critical dimension (CD) control
• Profile control
• Defectivity
• Uniformity
• Characterize process performance and establish process windows for manufacturing robustness.
• Evaluate new process chemistries, hardware configurations, and chamber technologies.

Technology Introduction

• - Support development and qualification of next-generation etch technologies.
• Collaborate with device integration teams to meet product and technology requirements.
• Drive process readiness for technology transfers from development into manufacturing.
• Establish process specifications, control plans, and release documentation.

Tool and Equipment Engineering

• - Partner with equipment engineering teams to improve tool capability, productivity, and reliability.
• Lead chamber matching, equipment qualification, and process performance improvement activities.
• Support installation and startup of new etch platforms.

Data Analysis and Continuous Improvement

• - Analyze complex process datasets using statistical methods and data analytics tools.
• Identify root causes of process excursions and implement corrective actions.
• Lead yield improvement and defect reduction initiatives.
• Utilize SPC methodologies to monitor and improve process stability.

Cross-Functional Collaboration

• - Work closely with:
• - Process Integration
• Manufacturing
• Yield Engineering
• Metrology
• Equipment Engineering
• Quality and Reliability teams
• Present technical findings and recommendations to management and key stakeholders.
• Mentor junior engineers and technicians as needed.

Qualifications

Minimum requirements:

• 5+ years of semiconductor plasma/dry etch process development experience.
• Bachelors in an engineering, science, or related STEM discipline
• Strong foundation in statistical process control, engineering change control and process release strategies
• Experience with DOE methodologies and statistical analysis.
• Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.

Preferred qualifications:

Experience in Gallium Nitride (GaN) and/or similar wide-bandgap III-V nitrides processes and technology development

Strong foundation in statistical process control, engineering change control and process release strategies

Proficiency with Python, Claude, or other AI models or tools is a plus

Demonstrated strong analytical and problem so