Dry/Plasma Etch GaN Process Development Engineer - 25017639 - Sherman

Dry/Plasma Etch GaN Process Development Engineer (SM1) Job Identification: 25017639 We are seeking a highly motivatedAdvanced GaN Process Development Engineerto join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation GaN semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing. The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving. The responsibilities of a Manufacturing Development Process Engineer in this role include: - Process Development - - Develop and optimize plasma etch processes for advanced semiconductor devices. - Design and execute experiments (DOE) to improve critical process metrics, including: - - Etch rate - Selectivity - Critical dimension (CD) control - Profile control - Defectivity - Uniformity - Characterize process performance and establish process windows for manufacturing robustness. - Evaluate new process chemistries, hardware configurations, and chamber technologies. Technology Introduction - - Support development and qualification of next-generation etch technologies. - Collaborate with device integration teams to meet product and technology requirements. - Drive process readiness for technology transfers from development into manufacturing. - Establish process specifications, control plans, and release documentation. Tool and Equipment Engineering - - Partner with equipment engineering teams to improve tool capability, productivity, and reliability. - Lead chamber matching, equipment qualification, and process performance improvement activities. - Support installation and startup of new etch platforms. Data Analysis and Continuous Improvement - - Analyze complex process datasets using statistical methods and data analytics tools. - Identify root causes of process excursions and implement corrective actions. - Lead yield improvement and defect reduction initiatives. - Utilize SPC methodologies to monitor and improve process stability. Cross-Functional Collaboration - - Work closely with: - - Process Integration - Manufacturing - Yield Engineering - Metrology - Equipment Engineering - Quality and Reliability teams - Present technical findings and recommendations to management and key stakeholders. - Mentor junior engineers and technicians as needed. Qualifications Minimum requirements: - 5+ years of semiconductor plasma/dry etch process development experience. - Bachelors in an engineering, science, or related STEM discipline - Strong foundation in statistical process control, engineering change control and process release strategies - Experience with DOE methodologies and statistical analysis. - Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools. Preferred qualifications: Experience in Gallium Nitride (GaN) and/or similar wide-bandgap III-V nitrides processes and technology development Strong foundation in statistical process control, engineering change control and process release strategies Proficiency with Python, Claude, or other AI models or tools is a plus Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions []{style="font-famil : Arial; "}