Jobs in the United States

25+ jobs

Save this search

Added 1 min ago
Information & Data Architect
Medtronic
Fridley, MN
…platform. This role leads data strategy, governance, modeling, integration, and stewardship efforts to ensure data is accurate, secure, accessible, and aligned with business, quality, and…
Added 1 min ago
Sr. Product Design Engineer
Rolls-Royce
Mankato, MN
Join our team as a Senior Product Design Engineer and play a critical role in the design, development, validation, and production release of advanced generator set systems, subsystems, and…
Added 1 min ago
Manager Advanced Technology 3
Northrop Grumman
Plymouth, MN
Lead and develop a team of chief engineers within the Design Engineering department. The Chief Engineering Team supports Northrop Grumman Armament System programs leading and directing the…
Added 1 min ago
Principal Software Engineer
Highmark Health
Saint Paul, MN
We are seeking a visionary Principal Software Engineer responsible for building scalable public-facing software applications across Digital Member Experience channels. As a key player…
Added 1 min ago
Senior Staff Full-stack Engineer - Global Payment Network (Remote - Eligible)
Capital One
Saint Paul, MN
As a Senior Staff Engineer at Capital One, you will be part of a community of technical experts working to define the future of banking in the cloud. You will work alongside our talented…
Added 2 mins ago
Cyber Operate Manager - GCP Cloud DevOps Engineer
Deloitte
Minneapolis, MN
Deloitte is seeking a Lead Managed Services Engineer II to design, automate, and operate enterprise-scale cloud capabilities that support clients' critical cyber assets. In this role, you…
Added 15 mins ago
Principal/Sr Principal Engineer Systems
Northrop Grumman
Roy, UT
Ensure the architecture and design of systems are functional and secure; support the design, development, implementation, and integration of security systems and system components.
Added 16 mins ago
Principal Software Engineer
Highmark Health
Salt Lake City, UT
We are seeking a visionary Principal Software Engineer responsible for building scalable public-facing software applications across Digital Member Experience channels. As a key player…
Added 16 mins ago
Senior Staff Full-stack Engineer - Global Payment Network (Remote - Eligible)
Capital One
Salt Lake City, UT
As a Senior Staff Engineer at Capital One, you will be part of a community of technical experts working to define the future of banking in the cloud. You will work alongside our talented…
Added 16 mins ago
Sr Engineer - Systems Design and Implementation
MOTOROLA INC
SALT LAKE CITY, UT
Added 16 mins ago
Senior Backend Engineer - AI Platform
WEX INC.
SALT LAKE CITY, UT
Added 16 mins ago
Cyber Operate Manager - GCP Cloud DevOps Engineer
Deloitte
Salt Lake City, UT
Deloitte is seeking a Lead Managed Services Engineer II to design, automate, and operate enterprise-scale cloud capabilities that support clients' critical cyber assets. In this role, you…
Added 26 mins ago
Senior Platform Engineer - API
Cargill
Atlanta, GA
…this job collaborates with cross functional teams to define, design and implement new features to meet user needs and business goals, and upgrade existing platforms to improve performance…
Added 50 mins ago
System I&T Engineer, Amazon Leo for Government (ALG), SEIT | MFG
Amazon
NORTHRIDGE, CA
The System Integration & Test (I&T) Engineer will engage with an experienced cross-disciplinary team to design, integrate, and test innovative product solutions. The System I&T Engineer…
Added 50 mins ago
Systems Engineer, Amazon Leo for Government (ALG), SEIT | MFG
Amazon
NORTHRIDGE, CA
The Systems Engineer will engage with an experienced cross-disciplinary team to design, integrate, and test innovative product solutions. The Systems Engineer will work closely with…
Added 50 mins ago
Cleared Senior/Principal R&D Mechanical Engineer - W87-0/Sentinel Integration, Onsite
Sandia National Laboratories
Livermore, CA
Our people are designing and building a suite of flight test vehicles to enable W87-0 integration on the Air Force's Sentinel missile. This is a highly collaborative work environment where…
Added 50 mins ago
Engineer I
General Atomics
Poway, CA
Engineering requirements would be applicable to both product design as well as manufacturing process design and development with an emphasis on the latter.
Added 50 mins ago
DE
Staff Content Security Engineer
Disney Entertainment
Glendale, CA
- $141,900 to $170,000 USD / year
Demonstrate subject matter expertise of the design and security integration of complex systems across platforms and cloud-native tools
Added 50 mins ago
Senior Software Development Engineer, IMDb Discovery Services
Amazon
Santa Monica, CA
Design and build the search, ranking, and list systems behind IMDb - the platform hundreds of millions of people use to find movies, shows, and talent. As a senior engineer, you'll own the…
Added 50 mins ago
Skunk Works Manufacturing Engineer Senior- Level 3
Lockheed Martin
Palmdale, CA
…analytics solutions for continuous improvement. Provides input to product design regarding design concepts and specification requirements to best utilize equipment and manufacturing…
Added 50 mins ago
Manufacturing Engineer Senior- Level 3
Lockheed Martin
Palmdale, CA
…analytics solutions for continuous improvement. Provides input to product design regarding design concepts and specification requirements to best utilize equipment and manufacturing…
Added 50 mins ago
Skunk Works Manufacturing Engineer Senior- Level 3- Clearance required
Lockheed Martin
Palmdale, CA
…analytics solutions for continuous improvement. Provides input to product design regarding design concepts and specification requirements to best utilize equipment and manufacturing…
Added 50 mins ago
ASIC/FPGA Verification Engineer - (Associate, Experienced, or Lead) - SoCal
The Boeing Company
El Segundo, CA
Our diverse development portfolio provides opportunities to learn with exposure to the breadth of the Boeing product line – approximately half our design/verification work is within the…
Added 51 mins ago
Sr Embedded Software Engineer (Board Bring Up)
Capgemini
Palo Alto, CA
We are looking for a Senior DSP & Audio Embedded Software Engineer to support the bring-up, integration, and validation of the DSP and Safety Processor subsystems on the iRDK platform. In…
Added 51 mins ago
A
Validation & Tooling Software Engineer
Actalent
Palo Alto, CA
- $55 to $70 USD / hour
We are seeking a highly skilled Software Engineer to join our team and design, maintain, and enhance our internal tooling and simulation infrastructure. This role focuses on accelerating…

Skyworks

Principal Packaging Engineer

Richardson, United States

$122,900 to $255,200 USD / year

Apply About employer

Applications open in a new tab.

Job details

Pay: $122,900 to $255,200 USD / year
Experience: 8+ years of industrial, government laboratory, or academic research experience in advanced microelectronics packaging, heterogeneous integration, or closely related fields.
Posting language: English

Original job description

Required. If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID: 78994

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 78994

Description

Qorvo, a part of Skyworks, is seeking a Principal Research Scientist to serve as a Principal Investigator and key individual contributor, providing technical leadership and innovation in RF-based 3D heterogeneous integration (3DHI). This role is responsible for identifying, developing, and maturing next-generation RF system-in-package (SiP), wafer-level packaging (WLP), and heterogeneous integration technologies that enable future radar, communications, and other emerging applications.

The successful candidate will be a recognized technical leader with a demonstrated track record of innovation, proposal development, funding capture, and technology transition. This individual will lead focused research initiatives, guide small multidisciplinary R&D teams, and collaborate across the organization to deliver high-impact technical outcomes. The role requires the creation of differentiated advanced packaging technologies that enable new product capabilities, accelerate technology adoption, strengthen intellectual property, and contribute directly to Skyworks' long-term commercial success and technology leadership.

Responsibilities

Lead research and technology development in advanced microelectronics packaging, including 3D heterogeneous integration (3DHI), wafer-level packaging (WLP), and advanced RF packaging technologies.
Develop innovative concepts, architectures, and integration approaches for RF systems, subsystems, and system-in-package (SiP) solutions.
Evaluate emerging materials, assembly processes, packaging architectures, and manufacturing technologies to improve RF performance, miniaturization, reliability, and cost.
Define and execute technology roadmaps aligned with business strategy, product needs, and long-term research objectives.
Develop RF-enabled heterogeneous integration solutions incorporating semiconductor devices, advanced substrates, embedded passives, antennas, and advanced interconnect technologies.
Lead modeling, simulation, characterization, and validation activities across device, package, and subsystem levels.
Collaborate with cross-functional teams including design, materials, manufacturing, reliability, product engineering, and business development organizations.
Identify, develop, and pursue externally funded research opportunities with government agencies, industry consortia, universities, national laboratories, and strategic partners.
Serve as Principal Investigator or technical lead on sponsored research programs, ensuring successful execution of technical objectives, schedules, and deliverables.
Publish technical papers, generate invention disclosures and patents, and present research findings at technical conferences, customer reviews, and industry forums.

Required Experience and Skills

Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related technical discipline.
8+ years of industrial, government laboratory, or academic research experience in advanced microelectronics packaging, heterogeneous integration, or closely related fields.
Demonstrated expertise in advanced package assembly, interconnect technologies, and subsystem integration.
Proven experience leading research programs from concept development through technology demonstration, transition, or commercialization.
Strong understanding of advanced packaging technologies, including multi-chip modules (MCM), system-in-package (SiP), wafer-level packaging (WLP), chiplet architectures, and 2.5D/3D integration.
Demonstrated record of technical innovation through patents, peer-reviewed publications, conference presentations, and significant technology contributions.
Experience leading multidisciplinary technical teams and collaborating effectively across organizational boundaries.
Strong written, verbal, and presentation skills, with the ability to communicate effectively with technical, business, customer, and executive audiences.
Demonstrated ability to develop technology strategy and influence research and development investment decisions.

Desired Experience and Skills

Recognized industry expert in RF-enabled heterogeneous integration, advanced packaging, or related technologies.
Experience with RF packaging solutions for microwave, mmWave, and sub-THz applications, including phased-array, radar, satellite communications, aerospace and defense, and wireless infrastructure systems.
Deep knowledge of laminate-based packaging, organic and inorganic substrates, package-on-package (PoP), embedded component technologies, and advanced interconnect architectures.
Experience with RF co-design across die, package, board, antenna, and system levels.
Strong understanding of thermal, mechanical, reliability, and manufacturability considerations for advanced package development.
Demonstrated success securing and leading externally funded research programs, including DARPA, DoW, or industry-sponsored programs.
Experience working with semiconductor foundries, OSATs, substrate manufacturers, and advanced packaging supply chains.
Established network within government, academic, and industry research communities.
Significant patent portfolio and strong publication record in leading journals and conferences.
Experience mentoring Ph.D.-level researchers and building technical capability within an R&D organization.
Experience influencing industry roadmaps, standards, consortium activities, or strategic technology initiatives related to advanced packaging and heterogeneous integration.

The typical base pay range for this role across the U.S. is currently USD $122,900 - $255,200 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.

Apply About employer

More about this job

Skills

Packaging
Think creatively
Research
Microelectronics
Assembly
Sales
Electrical engineering
Materials science
Mechanical engineering
Presentation skills
Coaching

Report this job