Jobs in the United States

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Added 4 mins ago
Cloud Network Architect
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Microsoft Certified: Azure Network Engineer Associate or Azure Solutions Architect Expert.
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Plant Engineer Sr - Plant Engineer Prin
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Begins networking with peers to share information and encourage cooperation.
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Area Lead Instrumentation Field Engineer
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Site Lead Instrumentation Field Engineer
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The Site Lead Instrumentation Field Engineer is responsible for planning, coordinating, and providing technical oversight of instrumentation and controls systems installed on the project.…
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Senior Platforms Engineer, Compute, Storage, and Virtualization
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…landscape, we are seeking a dynamic and experienced Senior Platforms Engineer to join our Infrastructure Engineering & Operations organization. This role combines deep technical expertise…
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Apply established cloud security, networking, resiliency, and governance patterns to deliver well‑managed enterprise environments.
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Cyber Security Systems Administrator - Cyber Security & TSOC - Akron FirstEnergy Headquarters
FirstEnergy
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The Operational Technology (OT) Engineer works at FirstEnergy's Transmission or Distribution Control Center with a team of analysts and engineers in support of the Energy Management System…
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Supervisor OT Network Security - Cyber Security & TSOC
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Assist the manager and director with coordinating team projects to engineer, design, configure, and administer platforms to deliver quality, secure, and functional solutions in support of…
Added 6 mins ago
ConvergeCONSUMER - Product Installation Engineer - Products & Platforms
Deloitte
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Are you a hands-on cloud engineer who thrives on turning complex deployments into smooth, repeatable rollouts? As a Product Installation Engineer with ConvergeCONSUMER, you'll bring our…
Added 6 mins ago
Field Engineer Intern - Tunnel
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…unique opportunities for hands-on experience, mentorship and networking, there's never been a better time to join our team. General Summary This position is responsible for assisting…
Added 6 mins ago
Google Infrastructure and Security Lead Architect
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…from establishing secure multi-tenant landing zones and robust networking topologies to guiding application migration strategies. A critical component of this role is embedding security by…
Added 6 mins ago
O
Lead Principal Site Reliability Engineer - (work in Vienna VA location)
Oracle
Columbus, OH
- $96,300 to $264,100 USD / year
We are seeking a highly motivated Site Reliability Engineer (SRE) to support a strategic customer's cloud platform and mission-critical applications. The SRE will be responsible for…
Added 6 mins ago
Senior Staff Full-stack Engineer - Global Payment Network (Remote - Eligible)
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As a Senior Staff Engineer at Capital One, you will be part of a community of technical experts working to define the future of banking in the cloud. You will work alongside our talented…
Added 6 mins ago
Senior Technical IT Storage Engineer
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Added 6 mins ago
Principal Infrastructure Engineer
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Site Reliability Engineer
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Lead Software Engineer - AWS/SRE Engineer
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As a Lead Software Engineer at JPMorgan Chase within the Deposits team of Consumer & Community Banking Division, you are an integral part of an agile team that works to enhance, build, and…
Added 7 mins ago
Senior Software Engineer, RF Spectrum Solutions
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Columbus, OH
Battelle's Advanced Microsystems Solutions (AMS) organization is seeking a Software Engineer to support the development of next-generation Radio Frequency (RF) and Spectrum Operations…
Added 34 mins ago
TT
Senior Platform Engineer
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- $175,000 to $220,000 USD / year
- Debug and tune systems across application code, storage, and networking, and mentor engineers through reviews, pairing, and technical guidance.
Added 1 hour ago
ND
Networking Service Delivery Field Support Engineer (L2)
NTT Data Americas, Inc.
Henderson, NV
- $40 USD / hour
NTT DATA Services currently seeks a Networking Service Delivery Field Support Engineer (L2) to join our team in Henderson, NV.
Added 1 hour ago
Site Reliability Engineer
Highmark Health
Carson City, NV
Added 2 hours ago
TT
Electrical & Computer Engineer
True Talent Solutions Partners
Los Angeles, CA
- $120,000 to $220,000 USD / year
A defense and space technology startup is looking for an Electrical & Computer Engineer to own flight-computer development and contribute to satellite compute systems. You will be the…

Skyworks

Principal Packaging Engineer

Richardson, United States

$122,900 to $255,200 USD / year

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Job details

Pay: $122,900 to $255,200 USD / year
Experience: 8+ years of industrial, government laboratory, or academic research experience in advanced microelectronics packaging, heterogeneous integration, or closely related fields.
Posting language: English

Original job description

Required. If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID: 78994

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 78994

Description

Qorvo, a part of Skyworks, is seeking a Principal Research Scientist to serve as a Principal Investigator and key individual contributor, providing technical leadership and innovation in RF-based 3D heterogeneous integration (3DHI). This role is responsible for identifying, developing, and maturing next-generation RF system-in-package (SiP), wafer-level packaging (WLP), and heterogeneous integration technologies that enable future radar, communications, and other emerging applications.

The successful candidate will be a recognized technical leader with a demonstrated track record of innovation, proposal development, funding capture, and technology transition. This individual will lead focused research initiatives, guide small multidisciplinary R&D teams, and collaborate across the organization to deliver high-impact technical outcomes. The role requires the creation of differentiated advanced packaging technologies that enable new product capabilities, accelerate technology adoption, strengthen intellectual property, and contribute directly to Skyworks' long-term commercial success and technology leadership.

Responsibilities

Lead research and technology development in advanced microelectronics packaging, including 3D heterogeneous integration (3DHI), wafer-level packaging (WLP), and advanced RF packaging technologies.
Develop innovative concepts, architectures, and integration approaches for RF systems, subsystems, and system-in-package (SiP) solutions.
Evaluate emerging materials, assembly processes, packaging architectures, and manufacturing technologies to improve RF performance, miniaturization, reliability, and cost.
Define and execute technology roadmaps aligned with business strategy, product needs, and long-term research objectives.
Develop RF-enabled heterogeneous integration solutions incorporating semiconductor devices, advanced substrates, embedded passives, antennas, and advanced interconnect technologies.
Lead modeling, simulation, characterization, and validation activities across device, package, and subsystem levels.
Collaborate with cross-functional teams including design, materials, manufacturing, reliability, product engineering, and business development organizations.
Identify, develop, and pursue externally funded research opportunities with government agencies, industry consortia, universities, national laboratories, and strategic partners.
Serve as Principal Investigator or technical lead on sponsored research programs, ensuring successful execution of technical objectives, schedules, and deliverables.
Publish technical papers, generate invention disclosures and patents, and present research findings at technical conferences, customer reviews, and industry forums.

Required Experience and Skills

Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related technical discipline.
8+ years of industrial, government laboratory, or academic research experience in advanced microelectronics packaging, heterogeneous integration, or closely related fields.
Demonstrated expertise in advanced package assembly, interconnect technologies, and subsystem integration.
Proven experience leading research programs from concept development through technology demonstration, transition, or commercialization.
Strong understanding of advanced packaging technologies, including multi-chip modules (MCM), system-in-package (SiP), wafer-level packaging (WLP), chiplet architectures, and 2.5D/3D integration.
Demonstrated record of technical innovation through patents, peer-reviewed publications, conference presentations, and significant technology contributions.
Experience leading multidisciplinary technical teams and collaborating effectively across organizational boundaries.
Strong written, verbal, and presentation skills, with the ability to communicate effectively with technical, business, customer, and executive audiences.
Demonstrated ability to develop technology strategy and influence research and development investment decisions.

Desired Experience and Skills

Recognized industry expert in RF-enabled heterogeneous integration, advanced packaging, or related technologies.
Experience with RF packaging solutions for microwave, mmWave, and sub-THz applications, including phased-array, radar, satellite communications, aerospace and defense, and wireless infrastructure systems.
Deep knowledge of laminate-based packaging, organic and inorganic substrates, package-on-package (PoP), embedded component technologies, and advanced interconnect architectures.
Experience with RF co-design across die, package, board, antenna, and system levels.
Strong understanding of thermal, mechanical, reliability, and manufacturability considerations for advanced package development.
Demonstrated success securing and leading externally funded research programs, including DARPA, DoW, or industry-sponsored programs.
Experience working with semiconductor foundries, OSATs, substrate manufacturers, and advanced packaging supply chains.
Established network within government, academic, and industry research communities.
Significant patent portfolio and strong publication record in leading journals and conferences.
Experience mentoring Ph.D.-level researchers and building technical capability within an R&D organization.
Experience influencing industry roadmaps, standards, consortium activities, or strategic technology initiatives related to advanced packaging and heterogeneous integration.

The typical base pay range for this role across the U.S. is currently USD $122,900 - $255,200 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.

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More about this job

Skills

Packaging
Think creatively
Research
Microelectronics
Assembly
Sales
Electrical engineering
Materials science
Mechanical engineering
Presentation skills
Coaching

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