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Added 16 mins ago
Senior Engineer
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Added 17 mins ago
Senior Cloud Engineer/Architect (AWS)
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Added 29 mins ago
Solutions Engineer
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Added 29 mins ago
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Senior Network Engineer - TS/SCI Clearance
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Added 52 mins ago
Software Engineering Manager II, YouTube
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Added 1 hour ago
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Software Engineer (Multiple openings) in Irving, TX.
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Added 1 hour ago
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Added 1 hour ago
Sr Software Engineer (Product Engineering Background)
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Added 1 hour ago
Sr Consultant, Software Engineering - Forward Deployed Engineering
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Added 1 hour ago
Consultant, Software Engineer - Platform Engineering
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OH · AZ · IA
Added 1 hour ago
Consultant, Software Engineer - Forward Deployed Engineering
Nationwide Life and Annuity Insurance Co
OH · AZ · IA
Added 1 hour ago
IT Helpdesk Engineer
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The IT Helpdesk Engineer is responsible for following and supporting IT policies and providing comprehensive technical support to end users. This role involves assisting employees with a…
Added 1 hour ago
Build Engineer
Etched
San Jose, CA
Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode…

Samsung Austin Semiconductor, LLC.

Etch Engineer - Process Owner

1530 FM 973 Taylor, TX, United States

The current base salary range for this role is between $102,230 to $122,230.

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Job details

Pay: The current base salary range for this role is between $102,230 to $122,230.
Apply by: Nov 17, 2026
Posting language: English
Posted: Nov 2, 2026

Original job description

About Samsung Austin Semiconductor Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

Come innovate with us!

Position Summary

As an Etch Engineer - Process Owner, see roles and responsibilities below. Role and Responsibilities

Develop and optimize Front End of Line (FEOL) and Back End of Line (BEOL) plasma etch processes for emerging Gate-All-Around (GAA) architectures including 2 nm node and mature semiconductor technology nodes, including 14nm, 17nm, 28nm FinFET. Implement and sustain Advanced Process Control (APC) methodologies, including feed-forward (FF) process control strategies for trench etch and via-height optimization. Perform Statistical Process Control/Fault Detection and Classification (SPC/FDC) monitoring, statistical yield analysis, and root-cause investigations for plasma etch process excursions, interlocks, and Out-of-Control Action Plan (OCAP) events. Qualify and integrate heterogeneous etch tool platforms, including LAM Research FLEX/KIYO, and/or TEL, Applied Materials, Mattson, PSK and SEMES and cross-platform etch equipment for production deployment. Conduct process matching and technology transfer activities across global semiconductor manufacturing sites. Support factory ramp-up activities through tool qualification planning, capacity optimization, and throughput improvement initiatives. Develop monitoring plans for post-preventive maintenance (PM) defect detection and production wafer qualification. Collaborate with equipment engineering, process integration, metrology, and yield enhancement teams to improve process stability and manufacturing efficiency. Utilize DOE methodologies and statistical analytics platforms, including Spotfire, JMP, Minitab, and Python for process optimization and defect reduction initiatives. Perform failure analysis and material characterization using SEM, EDX, spectroscopy, and related semiconductor characterization techniques. Support semiconductor manufacturing for automotive electronics, memory devices, RF technologies, and advanced display applications. Participate in cost-reduction and risk-assessment initiatives involving process hardware qualification and fab operational efficiency improvements. (Multiple Openings)

Skills and Qualifications

Bachelor’s degree in Chemical Engineering, Materials Science Engineering, Electrical Engineering, Semiconductor Engineering, or closely related engineering discipline and 24 months of experience in job offered or in a semiconductor plasma etch process engineering role within an advanced-node semiconductor manufacturing environment. Requires 24 months of experience involving the following: 1. Back End of Line (BEOL) and Front End of Line (FEOL) dry plasma etch process development and sustaining; 2. Semiconductor manufacturing using FinFET and/or Gate-All-Around (GAA) process technologies, including Nanosheet 3D transistor technology and Copper to Copper Hybrid Bonding; 3. Statistical Process Control (SPC), Fault Detection and Classification (FDC), Advanced Process Control (APC), and statistical yield analysis methodologies to detect, correct, and optimize semiconductor manufacturing processes to maximize yield; 4. Authorship of critical standard operating procedures (SOPs) for novel etch processes; 5. New Product Introduction: Facilitating launch of new products by optimizing etch recipes and tool spread, and implementing novel APC processes like Feed Forward APC; 6. Semiconductor tool qualification and process matching activities to ensure matching process baselines and hardware to hardware reproducibility; 7. Root-cause analysis for yield excursions and defect reduction; 8. Semiconductor process optimization using Design of Experiments (DOE) methodologies; 9. Semiconductor metrology and characterization, including SEM and EDX analysis; 10. Statistical analytics software, such as Spotfire, JMP, Minitab, or Python, to maximize wafer yield, optimize complex manufacturing processes, and detect equipment failures before they cause defects; and 11. High-volume manufacturing (HVM) and factory ramp support to transition a semiconductor design from a functional prototype into a commercially viable, cost-effective, and mass-produced product.

The current base salary range for this role is between $102,230 to $122,230. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifi cations and experience. Total compensation for this position will include a competitive benefi ts package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

Medical, dental, and vision insurance
Life insurance and 401(k) matching with immediate vesting
Onsite café(s) and workout facilities
Paid maternity and paternity leave
Paid time off (PTO) + 2 personal holidays and 10 regular holidays
Wellness incentives and MORE

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

Trade Secrets By submitting an application, you agree not to disclose to Samsung or induce or encourage Samsung to use any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

Please visit Samsung membership to see Privacy Policy, which defaults according to your location. You can change Country/Language at the bottom of the page. If you are European Economic Resident, please click here.
Samsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.

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More about this job

Skills

Control engineering
Statistical process control
SPC
Research
Preventive maintenance
Minitab
Python
SEM
Hazard assessment
Chemical engineering
Materials science
Electrical engineering
Process engineering
Manufacturing processes
Root cause analysis

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