Jobs in the United States

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Added 2 hours ago
Senior Instrumentation and Controls Design Engineer
Trustees of Princeton University
Princeton, NJ
Added 7 hours ago
Analog Design Engineer
Analog Devices Inc.
TX
Master’s degree in Electrical Engineering, Electronics Engineering, Microelectronics, or a closely related field
Added 8 hours ago
BN
Senior Motion Controls Engineer
Brookhaven National Laboratory
UPTON, NY
- $109,150 to $182,033 USD / year
…science, physics, chemistry, and biology. From batteries and microelectronics to drug design and future quantum computers, NSLS-II enables its growing research community to study materials…
Added 20 hours ago
Embedded Hardware Security Research Engineer
Riverside Research Institute
Dayton, OH
Embedded Hardware Security Research Engineer Location US-OH-Dayton ID 2026-4446 Category Research & Development Position Type Full Time Salary Riverside Overview Riverside Research is an…
Added 22 hours ago
Principal/Senior Principal Microelectronics Product Engineer
Northrop Grumman
Linthicum Heights, MD
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Microelectronics Product Engineer for…
Added 1 day ago
Staff Failure Analysis Engineer
Renesas Electronics
Palm Bay, FL
Renesas Electronics is seeking an enthusiastic, initiative-taking, and fast-learning Staff Failure Analysis Engineer to join our team in Palm Bay, Florida. In this role, you will play a…
Added 1 day ago
Instrumentation and Controls Engineer - Control Systems Focus
Princeton Plasma Physics Laboratory
Princeton, NJ
In this role you would serve as an Instrumentation & Control Engineer working closely with engineers and technical staff and researchers to design, deploy and operate systems used for…
Added 1 day ago
Senior Instrumentation and Controls Design Engineer
Princeton Plasma Physics Laboratory
Princeton, NJ
In this role you would serve as a Senior Instrumentation & Controls Engineer working closely with researchers, engineers and technical staff to design, deploy and operate systems used for…
Added 1 day ago
AS
EDA Engineer
Arizona State University
United States
- $86,900 to $125,000 USD / year
The Southwest Advanced Prototyping (SWAP) Hub is looking for an EDA Engineer. SWAP Hub is one of eight regional innovation hubs within the Department of Defense’s Microelectronics Commons…
Added 2 days ago
Principal Engineer-Yield Enhancement
Microchip - USA
CO
Semiconductor wafer fab device engineer with product and technology yield responsibility. Determines cause of low yields at parametric and wafer sort test, introduces new products into…
Added 2 days ago
Principal Wafer Process Engineer - 2nd shift
RTX
United States
…have an opportunity for a talented Principal Wafer Process Engineer – 2nd shift with a background in semiconductor manufacturing or thin film…
Added 2 days ago
Principal Analog Design Engineer
Renesas Electronics
Duluth, GA
Advanced degree in Electronics/Microelectronics Engineering or related discipline.
Added 2 days ago
AI enabled PDK Development Engineer
GLOBALFOUNDRIES U.S. INC.
NY
GlobalFoundries is seeking an AI-Enabled PDK Development Engineer with strong artificial intelligence and software-engineering skills to develop, implement, test, and support AI-guided…
Added 3 days ago
Heating Systems Group Lead
Trustees of Princeton University
Princeton, NJ
…also using its expertise to advance research in the areas of microelectronics, quantum sensors and devices, and sustainability sciences. Whether it be through science, engineering,…
Added 3 days ago
RE
Senior Principal Engineer
Renesas Electronics
San Jose, CA
- $239,000 to $299,000 USD / year
We are seeking a Power Design Engineer to lead the development of test vehicles supporting our high-current BCD (Bipolar-CMOS-DMOS) and low-voltage GaN power process and product portfolios.…
Added 4 days ago
LD
Principal Manufacturing Engineer
Leonardo DRS, Inc.
Cypress, CA
- $119,940 to $186,207 USD / year
Principal Manufacturing Engineer responsible for developing and sustaining hands-on microelectronics assembly processes in a cleanroom production environment. This is a working engineering…
Added 4 days ago
Heating Systems Group Lead
Princeton Plasma Physics Laboratory
Princeton, NJ
…also using its expertise to advance research in the areas of microelectronics, quantum sensors and devices, and sustainability sciences. Whether it be through science, engineering,…
Added 5 days ago
Associate, Computer / Electrical Engineer (FPGA Development)
L3Harris Technologies
Rochester, NY
Job Title: Associate, Computer / Electrical Engineer (FPGA Development)
Added 6 days ago
Electronic Component Structural Analysis Engineer
The Aerospace Corpor
Colorado Springs, CO
…the areas of vehicle engineering; guidance, navigation, and controls; robotics; electro-mechanical devices; embedded systems; fluid mechanics; propulsion; thermal control; orbital…
Added 6 days ago
Electronic Component Structural Analysis Engineer
The Aerospace Corpor
Colorado Springs, CO
…the areas of vehicle engineering; guidance, navigation, and controls; robotics; electro-mechanical devices; embedded systems; fluid mechanics; propulsion; thermal control; orbital…
Added 8 days ago
IC
Facilities Services - Intern, Graduate
Intel Corporation
OR · CA · AZ
- $89,098 to $89,102 USD / year
Facilities Instrumentation & Controls Engineer
Added 8 days ago
Senior Controls Systems Engineer
Bechtel
Chandler, AZ
…helping deliver the infrastructure behind the next generation of…
Added 8 days ago
Senior Engineer – System Security
BAE Systems
Broomfield, CO
Job Description We are seeking an experienced Senior System Security Engineer (SSE) to support cybersecurity engineering activities within BAE Systems Space & Mission Systems (SMS). In this…
Added 9 days ago
Staff Package Design Engineer
Renesas
Tempe, AZ
Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.
Added 9 days ago
Sr. Operations Quality Engineer
RTX
United States
We are seeking a Senior Operations Quality Engineer with hands-on hardware quality experience to become a key part of our Operations Quality Team within the Microelectronics/Radio Frequency…

Renesas

Staff Package Design Engineer

Tempe, AZ, United States

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Job details

Posting language: English
Posted: Oct 1, 2026

Original job description

Staff Package Design Engineer

Job Description

In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.

Key Responsibilities

Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
Develop and maintain package CAD databases, ensuring accuracy and adherence to package design guidelines, DFM, and DFA requirements to support manufacturability, yield, and long-term reliability.
Manage the package design cycle, including schematic creation, netlist import, footprint assignment, layout implementation, verification, and generation of manufacturing release outputs such as Gerber/drill data, fabrication drawings, assembly drawings, bump maps, and related documentation.
Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features.
Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams to support package-level co-optimization and participate in design reviews.
Ensure package designs comply with applicable foundry, OSAT, substrate vendor, and manufacturing design rules, including DRC, LVS, connectivity, and netlist verification requirements.
Support Engineering Change Order cycles, design updates, revision control, and release documentation throughout the project lifecycle.

Qualifications

4+ years of hands-on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, or equivalent CAD platforms.
Proven experience applying advanced package design rules, substrate vendor constraints, OSAT assembly requirements, DFM/DFA principles, and manufacturing release standards.
Experience interfacing directly with Tier-1 OSATs, substrate suppliers, foundries, silicon design teams, and product engineering teams.
Working understanding of SI/PI fundamentals, high-speed routing, impedance control, power/ground distribution, and crosstalk mitigation.
Strong communication, presentation, and technical documentation skills, with demonstrated experience working effectively in global, cross-functional engineering environments.

Education

Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Company Description

Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced packaging capabilities and seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices. In this role, you will design and deliver next-generation, high-performance package solutions that support our world-class product portfolio across automotive, industrial, infrastructure, and IoT applications.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement (https://jobs.renesas.com/diversity-and-inclusion) .

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

VideoUrl

https://www.youtube.com/embed/k-zs4tB6nNc

Department Engineering
Location Tempe
Remote No

Requisition ID

20033893_2026-09-23

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