Jobs in the United States

25+ jobs

Save this search

Added just now
IC
Industrial Engineer - Foundry Quality and Reliability Labs
Intel Corporation
AZ
- $140,830 to $198,820 USD / year
The Labs Industrial Engineer is responsible for optimizing the operational efficiency, capacity utilization, and quality performance of Foundry Quality Reliability Laboratory functions.…
Added just now
IC
Physical Design Clocking Engineer
Intel Corporation
CA
- $105,650 to $149,150 USD / year
As a Physical Design Engineer, you will play a critical role in the implementation of custom IP and SoC designs, transforming RTL to GDS to produce design databases ready for manufacturing.…
Added 8 mins ago
HPC Engineer
GD Information Technology, Inc.
United States
We are seeking an HPC Engineer to join a Scientific Technologies team supporting high-performance computing (HPC) and scientific research at NIAID. This role focuses on the administration,…
Added 11 mins ago
TC
Power Distribution Intern
TRC Companies, Inc.
Nashville, TN
- $20 to $28 USD / hour
…long-lasting impacts for our communities and our clients in the power and energy, transportation and infrastructure, environmental, and property and buildings sectors. As part of our team,…
Added 11 mins ago
Electrical Engineer III
TRC Companies, Inc.
Boston, MA
…innovative solutions that stand the test of time. From pipelines to power plants, roadways to reservoirs, schoolyards to security solutions, clients look to TRC for breakthrough thinking…
Added 12 mins ago
O
Platform Software Engineer 2
Oracle
Nashville, TN
- $81,000 to $166,100 USD / year
Supports the implementation of standard and non-standard performance profiling and optimization of coding.
Added 26 mins ago
Lab Technician
Panasonic
Bridgeton, MO
The Lab Technician will set up and conduct performance testing to develop knowledge to continue Hussmann’s leadership position in Refrigeration Systems, Merchandisers, and associated…
Added 26 mins ago
Software Engineer Sr. Manager | Marketing Technology (Remote)
HOME DEPOT MANAGEMENT COMPANY, LLC
Remote, United States
…experiences. Our mission is to win for our customer by leveraging the power of data to deliver cross-channel personalized experiences at speed and scale. The Sr. Manager, Martech Data…
Added 33 mins ago
Sr. Engineer I (II)
PJM Interconnection, L.L.C.
Audubon, PA
Join our dynamic team as a Engineer, where you'll play a critical role in advancing interconnection projects within the PJM New Service Request Cycle study process. This position is your…
Added 40 mins ago
Senior Fullstack Engineer (Matchmaking)
Jobgether
Remote, United States
…and next steps. Our partner is looking for a Senior Fullstack Engineer (Matchmaking) based in the United…
Added 46 mins ago
M
Senior Software Engineer
Microsoft
United States
- $119,800 to $261,000 USD / year
The Azure Cloud Native Platform organization builds the distributed systems that power virtual machines and large-scale applications across Microsoft Azure. These systems operate at global…
Added 46 mins ago
M
Solution Engineer - Microsoft Innovation Hub
Microsoft
MA · Boston, MA · Boston
- $130,900 to $272,300 USD / year
As a Solution Engineer - Microsoft Innovation Hub, working on-site in the Microsoft Innovation Hub located in Burlington, Massachusetts, you will merge business and technical requirements…
Added 46 mins ago
M
Software Engineering IC2
Microsoft
WA · Redmond, WA · Redmond
- $85,400 to $183,700 USD / year
…You will learn Windows debugging, system behavior, drivers, power, performance, reliability, and device configuration while using logs and telemetry to investigate test…
Added 48 mins ago
M
Software Engineer 2
Microsoft
WA · CA · NY · Redmond, WA · Mountain View, CA · Redmond · Mountain View · New York
- $102,100 to $219,200 USD / year
…video, and multimodal content. We are looking for a Software Engineer 2 - Responsible AI who is passionate about building customer-facing AI services with scalable and sustainable…
Added 48 mins ago
M
Software Engineer
Microsoft
BC, CA
- $67,700 to $133,600 CAD / year
…Synapse Analytics, Azure Service Bus, Azure Event Grid, and Power BI. Our mission is to build the data platform for the age of AI, powering a new class of data-first applications and…
Added 57 mins ago
T
Network Engineer- CCNA
TEKsystems
Charlotte, NC
- $38 to $41 USD / hour
DescriptionWe are seeking a Network Engineer to provide advanced engineering support for the organization's global Data, Voice, Security, and Wireless networks. This role will have a…
Added 1 hour ago
N
Software Engineer
Nooks
Seattle, WA
- $200,000 to $330,000 USD / year
Nooks is an applied AI lab building revenue agents that power some of the fastest growing companies in the world. We build AI agents that operate across the full revenue lifecycle, from…
Added 1 hour ago
Embedded Linux Engineer – Qualcomm
Inabia Software & Consulting Inc.
Remote, United States
Optimize system stability, performance, and power consumption
Added 1 hour ago
PN
Research Engineer II - Building Energy Analysis
Pacific Northwest National Laboratory
UNAVAILABLE · Richland, WA · Seattle, WA · Portland, OR
- $89,300 USD / year
The BS&DG is seeking a Research Engineer II - Building Energy Analysis with strong knowledge of building energy systems, programming and data analysis skills, and experience evaluating…
Added 1 hour ago
PN
Research Engineer II - Building Energy Analysis
Pacific Northwest National Laboratory
Providence, RI
- $89,300 USD / year
The BS&DG is seeking a Research Engineer II - Building Energy Analysis with strong knowledge of building energy systems, programming and data analysis skills, and experience evaluating…
Added 1 hour ago
Q
Senior System Protection Engineer - Transmission Line
Qualus
Reno, NV
- $150,000 to $200,000 USD / year
Power your future with Qualus in our Engineering Department as an Senior Protection and Controls Engineer. As a Senior P&C Engineer you will beresponsible for protective relaying equipment,…
Added 1 hour ago
PN
Research Engineer II - Building Energy Analysis
Pacific Northwest National Laboratory
Carson City, NV
- $89,300 USD / year
The BS&DG is seeking a Research Engineer II - Building Energy Analysis with strong knowledge of building energy systems, programming and data analysis skills, and experience evaluating…
Added 1 hour ago
Mid-Level Databricks Engineer
Techstra Solutions
Pittsburgh, PA
We are seeking a Mid-Level Databricks Engineer to design, develop, and support scalable data solutions using Databricks and modern cloud data platforms. This role will focus on building…
Added 1 hour ago
Senior Databricks Engineer
Techstra Solutions
Pittsburgh, PA
We are seeking a Senior Databricks Engineer / Technical Lead with 10+ years of experience in data engineering, data warehousing, and ETL/ELT, including significant hands-on experience…
Added 1 hour ago
IL
Principal Engineer, SCADA Engineering- R10878
Invenergy LLC
Corinth, MS
- $155,000 to $182,500 USD / year
Job Description: Invenergy is North America's largest privately held developer, owner, and operator of power infrastructure. With 25 years of trusted execution, we deliver reliable,…

Renesas Electronics

Staff Package Design Engineer

Tempe, AZ, United States

Apply About employer

Applications open in a new tab.

Job details

Experience: 8+ years of related experience with a Bachelor’s degree (or 6+ years with a Master’s degree);
Posting language: English
Posted: Nov 3, 2026

Original job description

Job Description

In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. As a Staff-level contributor, you will serve as the technical focal point, guiding the architecture and physical design of next-generation, high-performance semiconductor packages, including 2.5D/3D heterogeneous integration, chiplet-based architectures, high-density interposers, and advanced substrate technologies. This role requires deep expertise in advanced packaging R&D, cross-domain co-design, and the ability to define methods and procedures for complex, multi-die integration assignments. You will lead cross-functional alignment with global silicon design, signal integrity/power integrity (SI/PI), thermal, and product engineering teams, while driving the creation of new packaging design rules and methodologies.

Key Responsibilities

Physical Architecture Leadership: Lead package layout architecture and physical design for next-generation heterogeneous integration, including 2.5D/3D chiplet packaging, high-density interposers, bridge technologies (e.g., EMIB equivalents), RDL, and advanced FCBGA solutions.
Methodology & Design Rules: Define, establish, and optimize package design rules and assembly Best Known Methods (BKMs); partner with foundries, substrate vendors, and OSATs to evaluate and validate advanced packaging capabilities, DRCs, and manufacturing limits.
Cross-Functional Technical Focal Point: Act as the primary package architecture lead across SI/PI, thermal, tooling, and platform integration teams. Lead design reviews to establish project scope, align stakeholder requirements, and balance pin budgets against electrical and mechanical trade-offs.
Layout & Release Management: Manage the complex package design cycle - including footprint assignment, stack-up structures, high-speed escape routing, power/ground distribution, and generation of manufacturing release outputs (Gerber/drill data, bump maps, assembly drawings).
Mentorship: Provide technical mentorship and guidance to junior and intermediate package design engineers, establishing standardized CAD workflows, layout techniques, and technical training to drive consistent execution across the department.

Qualifications

Experience

8+ years of related experience with a Bachelor’s degree (or 6+ years with a Master’s degree); OR 5+ years of intensive R&D experience in advanced 2.5D/3D heterogeneous packaging (bridge/interposer architectures) with demonstrated experience establishing new design rules and authoring engineering BKMs.
Advanced Packaging Expertise: Strong background in advanced substrate-based packages, flip-chip layout, multi-die/chiplet-based architectures, thermal mitigation, and high-density routing.
CAD Proficiency: High proficiency with industry-standard package design tools, specifically Siemens/Mentor Xpedition (Layout / Substrate Integrator), Valor NPI, and/or Cadence Allegro Package Designer / SiP Layout.
Cross-Disciplinary Acumen: Working understanding of SI/PI fundamentals, impedance control, crosstalk mitigation, and the ability to balance these constraints against pin budgets and platform integration requirements.
Leadership & Communication: Strong communication and technical documentation skills, with a proven ability to lead multi-disciplinary test vehicle or product design meetings and secure tooling/supplier approvals independently.

Education

Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Apply About employer

Report this job