Jobs in the United States

25+ jobs

Save this search

Added 24 mins ago
Automation Engineer
Valley Queen
Milbank, SD
Experience with robotics, vision systems, and automated packaging lines. Knowledge of MES systems, and data analytics for process optimization. Bilingual in English/Spanish.
Added 27 mins ago
Packaging Engineer - Burton Area
The Pivot Group Network
Burton · Burton, MI
Are you a skilled professional with a passion for excelling as a packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is dedicated to building…
Added 33 mins ago
Packaging Engineer - Alpena Area
The Pivot Group Network
Alpena · Alpena, MI
Are you a meticulous professional with a passion for excelling as a packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is dedicated to fostering…
Added 37 mins ago
Packaging Engineer - Dearborn Area
The Pivot Group Network
Dearborn · Dearborn, MI
Are you a meticulous professional with a passion for excelling as a packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is dedicated to fostering…
Added 39 mins ago
Packaging Engineer - Monroe Area
The Pivot Group Network
Monroe · Monroe, MI
Are you ready to take on a challenging and rewarding opportunity in packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is committed to building…
Added 41 mins ago
Packaging Engineer - Warren Area
The Pivot Group Network
Warren · Warren, MI
Are you a dynamic leader with a passion for excelling as a packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is dedicated to building…
Added 1 hour ago
Senior Systems Engineer IBM i
ULINE INC
PLEASANT PRAIRIE, WI
JOB REQUIREMENTS: Senior Systems Engineer - IBM i Corporate Headquarters 12575 Uline Drive, Pleasant Prairie, WI 53158 Keep Uline\'s IBM i systems running seemlessly. As a Senior Systems…
Added 2 hours ago
Product Pathfinding Engineer- HIG-TPG
Micron Technology, Inc.
Boise, ID
Micron Technology is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team!
Added 2 hours ago
Process Integration Engineer, APTD
Micron Technology, Inc.
Boise, ID
The Advanced Packaging Technology Development (APTD) team is developing the packaging and integration technologies that will power future generations of memory products. We bring together…
Added 3 hours ago
ProMade New Product Development Technician
Encore Medical LP
TX
Support the part number identification process by coordinating with Product Development, Manufacturing Engineering, Packaging Engineering, Quality, Regulatory Affairs, Supply Chain, and…
Added 4 hours ago
OS
Senior Software Engineer
Odyssey Systems Cons
Colorado Springs, CO
- $31,533 USD / year
We are seeking a Senior Software Engineer to be a primary technical contributor on the Multimode Threat Engagement Simulation Platform. You will own significant portions of the stack…
Added 4 hours ago
OS
Lead Software Engineer/Technical Program Manager
Odyssey Systems Cons
Colorado Springs, CO
- $31,533 USD / year
We are seeking a Lead Software Engineer / Technical Program Manager to own both the technical architecture and program execution of the Multimode Threat Engagement Simulation Platform - a…
Added 5 hours ago
Associate, Electrical Engineering (Rochester, NY)
L3Harris
Rochester, NY
Microelectronics Design requires training in advanced electronics packaging and MEMS technology
Added 5 hours ago
Manufacturing Engineer
CACI International
Rochester, NY
Experience with pressing, staking, riveting, swaging, potting, electronics soldering, conformal coating, packaging, X-ray inspection, laser welding, robotics, and control systems
Added 5 hours ago
Senior MLOps Engineer
C the Signs
Remote, United States
We’re hiring a Senior MLOps Engineer with deep machine learning engineering experience to build and operate the production platform powering ML/LLM-driven healthcare workflows. You’ll…
Added 7 hours ago
Head of GTM (AI Agents)
Bolder Apps
Remote, United States
Run pricing and packaging experiments. Learn fast from what buyers actually pay for
Added 7 hours ago
Principal Mixed Signal Design Engineer
Micron Technology, Inc.
Richardson, TX
Partner closely with Digital design and verification teams, Physical design and layout, Packaging, SI/PI, and process technology teams
Added 9 hours ago
Senior Materials and Process Engineer
ColdQuanta
Louisville, CO
We are seeking a Senior Materials and Process Engineer to own materials and manufacturing process development for the Quantum Gravity Gradiometer (QGG) program. This hands-on role turns…
Added 10 hours ago
Staff High Voltage System Architect and Simulation Engineer
Ford Motor Company
Allen Park, MI
As a Staff. HV System Design and Simulation Engineer, you will be working with cross functional teams including SW, mechanical packaging, vehicle integration, and EPA range to characterize…
Added 10 hours ago
Senior Closures Systems Sealing Engineer
Ford Motor Company
Allen Park, MI
The Senior Closures Systems Sealing Engineer will be a key member responsible for the design, development, and integration of closure mechanisms and primarily sealing for Advanced EV…
Added 10 hours ago
Product Development Engineer- Power Conversion EVSE D&R
Ford Motor Company
Dearborn, MI
The Electrified Powertrain Power Conversion EVSE D&R Engineer will own the design, release, packaging, and certification of Electric Vehicle Supply Equipment (EVSE) for future model battery…
Added 10 hours ago
Electrical Engineer
SIGMA
Garden City, GA
We are seeking a motivated and detail-oriented Entry-Level Electrical Engineer to join our engineering and maintenance team within a fast-paced food manufacturing environment. This position…
Added 10 hours ago
Industrial Mechanical Engineer
SIGMA
Garden City, GA
We are seeking a motivated and detail-oriented Entry-Level Industrial Mechanical Engineer to join our engineering and maintenance team in a fast-paced food manufacturing environment. This…
Added 11 hours ago
DevOps and Automation Engineer – ICPE
NVIDIA Corporation
North District, IL
We are looking for a creative, independent, and hands-on DevOps and Automation Engineer to join the IC Test and Product Engineering group in NVIDIA Networking Business Unit. NVIDIA…
Added 11 hours ago
Product Development Engineer
Shape Corporation
Novi, MI

Renesas Electronics

Staff Package Design Engineer

Tempe, AZ, United States

Apply About employer

Applications open in a new tab.

Job details

Experience: 8+ years of related experience with a Bachelor’s degree (or 6+ years with a Master’s degree);
Posting language: English
Posted: Nov 3, 2026

Original job description

Job Description

In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. As a Staff-level contributor, you will serve as the technical focal point, guiding the architecture and physical design of next-generation, high-performance semiconductor packages, including 2.5D/3D heterogeneous integration, chiplet-based architectures, high-density interposers, and advanced substrate technologies. This role requires deep expertise in advanced packaging R&D, cross-domain co-design, and the ability to define methods and procedures for complex, multi-die integration assignments. You will lead cross-functional alignment with global silicon design, signal integrity/power integrity (SI/PI), thermal, and product engineering teams, while driving the creation of new packaging design rules and methodologies.

Key Responsibilities

Physical Architecture Leadership: Lead package layout architecture and physical design for next-generation heterogeneous integration, including 2.5D/3D chiplet packaging, high-density interposers, bridge technologies (e.g., EMIB equivalents), RDL, and advanced FCBGA solutions.
Methodology & Design Rules: Define, establish, and optimize package design rules and assembly Best Known Methods (BKMs); partner with foundries, substrate vendors, and OSATs to evaluate and validate advanced packaging capabilities, DRCs, and manufacturing limits.
Cross-Functional Technical Focal Point: Act as the primary package architecture lead across SI/PI, thermal, tooling, and platform integration teams. Lead design reviews to establish project scope, align stakeholder requirements, and balance pin budgets against electrical and mechanical trade-offs.
Layout & Release Management: Manage the complex package design cycle - including footprint assignment, stack-up structures, high-speed escape routing, power/ground distribution, and generation of manufacturing release outputs (Gerber/drill data, bump maps, assembly drawings).
Mentorship: Provide technical mentorship and guidance to junior and intermediate package design engineers, establishing standardized CAD workflows, layout techniques, and technical training to drive consistent execution across the department.

Qualifications

Experience

8+ years of related experience with a Bachelor’s degree (or 6+ years with a Master’s degree); OR 5+ years of intensive R&D experience in advanced 2.5D/3D heterogeneous packaging (bridge/interposer architectures) with demonstrated experience establishing new design rules and authoring engineering BKMs.
Advanced Packaging Expertise: Strong background in advanced substrate-based packages, flip-chip layout, multi-die/chiplet-based architectures, thermal mitigation, and high-density routing.
CAD Proficiency: High proficiency with industry-standard package design tools, specifically Siemens/Mentor Xpedition (Layout / Substrate Integrator), Valor NPI, and/or Cadence Allegro Package Designer / SiP Layout.
Cross-Disciplinary Acumen: Working understanding of SI/PI fundamentals, impedance control, crosstalk mitigation, and the ability to balance these constraints against pin budgets and platform integration requirements.
Leadership & Communication: Strong communication and technical documentation skills, with a proven ability to lead multi-disciplinary test vehicle or product design meetings and secure tooling/supplier approvals independently.

Education

Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Apply About employer

Report this job