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Added 4 mins ago
Warehouse Lead Industrial Engineer - Ryder Last Mile (remote)
Ryder System
Augusta, ME
…improvement methods to support new and existing operations. The Lead Engineer will identify, lead and drive change within the operation through data driven CI, Engineering, and Automation…
Added 1 hour ago
Sr. Controls Engineer
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York, PA
Continually improve packaging and processing equipment controls logic for better efficiency and reduced waste.
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Added 9 hours ago
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Added 10 hours ago
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Sort Probe Card Module Engineer
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As a Sort Probe Card Module Engineer within the NM DS Probe Card Metrology (PCM) team, you will play an essential role in ensuring the efficiency and reliability of high-volume…
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Design Release Engineer - Power Transfer Module/Rear Drive Module
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Senior Principal Engineer
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San Jose, CA
- $239,000 to $299,000 USD / year
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Packaging Module Development Engineer
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- $133,800 to $188,890 USD / year
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Added 1 day ago
Silicon Photonics & Optical Packaging Eng
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…high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for…
Added 1 day ago
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Packaging Module Development Engineer
Intel Corporation
AZ
- $133,800 to $188,890 USD / year
Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role,…
Added 1 day ago
Silicon Photonics & Optical Packaging Eng
Apple
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…high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for…
Added 1 day ago
Lead Photonics System Engineer
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Austin, TX
Job Posting Title: Lead Photonics System Engineer
Added 1 day ago
Senior Staff Package Design Engineer
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Austin, TX
10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
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Engineer- Manufacturing Principal USA
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Experience in Photovoltaics Manufacturing Flow or Technology Development experience in the broad fields of Thin Film Vacuum Deposition, Glass Therm-Mechanical Processing, Module Packaging…
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Silicon Packaging Engineer
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Meta is looking for an experienced Silicon Packaging Engineer for its Ecosystem and Technical Operation team. The ideal candidate will be able to prioritize competing workstreams across a…
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Quantum Integration Engineer PMTS
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ROUND LAKE, NY
The Quantum Integration Engineer (PMTS) will serve as a principal technical contributor enabling GlobalFoundries' quantum computing roadmap. This individual will provide critical…
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Mechanical Design Engineer
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Tempe, AZ
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The day to day work encompasses electronics packaging, cabling, thermal analysis down to the component junction level, structural analysis, and qualification testing. You will ensure the…
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Advanced Packaging Development Engineer
Intel Corporation
AZ
- $133,800 to $188,890 USD / year
As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor…
Added 2 days ago
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Staff Module Design Engineer
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We are looking for a Staff Electrical Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve…
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Sr. Electrical Engineer
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Packaging Module Equipment Development Engineer
Intel Corporation
AZ
- $133,800 to $188,890 USD / year
We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and optimizing the…
Added 2 days ago
Wireless Module Engineer
Apple
Austin, TX · San Diego, CA · Sunnyvale, CA
…more than join something - you’ll add something. The Wireless Module Engineer (WME) is well-versed in multiple fields for wireless module development: RF design, packaging, product…

Renesas Electronics

Senior Staff Package Design Engineer

Austin, TX, United States

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Job details

Experience: 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
Posting language: English
Posted: Oct 27, 2026

Original job description

Job Description

RESPONSIBILITIES:

Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging.
Package technologies qualification for consumer & industrial power as well as automotive power applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critical process steps.
Establish production controls and monitor to ensure there is no room for quality incidents.
Ensure smooth transition into production & implement ramp up monitor.
Work with OSAT/CM to monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.
Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
Participate in packaging roadmap development & focus on execution.
Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
Establish & maintain package design rules.

Qualifications

Bachelors of Engineering Degree required in Physics, Chemistry, Mechanical, Electrical or Materials Engineering or a related field. Doctorate or Master's in is a plus.
10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of wire-bonding & multi-chip module technologies a plus.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Additional Information Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

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