Job Description
The Sr. Director, will lead organization responsible for driving execution of packaging development, new product introduction and assembly engineering continuous improvement. This leader will partner closely with Package Design and Development Engineering Directors, product group partners - especially Design, Application, and Marketing teams - Product, Reliability, Quality, Operations, Supply Chain, and key OSAT/CM partners to ensure programs meet committed schedules, quality and reliability objectives, production readiness requirements and long term continuous improvement of packaging products. The role will establish strong program governance, identify and escalate critical risks early, and lead cross-functional technical task forces to resolve development challenges that threaten quality, reliability, yield, manufacturability, or schedule. Additionally, the role will closely monitor operations at our key OSAT partners, ensuring consistent execution, effective issue escalation, and tight alignment between Renesas development teams and external assembly partners.
Responsibilities:
- Recruit, build and mentor a new team of Packaging engineers.
- Partner with Package Engineering Directors who lead technical package development programs, providing program-level execution leadership, governance, and accountability.
- Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting to ensure committed schedules are achieved.
- Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
- Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalate critical issues with clear recommendations and decision points.
- Lead cross-functional technical task forces for major development challenges, particularly issues affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule.
- Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, risk assessment, and clearly defined corrective/preventive actions.
- Coordinate closely with Package Engineering, product group partners - especially Design, Application, and Marketing teams - Product Engineering, Reliability, Quality, Operations, Supply Chain, and other functional leaders to remove execution barriers and maintain program momentum.
- Establish program dashboards and management systems that provide transparent visibility to milestones, critical path activities, risks, issues, action owners, and recovery plans.
- Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, issue escalation, recovery plans, qualification readiness, and production ramp execution.
- Ensure execution of Engineering Build Requests (EBRs) per committed schedule at each OSAT, regularly tracking overall EBR progress, identifying delays, and driving timely recovery actions.
- Develop and lead package and assembly teams located at strategic OSATs, ensuring alignment with Renesas priorities, technical teams, and global NPI schedules.
- Ensure OSAT/CM development activities, DOE, process optimization, qualification, process-window verification, production controls, and ramp readiness are aligned with overall NPI program objectives.
- Drive timely resolution of process integration and assembly issues that could impact product quality, reliability, qualification, yield, or customer commitments.
- Ensure effective transition from development and qualification into production, including readiness reviews, ramp monitoring, issue management, and sustained execution.
- Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons-learned practices across the global organization.
- Provide concise, fact-based executive communication on program health, critical risks, schedule recovery, resource needs, and decisions required from senior leadership.
- Build strong relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs.
- Develop the technical and leadership capabilities of the TPM organization and establish a high-performance, execution-focused culture.
- Support package technology roadmap execution by translating strategic technology priorities into executable development programs, milestones, resources, and deliverables.
- Address internal and external customer-impacting issues in partnership with Marketing, Product, Quality, Operations, and Package Engineering organizations.
LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES
- Recruit, build and mentor a new team of Packaging engineers.
- Lead and develop a team of Package and assembly engineers supporting multiple package types and business groups
- Set organizational priorities, staffing strategy, performance expectations, and development plans aligned with business growth.
- Establish clear accountability between Package Development Engineering, NPI Engineering, OSAT engineering technical leaders while avoiding duplication of technical ownership.
- Create a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution.
- Drive consistent execution standards across internal teams and strategic OSAT locations.
Qualifications
- Location Commitment: Willingness and ability to relocate to / be based in India for a 2-year project assignment.
- Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Electrical Engineering, Physics, Chemistry, or a related technical discipline.
- 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field.
- Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
- Strong understanding of semiconductor product development process, package and assembly processes.
- Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
- Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
- Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
- Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
- Strong interpersonal, communication, negotiation, and executive presentation skills.
- Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries.
- Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations.
- Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
PREFERRED QUALIFICATIONS
- Experience supporting high-growth customer programs.
- Experience with formal technical program management methodologies and portfolio-level governance.
- Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.
SUCCESS MEASURES
- On-time achievement of NPI milestones and customer commitments.
- Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues.
- Timely closure of critical cross-functional task-force actions.
- Improved qualification, yield, reliability, and production-readiness performance.
- Effective execution and alignment of strategic OSAT/CM partners.
- Development of a high-performing Packaging Development and Assebly Engineering organization and standardized program-management operating model.
Additional Information The expected annual pay range for this position is $230K - $290K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
