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Packaging Development Engineer

  • Fremont, CA, United States

$95,000 to $130,000 USD / year

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Job details

Pay
$95,000 to $130,000 USD / year
Apply by
Experience
Minimum 3 years of experience
Posting language
English
Posted

Original job description

job summary:

Packaging Development Engineer (Travel to Asia & Mexico 15%). Join Our Client, a premier industry leader, to shape cutting-edge sensors! Reqs: BS Engineering, 3+ yrs semiconductor/sensor packaging & MEMS experience.

location: FREMONT, California job type: Permanent salary: $95,000 - 130,000 per year work hours: 8am to 4pm education: Bachelors

responsibilities:

  • Process Development: Design, develop, and qualify new package types and assembly processes (such as die attach, wire bond, and flip-chip) from prototype through to high-volume production for Our Client.
  • Manufacturing Optimization: Define process flows, execute Design of Experiments (DOE), and analyze results with statistical tools to maximize yield, performance, and manufacturability.
  • Supplier Collaboration & Compliance: Partner with suppliers and contract manufacturers to qualify materials and equipment, ensuring strict adherence to industry standards, environmental regulations, and customer requirements.
  • Testing & Failure Analysis: Oversee environmental qualification testing, conduct hands-on failure analysis using techniques like X-ray or C-SAM, and drive root-cause corrective actions.
  • Global Production Support: Transfer manufacturing processes to global facilities, traveling to hubs in Asia and Mexico to troubleshoot yield issues, oversee production ramps, and mentor junior engineers.

qualifications:

Experience level: Experienced

Minimum 3 years of experience

Education: Bachelors

skills:

encapsulation,FMEA,JMP,MEMS,Minitab,SPC,analysis skills,Excellent written and verbal communication,troubleshoot,reliability,APQP,AS9100,assembly,assembly process,supplier audits,automotive,plating,corrective actions,prototype,prototypes,cycling,DfM,design of experiments,failure analysis,ISO 9001,IATF 16949,die attach,packaging,aerospace,production process,manufacturing,manufacturability,manufacturing process,materials specifications,Mechanical Engineering,Mentor,molding,Packaging Development,process development,product design,PPAP,X-ray,Ensure compliance,reliability test,investigations,RoHS,SEM,semiconductor devices,semiconductor,sensors,sensor,soldering,supplier development,product roadmaps,thermal performance,tooling,vibration,wire bonding,process documentation,process sheets

Equal Opportunity Employer: Race, Color, Religion, Sex, Sexual Orientation, Gender Identity, National Origin, Age, Genetic Information, Disability, Protected Veteran Status, or any other legally protected group status.

At Randstad, we welcome people of all abilities and want to ensure that our hiring and interview process meets the needs of all applicants. If you require a reasonable accommodation to make your application or interview experience a great one, please contact HRsupport@randstadusa.com.

Pay offered to a successful candidate will be based on several factors including the candidate's education, work experience, work location, specific job duties, certifications, etc. In addition, Randstad offers a comprehensive benefits package, including: medical, prescription, dental, vision, AD&D, and life insurance offerings, short-term disability, and a 401K plan (all benefits are based on eligibility).

This posting is open for thirty (30) days.

Qualified applicants in San Francisco with criminal histories will be considered for employment in accordance with the San Francisco Fair Chance Ordinance.

Qualified applicants with arrest or conviction records will be considered for employment in accordance with the Los Angeles County Fair Chance Ordinance for Employers and the California Fair Chance Act.

We will consider for employment all qualified Applicants, including those with criminal histories, in a manner consistent with the requirements of applicable state and local laws, including the City of Los Angeles' Fair Chance Initiative for Hiring Ordinance.

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