RF/Analog Design/Mixed-Signal Engineering Internship Summer 2027

This job was posted by https://www.azjobconnection.gov : For more information, please see: https://www.azjobconnection.gov/jobs/7599528

Company:Qualcomm Technologies, Inc.\ Job Area:Interns Group, Interns Group > Interim Engineering Intern - HW\ General Summary:\ About Qualcomm\ Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. Were proud to be the partner of choice to many of the worlds largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress.\ \ Join Us in Shaping the Future\ At Qualcomm, we\'re committed to engineering human progress by delivering intelligent computing everywhere. We\'re passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you\'ll be part of a community that\'s pushing the boundaries of what\'s possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you\'ll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.\ \ Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You\'ll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S.2027 summer intern class!\ \ Maximize Your Opportunities:\ Our internship hiring model routes candidates from this application into multiple project specific roles. Your \"Profile Visibility\" choice will guide how we manage your data across our systems. To be considered for the full breadth of internship opportunities, select the option to use your profile data for \"Any Roles Globally\".\ \ If you choose to limit your data to \"Only The Role I\'m Applying For\", it will restrict the opportunity for you to be considered across matching internship opportunities.\ \ You can update your profile visibility preferences at any time through the Candidate Home Portal.\ \ Steps:\ \ Log Into Your Eightfold Candidate Home Account\ Hover Over The \"Profile\" Dropdown\ Open Settings\ Edit \"Profile Visibility\"\ \ Role Overview\ As a Qualcomm RF/Analog or Mixed-Signal Engineering Intern, youll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. Project opportunities span 5G/6G mmWave, RF system design, transceiver performance analysis and optimization, RFIC/Analog IC design, PA architectures, RF front-end engineering, signal processing/integration, RF microwave design, power amplifiers, WLAN/Bluetooth LNAs, ADC/DAC, and more.\ \ This internship supportstwo technical tracks:\ \ RF/Analog Design\ Mixed-Signal Design\ \ Based on your resume you may be aligned to one or more of these tracks.Please clearly indicate your track interest(s) in your resume, as this is the only way to communicate preferences during the recruiting process.\ \ Minimum Qualifications\ \ Currently enrolled in a bachelors, masters, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field\ Must be available for1114 weeksduringSummer 2027 (MaySeptember)\ Expected graduation date of November 2027 or later\ \ Preferred Qualifications\ \ Currently enrolled in a Maste s or PhD degree program in computer engineering, computer science, electrical engineering, or a related field\ Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028\ \ Track 1: RF/Analog Design\ \ RF, microwave theory, antenna theory\ Analog IC design or RFIC design\ Electromagnetics, digital pre-distortion, RF matching networks\ S-parameters, linear systems, filter design\ Digital communication systems, noise figure, linearity (IP3), impedance matching\ Memory system design and analysis\ High-speed interface system design\ Printed circuit board design\ Electrical system analysis and modeling\ Signal and power integrity (SIPI) analysis\ Power delivery network (PDN) design/analysis\ Transmission lines, power amplifiers, transmitters, receivers, ACLR\ Layout experience and chip tape-out\ Programming experience in Perl, MATLAB, Cadence, HFSS\ \ Track 2: Mixed-Signal Design\ \ Mixed-signal IP and high-speed interface (ADC/DAC, PLL, sensor, SerDes, DDR) architecture definition, design, implementation, and SoC integration\ RTL coding, lint checks, CDC checks, DFT updates, formal equivalency checks, ECO implementation\ SERDES (PCIe, USB), memory (DDR, HBM), or 2D/3D die-to-die (D2D) interface system exploration and co-optimization\ Static timing anal