Senior PCB Fabrication Engineer (10698)

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Qorvo is looking for a PCB Fabrication Engineer with knowledge in PCB and/or IC Substrate manufacturing process for RF product applications.

The technology needed in the quickly changing RF market require that packaging innovation provide the business a strategic advantage. The ideal candidate will utilize their broad PCB manufacturing experience to work with our suppliers in developing new substrate technologies for next generation product / technology requirements from concept to high volume manufacturing.

Responsibilities include:

• Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
• Develop, qualify, and support clean launch of new PCB material sets, design rules, capabilities, and suppliers in line with centralized Qorvo processes and documentation standards.
• Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
• Utilize program management methodology to plan, execute, and monitor complex process and/or product development projects.
• Apply problem-solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
• Travel to PCB suppliers to provide technical support for technology development, supplier qualification, and problem resolution.

Required Skills:

• Learn fast in a high-paced environment
• Strong communication skills
• Industry knowledge and experience with PCB manufacturing, including processes such as via drill, Cu pattern plating, panel plating, surface finishes, etc.
• Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc. is a plus.
• Recognized understanding of IPC laminate/PCB standards
• Experience in developing design rules
• Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
• Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high-volume manufacturing environment.
• Experience with Altium, KiCAD, Cadence, or other PCB design software
• Effective project management skills
• Proven record of accomplishment in supporting New Product / Processes and/or Technology through innovative packaging solutions

Required Experience:

• 5+ years of experience or an equivalent combination of advanced degree and education in PCB manufacturing
• Bachelors or higher degree in Chemistry or Engineering disciplines

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