Jobs in the United States

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Added 3 mins ago
HA
Principal ASIC Design Engineer
Honeywell Aerospace
Plymouth, MN
- $173,000 to $200,000 USD / year
As a Principal ASIC Design Engineer at Honeywell Aerospace, you will be a technical leader in our ASIC design team, responsible for driving innovation and excellence in ASIC design, leading…
Added 9 mins ago
Principal Semiconductor Packaging Technologist – Customer Solutions
Advanced Micro Devices, Inc
San Jose, CA
We are looking for a Principal Packaging Integration Engineer who can do two things exceptionally well: drive technically sound packaging architecture decisions and be the trusted…
Added 1 hour ago
Senior AI/ML Engineer
Ignite IT
Remote, United States
Partner with the MLOps Engineer on packaging, deployment, rollback, and post-release verification within Government-approved AWS environments.
Added 1 hour ago
Senior USPS Android Mobility & UEM Integration SME
Ignite IT
Remote, United States
…Microsoft Intune, USPS SOTI UEM, Android Enterprise, application packaging and deployment, identity, networking, cybersecurity, telemetry, testing, data integration, and production…
Added 1 hour ago
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Senior/Staff Physical Verification and PDK Engineer
HyperLight
Remote, United States
- $150,000 to $225,000 USD / year
Our growing team is looking for a Senior/Staff Physical Verification and PDK Engineer to own physical verification and design enablement for our most advanced heterogeneous integration…
Added 2 hours ago
Principal Actuation Systems Electrical Lead
RTX Corporation
tewksbury, MA
…opportunity for an Actuation Systems Leader (P4 Electrical Engineer) with control system, power conversion, and leadership experience. The ideal candidate possesses a combination of project…
Added 3 hours ago
VI
Structural Analyst
Viasat, Inc.
Remote (excluding ND, VT, or RI)
- $149,500 to $224,500 USD / year
…components, mechanisms, ground support equipment, and electronic packaging using finite element analysis and hand…
Added 4 hours ago
Packaging Engineer (Chippewa Falls, WI)
Hewlett Packard Enterprise
Chippewa Falls, WI
Designs, analyzes, develops, modifies and evaluates materials, mechanical systems, equipment and packaging. Conducts feasibility, design margin and validation analysis and empirical testing…
Added 5 hours ago
SM
Packaging Engineer
Scotts Miracle-Gro
Marysville, OH
- $80,200 to $94,400 USD / year
…would like to be considered we encourage you to apply! The Packaging Engineer will join a dynamic R&D team responsible for the development, testing, qualification and commercialization of…
Added 5 hours ago
Senior Process Engineer
Scotts Miracle-Gro
Marysville, OH
…encourage you to apply! We are looking for a Senior Process Engineer to join our Supply Chain team at one of our Marysville, OH plant locations. The Senior Process Engineer is responsible…
Added 5 hours ago
Associate Mfg. Systems Engineer 1 (Automation Technician) Night Shift 12 Hours (6PM to 6AM)
Amgen
New Albany, OH
Based in New Albany, Ohio, the site of Amgen’s new advanced product assembly and packaging plant. In this role you will provide technical engineering support on all system/equipment…
Added 5 hours ago
Microfabrication Engineering Manager
Synchron Inc.
San Diego, CA
We are seeking an exceptional Principal Microfabrication Engineer to lead the technical development of Synchron's next-generation, high-channel-count neural interfaces.
Added 5 hours ago
Indigo Technical Field Service Product Specialist
HP
Remote, United States
Digital printing, packaging, label, or commercial print industry experience.
Added 5 hours ago
Senior Operational Excellence Process Engineer/Digital Champion
The businesses of Merck KGaA, Darmstadt, Germany
Tamaqua, PA
Location: The Senior Operational Excellence Process Engineer/Digital Champion is an onsite position in Tamaqua, PA with
Added 5 hours ago
Principal or Sr. Principal PCB Layout Design Engineer
Northrop Grumman
Annapolis
Northrop Grumman Undersea Systems in Annapolis, MD is currently seeking an experienced Principal or Sr. Principal PCB Layout Design Engineer to join the Hardware Engineering Team.
Added 5 hours ago
Principal Mechanical Engineer - Data Center Liquid Cooling Systems
Mitsubishi Heavy Industries, Ltd.
Carrollton, TX
Mitsubishi Heavy Industries America, Inc. (MHIA) is looking for a Principal Mechanical Engineer-Data Center Liquid Cooling Systems to join our team. This is a hybrid role based out of our…
Added 6 hours ago
E
Electrical Failure Analysis Engineer
Eurofins
Sunnyvale, CA
- $100,000 to $140,000 USD / year
Eurofins EAG Laboratories is seeking a Senior Engineer to lead hands-on investigations of electronic components, packages, and systems. You will work directly in the lab owning electrical…
Added 6 hours ago
TT
AI-Native Electrical Engineer
True Talent Solutions Partners
Detroit, MI
- $110,000 to $250,000 USD / year
- Coordinate PCB fabrication, component sourcing, and packaging with external partners.
Added 6 hours ago
General Engineer
Department Of Energy
Carlsbad, NM
…- Carlsbad Field Office, Department of Energy. As a General Engineer, you will be managing the National Transuranic (TRU) waste transportation services across the nation and to the Waste…
Added 6 hours ago
KC
Product Development Engineer
KLA Corporation
Milpitas, CA
- $117,800 to $200,300 USD / year
…chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and PCB…
Added 6 hours ago
Principal AI Platform Engineer
Avaya
United States
We are seeking a high-performing, hands-on Principal Engineer to lead the development of reliable integrations and next-generation AI platform capabilities for Avaya Infinity™. In this…
Added 6 hours ago
Senior Software Engineer - Accelerated Kubernetes Runtime Team
NVIDIA USA
Remote, United States
…GPU-accelerated Kubernetes runtime distributions. As a Software Engineer on the Runtime team, you will design and build automation systems that enable engineers to seamlessly install,…
Added 7 hours ago
Senior Operational Excellence Process Engineer/Digital Champion
Tamaqua, PA
Location: The Senior Operational Excellence Process Engineer/Digital Champion is an onsite position in Tamaqua, PA with <10% travel required to meet business needs.
Added 7 hours ago
Manager -IPQA /QA Validation
Glenmark Pharmaceuticals Inc., USA
Monroe, NC
…documentation verification, IPQA checks for manufacturing and packaging processes, AQL, BPR revision, sample management, retain samples program, visual inspection program and notification…
Added 7 hours ago
Laboratory Scientist/Engineer 2
Fujifilm
Holly Springs, NC
The Laboratory Scientist/Engineer 2 is part of a manufacturing science lab that serves as the first point of entry for external client processes to execute process establishment runs within…

NVIDIA Corporation

IC Packaging Engineer

North District, IL, United States

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Job details

Apply by: Jan 10, 2027
Experience: 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
Posting language: English
Posted: Jul 14, 2026

Original job description

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology - and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.

Are you ready to take your engineering career to the next level? NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What you will be doing:

Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Thriving in a dynamic and challenging environment
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

What we need to see:

BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.
2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.
Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
Curious and creative problem solver, well organized and multi-tasker.

Ways to stand out of the crowd:

Hands-on FEA mechanical simulation experience - Advantage
Team / Group / Project management - Advantage
Experience with manufacturing environment and manufacturing statistics tools
Background in engineering semiconductor manufacturing processes

Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know, and we will work with you to meet your needs.

Apply now to be part of our world-class team and contribute to the future of computing! Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com

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