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Senior Packaging Development Engineer

CA, United States

The expected base salary ranges for this position are: 152,000 USD – 253,000 USD for Level 4; and 184,000 USD – 287,500 USD for Level 5.

Apply on nvidia.wd5.myworkdayjobs.com About employer

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Job details

Pay: The expected base salary ranges for this position are: 152,000 USD – 253,000 USD for Level 4; and 184,000 USD – 287,500 USD for Level 5.
Posting language: English
Posted: Nov 13, 2026

Original job description

NVIDIA’s invention of the GPU in 1999 fueled the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI - the next era of computing - with the GPU acting as the brain of computers, robots, and self-driving cars that can perceive and understand the world. This is our life’s work - to amplify human creativity and intelligence. Are you ready to help us change the world?

This position is an individual contributor position, representing the Operations team and collaborating with product marketing, industrial design, engineering and suppliers to lead packaging mechanical structure design and manufacturing maturity development. The candidate is expected to provide technical expertise and leadership throughout the product lifecycle, drive manufacturing feedback to improve packaging supply robustness, support new product introduction and supply chain optimization. The position is located at the corporate HQ in Santa Clara, California.

What you will be doing:

Lead the packaging mechanical structure design for various products during the product design phase, analyzing packaging materials and evaluating NVIDIA products for reliability and performance. Review manufacturability readiness at each milestone.
Resolve design, test and production issues, identify yield improvement opportunities, establish quality standards.
Ensure the aesthetic look of the total package meets objectives, considering structure, user interaction, cost impact, and schedule.
Proactively monitor Packaging Development Engineers KPIs and collaborate with cross functional teams to establish and enhance world-class packaging standards.
Coordinated release of New Product Introduction BOMs into Product Data Management (PDM) system, facilitated technical reviews of product changes throughout the supply chain and field, and supported second-source and EOL replacement part qualification.

What we need to see:

Bachelor's degree or higher in Packaging Engineering or a related field with equivalent experience, and 8+ years of relevant work experience in packaging commodity engineering, encompassing both electronic retail packaging design and datacenter protection industrial packaging design.
Proficient in using 2D Artios CAD and 3D NX/SolidWorks/Creo applications, including GD&T, CP/CPK and tolerance stack up analysis.
Working knowledge of product fragility, cosmetic protection, package testing, data reporting, and analysis.
Understanding of DFM, tooling design, manufacturing processes, and schedules for various materials (paper, molded fiber, corrugated, rigid box,crates, cases, foam, plastic tray, etc.)
Self-motivated and proactive with strong leadership and management abilities, fostering a culture of continuous learning, ongoing process improvement, and a first-principles approach to problem-solving.
Extensive experience managing multiple packaging projects in cross-functional settings, with expertise in sustainable packaging design methods and materials.
Proven excellence in interpersonal skills, collaborating effectively, and conveying complex ideas in ambiguous environments.

Ways to stand out from the crowd:

Proven success delivering products from concept through launch.
Strong ownership mindset and ability to tackle complex challenges.
Solid understanding of NPI processes, collaborating with Operations on manufacturing, quality, RMA, and EOL.
Proactive self-starter with strong prioritization, multitasking, and conflict-resolution skills.
Ability to thrive in dynamic and innovative environments.

With highly competitive salaries and a comprehensive benefits package, NVIDIA is widely considered to be one of the technology industry's most desirable employers. We have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state of the art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. We have a real passion for perfection and for building products that excite the imagination. If you share these values and have the experience and skills to participate, we would love to have you join our team.

Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary ranges for this position are: 152,000 USD – 253,000 USD for Level 4; and 184,000 USD – 287,500 USD for Level 5. You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until November 17, 2026. This posting is for an existing vacancy. NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Apply on nvidia.wd5.myworkdayjobs.com About employer

More about this job

Skills

Packaging processes
Provide technical expertise
Leadership
Packaging
Supply chain management
Product data management
Packaging engineering
Siemens NX
Dassault Systemes SolidWorks
PTC Creo
Test package
Reporting
Manufacturing processes
Process improvement
Problem solving
Interpersonal skills
Prioritization
Multitasking
Conflict resolution

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Work requirements

Jobs in the United States