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Northrop Grumman

Manager Programs 2 - Advanced Packaging

Apopka, United States

Primary Level Salary Range: $139,100.00 - $208,700.00

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Job details

Pay: Primary Level Salary Range: $139,100.00 - $208,700.00
Apply by: Apr 25, 2027
Posting language: English
Posted: Oct 27, 2026

Original job description

RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE REQUIRED FOR START: No

CLEARANCE TYPE: Secret

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced Packaging team full-time on-site in Apopka, FL. The selected candidate must be able to travel domestically as required by business needs.

For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense & commercial systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our customers across these industries.

The selected candidate will be responsible for leading business execution for semiconductor wafer post-processing. Their primary objective will be developing advanced packaging proposals, introducing new products and processes, and delivering all contractual requirements to our customers on-cost and on-schedule. They will oversee the development and achievement of all technical objectives, as well as numerous contractual requirements including: managing cost, schedule, and technical performance; leading interfaces with internal and external customers, and company support organizations; supporting insertion of these technologies into customer use cases; identifying volume growth and cost reduction opportunities; and interfacing with technical leadership across our customer base to identify technology needs and timelines to support next-generation microelectronics systems.

What You'll Get to Do:

Program Managers are responsible for leading all phases of the program life cycle from inception (proposal technical solution and cost development) through startup, execution, and completion (contract closeout). Primary responsibilities are the management of cost, schedule, and technical performance of company programs and include, but are not limited to:

Developing new business opportunities and customer relationships through long term strategic planning, capture planning, and new technology insertion and business plans.
Leading engagements with customers to develop, mature, and deploy advanced packaging solutions.
Leading and directing cross-functional teams to meet program cost, schedule and technical performance objectives across both development and production efforts.
Measuring and reporting program performance.
Delivering proposals and presentations to customers, executive management and other program stakeholders.
Development and adherence to budget baselines utilizing Earned Value Management (EVM) or similar cost & schedule control methodologies and tools.
Identifying, allocating and managing program resources, including workforce planning.
Managing Northrop Grumman capital and government/customer supplied property or information (GFE, CFE, etc.)
Managing suppliers & subcontractors to meet program objectives.
Adherence to all internal processes, policies, and applicable industry standards.
Ensuring teams adhere contract scope, and manages change through control board activities.
Development and adherence to master plans and schedules.
Conducting thorough risk & opportunity management practices including identification, mitigation and realization.

Basic Qualifications:

Bachelor’s degree with 8+ years of relevant professional experience, Master’s degree with 6+ years of relevant professional experience, or PhD with 3+ years of relevant professional experience in program/project management, engineering, manufacturing, microelectronics, or a related field.
Demonstrated experience leading programs, projects, or integrated product teams with responsibility for schedule, cost/budget, technical performance, and program deliverables.
Demonstrated technical experience supporting semiconductor or microelectronics design, fabrication, manufacturing, and/or advanced packaging.
Demonstrated experience preparing and delivering technical or programmatic communications, including proposals, white papers, program reviews, and/or presentations to customers, program leadership, and technical stakeholders.
Demonstrated experience applying Earned Value Management (EVM) and schedule-management principles to monitor program cost and schedule performance.
U.S. citizenship required.
Must have the ability to obtain and maintain a U.S. government Secret security clearance.

Preferred Qualifications:

Active/current U.S. government Secret security clearance.
Master’s or PhD in Engineering, Physics, Materials Science, Electrical Engineering, Microelectronics, Semiconductor Engineering, or a related technical discipline.
Experience managing research, development, manufacturing, and/or technology maturation programs involving microelectronics, semiconductors, or advanced packaging.
Experience working with U.S. Government, defense, and/or commercial customers to define technical requirements and solutions.
Experience supporting customer acquisition, capture, proposal development, program planning, and/or program execution processes.
5+ years of experience leading semiconductor or microelectronics technology-development, manufacturing, or production programs.
Experience supporting RF and/or digital system products, capabilities, and enabling technologies.
Experience applying agile principles, including breaking work into manageable increments, managing parallel work activities, and incorporating regular stakeholder or customer feedback.
Familiarity with FAR and DFARS requirements.

What We Can Offer You

Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!

Primary Level Salary Range: $139,100.00 - $208,700.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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More about this job

Skills

Packaging
Microelectronics
Cost management
Leadership
Customer relations
Strategic planning
Reporting
Presentation skills
Project management
Materials science
Electrical engineering
Research
Define technical requirements
Training and development

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