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Nokia

Principal Program Manager

United States

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Job details

Posting language: English
Posted: Oct 30, 2026

Original job description

Position Summary The ASIC Program Manager is responsible for leading complex ASIC development programs from concept through silicon production. This role drives cross-functional execution across architecture, digital and analog design, verification, physical design, CAD, product engineering, packaging, foundry, and operations teams to achieve program objectives related to schedule, cost, quality, and commitments. In addition the candidate will be supporting various communication and coordination functions for the ASIC organization and occasionally, cross-functional organizations. The successful candidate combines strong technical understanding of semiconductor and ASIC development with exceptional program management, leadership, communication, and risk management capabilities.

Key Responsibilities

Program Leadership

Lead end-to-end ASIC development programs from planning through production release while developing and maintaining integrated program schedules covering all major development milestones.
Establish clear ownership, accountability, and decision-making processes across functional teams and facilitate alignment and issue resolution in a timely manner.

Schedule and Milestone Management

Build and manage program plans for from architectural specifications to conclusion of validation and qualification of the ASIC project and track critical path tasks and cross-functional dependencies.
Monitor milestone progress, achievements and forecast program outcomes.

Risk and Issue Management

Lead risk identification, assessment, mitigation, and escalation activities to drive rapid resolution of technical, schedule, resource, and dependency issues.
Conduct regular program health reviews, track and drive all issues that arise to resolution.

Cross-Functional Coordination Partner closely with ASIC project engineering leaders and all cross-functional teams to understand critical deliverables between all teams and timelines associated with development and release. Continuously monitor and track the deliverables and all issues that arise that could potentially cause delays.

Drive operational cadence: Executive Monthly Reviews, ASIC WW all hands, agenda/material prep, knowledge sharing, and action item closure
Continuous improvements: identify areas for improvement between HW, SDK, SW and other cross-functional teams, propose solutions and drive implementation
ASIC Resources: Support org structure, headcount planning, and hiring prioritization for engineering teams by working with hiring managers and staffing support teams

Project Milestone Management

As critical development milestones are approaching, ensure that all relevant checklists and reviews occur in advance of achieving the milestone event. Drive actions that arise from the checklists and reviews to closure so that tapeout occurs on or before the target date.

Process Improvement

Continuous process program management improvements leveraging AI, methodologies and reporting of development metrics will be essential to keep up with the tremendous challenges that are faced to achieve execution predictability and implementation of best practices associated with risk mitigation, cross functional alignment and overall ASIC and DSP development processes.

Required Qualifications

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related technical field.
8+ years of semiconductor industry experience.
5+ years of program or project management experience leading ASIC or SoC development programs.
Demonstrated experience delivering successful tapeouts from concept through production.
Strong understanding of ASIC development lifecycles and semiconductor product development processes.
Proven ability to manage complex, cross-functional engineering teams.

Preferred Qualifications

Master's degree in Engineering, Computer Science, or Business Administration.
PMP certification or equivalent program management certification.
Experience with advanced process nodes such as 3nm, 2nm and beyond
Experience managing external vendors, foundries, and IP suppliers.
Understanding of AI, networking, wireless, data center, or telecom ASIC products.

Program Management Skills:

Program planning
Critical path analysis
Risk management
Dependency management
Executive communication
Stakeholder management
Financial and resource planning
Escalation management
Data-driven decision making

Technical Knowledge:

ASIC/SoC development lifecycle
Digital and analog design methodologies
Design verification
DFT and test methodologies
Physical implementation flows
Timing closure
Power and performance optimization
Silicon validation
Product qualification
Semiconductor manufacturing processes

Leadership Competencies:

Strategic thinking
Relationship building
Technical judgment
Bias for action
Collaboration and influence
Clear communication
Problem solving
Ownership and accountability
Continuous improvement mindset

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More about this job

Skills

Packaging
Communication skills
Program management
Leadership
Risk management
Decision making
Prioritization
Reporting
Electrical engineering
Computer engineering
Computer science
Project management
PMP
Stakeholder management
DFT
Manufacturing processes
Relationship building
Collaboration
Problem solving
Process improvement

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