PIC Process Integration Engineer

The Photonic Integrated Circuit (PIC) group at Nokia is at the forefront of developing and producing the chips that power our terabit-scale digital optical transport networks. We’re looking for a driven and collaborative Process Integration / Fab Start-Up engineer to join our PIC Product Integration Team. We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement.

•Fab Bring-Up & Equipment Qualification: Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones. Process Development & Integration: Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow. Yield & Reliability Engineering: Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology. Cross-Functional Collaboration: Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets. Documentation & Technology Transfer: Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.

• BS/MS/PhD in Electrical Engineering, Materials Science, or related field.
• Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics.
• Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices.
• Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support.
• Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages.
• Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus.
• Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.

Some of our benefits in US:

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability, and long-term disability
• Life insurance, and AD&D – Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and Vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.

Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.

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