Structural & Thermal-Fluids Engineering

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Structural & Thermal-Fluids Engineering CO-OP, Spring/Summer 2027 (Group 07-74) Apply now Date: Nov 12, 2026

Location:

Lexington, MA, US

Company:

MIT Lincoln Laboratory

The Structural & Thermal-Fluids Engineering Group provides innovative multidisciplinary engineering solutions through the development of advanced mechanical and aerospace technologies for sea, ground, air, and space-based prototype systems for national security applications. Examples include the development of structural-material systems for spaceborne imaging and laser communication terminals, heat exchangers for high-flux laser and RF solid-state devices, and aerodynamic designs and multifunctional materials for UAV platforms. New technologies and engineering solutions are developed through high-fidelity models and multidisciplinary simulations, environmental and materials characterization testing, and advanced materials to optimize solutions to meet ever increasing performance, size, weight, and environmental challenges.

Position Description:

MIT Lincoln Laboratory's Group 74 is seeking a Spring/Summer 2027 Co-Op (approximately January through August) to support exciting projects focused on structural, thermal, and fluids engineering challenges. This position offers hands-on experience applying engineering fundamentals to solve real-world problems across aerospace and defense domains. The group seeks well rounded candidates, placing high value on teamwork, collaboration, and diversity in addition to technical skills.

As a co-op in this group, you will have an opportunity to contribute to technical efforts in your field of study. Such efforts could include, but are not limited to: Creating and running analysis models for subsonic or hypersonic applications (finite element structural and/or thermal models, CFD models, etc) Running of internally-developed multidisciplinary simulation software Analyzing model results and generating new designs based on those results Structural and thermal testing and hardware integration Participating in the research and development of new modeling and design capabilities Assist in the design, implementation, and testing of novel technologies through understanding of thermal management (Comsol, etc.)

Requirements

Currently enrolled in a degree program (Preferred majors: Mechanical Engineering, Aero/Astro, Aerospace Engineering, Mathematics, Physics, Computer Engineering, etc.) Completed coursework in Mechanics of Materials and Thermal-Fluids (or equivalent)

Compensation:

$25-$40/hour depending on how many years of... For full info follow application link.

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.