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Project Electrical Engineer V
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Kansas City, MO
- $80,000 to $100,000 USD / year
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Senior Mechanical Engineer / Designer, HVAC Design-Build
GPAC
St Louis, MO
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A mechanical contracting firm with more than 100 years in business is hiring a Senior Mechanical Engineer / Designer for its HVAC design-build group in St. Louis.

MIT Lincoln Laboratory

Image Sensor Characterization Engineer

Lexington, MA, United States

Associate Staff 3 Hiring Range: $114,000 - $148,000 Associate Staff 4 Hiring Range: $124,000 - $164,000

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Job details

Pay: Associate Staff 3 Hiring Range: $114,000 - $148,000 Associate Staff 4 Hiring Range: $124,000 - $164,000
Apply by: May 1, 2027
Posting language: English
Posted: Nov 6, 2026

Original job description

The Advanced Imager Technology Group develops imaging platforms that enable impactful national security capabilities and scientific discovery. From fundamental device research to developing camera technology for fielded systems, our group covers the full technology development spectrum from concept to prototype. Research areas include novel imager and detector design with in-house silicon and compound semiconductor microfabrication facilities, leading-edge integrated circuit design, and advanced packaging and 3D integration capabilities. Examples of our technology include large-format focal planes, high-speed imagers, time-of-arrival detectors (LADAR receivers), and low-light-level imagers. The group's efforts span the range of device and materials development, integrated circuit design and fabrication, custom packaging, detector hybridization, and the development of control and readout electronics for system-level demonstrations. Job Overview

MIT Lincoln Laboratory Associate Staff provide critical multi-domain through expert multi-domain innovative research supporting the Laboratory’s national security mission. They prototype state-of-the-art technology solutions and engage in many steps of a program lifecycle with increasing independence and responsibility. As an Associate Staff member, you will contribute independently to multidisciplinary efforts, contribute to sponsor briefings, write test plans and reports, and apply complex and creative solutions to solving technical problems. You may own discrete project/program components or lead complex workstreams and small teams.

As a successful candidate, you will bring solid to strong technical depth, broaden your understanding across adjacent disciplines, and adapt approaches where precedent is limited. You will integrate technical inputs, contribute to program documentation and reporting, and collaborate with interdisciplinary project/program teams supporting projects that may range from rapid, high-risk efforts to longer-term mission programs. Your work will include multiple activities such as hardware and software development, systems analysis, data analysis, component fabrication, system integration, testing, and documentation.

Additional Job Overview Details

The Advanced Imager Technology Group performs research and development of imager devices and subsystem-level technology for the DoD and scientific community. Our efforts include visible- and infrared-band detectors for applications such as ground- and space-based surveillance, adaptive optics, and astronomy. The group's efforts span the range of device and materials development, integrated circuit design and fabrication, custom packaging, detector hybridization, and the development of control and readout electronics for system-level demonstrations. Our group is seeking to hire an Image Sensor Characterization Engineer to test visible and short-wave infrared band charge-coupled device (CCD) and active-pixel sensor (APS) imagers.

Job Duties & Responsibilities

Own or lead design, development, data analysis, programming, modeling, simulation, integration, testing, troubleshooting, and technical evaluation activities within broader project or program efforts.
Apply technical depth and judgment to less-defined and complex problems, identifying appropriate methods, adapting established approaches, and evaluating trade-offs.
Contribute to or lead system-, subsystem-, or component-level work spanning multiple disciplines, mission needs, products, or technical focus areas.
Develop, review, and integrate technical documentation, analyses, design materials, program reporting, presentations, papers, and other deliverables.
Coordinate milestones, assumptions, dependencies, quality expectations, and risks and present findings, recommendations, and alternatives to appropriate audiences.
Provide technical guidance, review, feedback, and mentorship while continuing to deepen mission-aligned expertise.

Additional Job Duties & Responsibilities

Characterize imager performance across key metrics such as shorts-opens yield, dark current, charge-transfer efficiency, and quantum efficiency at the wafer, chip, and packaged device level.
Form hypotheses to explain observed performance and measure test block structures (e.g., discrete transistors) to test those hypotheses.
Provide written reports to internal and external audiences summarizing testing results and archive test data.
Design and procure printed circuit boards needed to interface image sensors to test electronics and automated wafer probers.
Maintain the electronics used to operate image sensors and identify opportunities to improve testing infrastructure.
Review computer aided design (CAD) device layouts to identify potential issues that could adversely impact performance or yield.
Contribute to the development of new capabilities such as custom cryostats and optical testbeds.
Work with the packaging team to identify and procure the appropriate hardware needed to package image sensors and provide the required documentation to packaging laboratory personnel for wafer dicing and package assembly.

Minimum Qualifications

Candidates will be considered for the appropriate level based on their education, experience, demonstrated technical capabilities, leadership responsibilities, and the scope and complexity of their prior work.

Level 3 – Associate Staff

Bachelor’s degree in a STEM discipline or other relevant technical field and typically 2+ years of relevant experience; or Master’s degree and typically 0+ years of relevant experience; or an equivalent combination of education and experience.
Solid technical depth in a primary engineering, research, or other technical domain, with the ability to apply knowledge independently.
Demonstrated ability to solve complex technical problems and manage components of project work.
Experience contributing to technical documentation, analyses, reports, presentations, or project deliverables.
Ability to collaborate across project teams and communicate technical information clearly to appropriate audiences.
Emerging ability to guide less experienced colleagues and contribute to team capability development.

Level 4 – Associate Staff

Bachelor’s degree in a STEM discipline or other relevant technical field and typically 4+ years of relevant experience; or Master’s degree and typically 2+ years of relevant experience; a PhD may be considered; or an equivalent combination of education and experience.
Strong technical depth in a primary domain with emerging breadth across related engineering, research, technical disciplines, or mission areas.
Demonstrated ability to solve complex technical problems and lead components of projects or technical workstreams.
Experience managing milestones, dependencies, risks, and deliverables for assigned project areas.
Ability to communicate complex information to varied audiences and collaborate with project teams, sponsors, and internal partners.
Demonstrated ability to mentor others, review work, and contribute to team technical capability.

Additional Minimum Qualifications

Candidates should hold a degree in Electrical Engineering or a related field. Candidates should also have deep expertise in at least two of the following areas:

Scientific CMOS or charge-coupled device (CCD) imager testing
Camera electronics
Semiconductor device physics
Semiconductor wafer probing
Image sensor device design
Transistor modeling and characterization
Printed circuit board design

Associate Staff 3 Hiring Range: $114,000 - $148,000 Associate Staff 4 Hiring Range: $124,000 - $164,000

Disclaimer: MIT Lincoln Laboratory provides a typical hiring range as a good faith estimate of what we reasonably expect to offer for this position at the time of posting. The final salary offered to a selected candidate will depend on various factors, including - but not limited to - the scope and responsibilities of the role, the candidate’s experience, skills and education/training, internal equity considerations and applicable legal requirements. This range reflects base salary only and does not include additional forms of compensation or benefits.

At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include:

Comprehensive health, dental, and vision plans
MIT-funded pension
Matching 401K
Paid leave (including vacation, sick, parental, military, etc.)
Tuition reimbursement and continuing education programs
Mentorship programs
A range of work-life balance options
... and much more!

Please visit our Benefits page for more information. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks.

Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

Requisition ID: 43607

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