Jobs in the United States

25+ jobs

Added 1 day ago
ASIC Packaging SI/PI Engineer (Hybrid)
Cisco Systems, Inc.
San Jose, CA
SI/PI Simulation and Validation: Experience in pre- and post-layout signal and power integrity (SI/PI) analysis. This includes experience with simulation using industry-standard EDA tools…
Added 3 days ago
Power Conversion Senior Manager
Blue Origin Personnel, LLC
Huntsville, AL
We are seeking a Senior Manager to lead the Power Conversion team, which develops power electronics hardware and embedded systems for a new generation of advanced power systems. You will…
Added 4 days ago
High-Speed Signal Integrity Engineer
Advanced Micro Devices, Inc
Santa Clara, CA
We are looking for a dynamic and motivated Signal Integrity Engineer to join our Server Platform Signal and Power Integrity (SIPI) team. As a member of AMD's Server Platform organization,…
Added 4 days ago
IC
Pre-si Power and Performance System Validation Engineer
Intel Corporation
TX · CA · OR
- $52,000 to $200,000 USD / year
Develop and execute SoC-level power, thermal, and performance validation and optimization plan across Intel products.
Added 4 days ago
A
Remote PCB Layout Engineer (Cadence Needed)
Actalent
Waukesha, WI
- $50 to $75 USD / hour
Partner with hardware and signal integrity/power integrity engineers to develop constraints, perform pre- and post-layout simulations, and design power delivery networks.
Added 6 days ago
A
Senior PCB Layout Engineer
Actalent
Waukesha, WI
- $50 to $75 USD / hour
Partner with hardware and signal integrity/power integrity engineers to develop constraints, perform pre- and post-layout simulations, and design power delivery networks.
Added 9 days ago
Principal Analog Design Engineer
Micron Technology, Inc.
Richardson, TX
We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…
Added 13 days ago
TI
ASIC RTL/SoC Design Engineer
TETRAMEM INC
San Jose, CA
- $110,000 to $300,000 USD / year
Thoroughly comprehend both internal and external requirements, conducting Power, Performance, and Area (PPA) analysis to optimize design trade-offs
Added 16 days ago
I
Pre-Si Power Performance Val & Opt Engineer (Contract)
Intel
Hillsboro, OR
- $52,000 to $200,000 USD / year
You will be joining Intel's Data Center Group (DCG), a team dedicated to advancing data-centric technologies and solutions that power the world's digital infrastructure. The group focuses…
Added 16 days ago
M
Principal Product Engineer
Microsoft
WA · CA · TX · OR · Redmond, WA · Mountain View, CA · Austin, TX · Hillsboro, OR · Redmond · Mountain View · Austin · Hillsboro
- $142,800 to $304,200 USD / year
Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and…
Added 17 days ago
Senior Hardware Design Engineer - PCB Design
General Motors LLC
Warren, MI · Sunnyvale, CA
Create / collaborate closely with other design teams, such as circuit designers, system engineers, and packaging engineers, to understand design requirements and constraints. They work…
Added 18 days ago
Principal Electrical Engineer
Oracle
Santa Clara, CA
Designs, develops, and integrates complex electrical systems for hardware products, ensuring they meet functional, performance, power efficiency, security, and reliability requirements.…
Added 18 days ago
ASIC Packaging Signal/Power Integrity Hardware Engineer (Hybrid)
Cisco Systems, Inc.
San Jose, CA
We are seeking a qualified Signal and Power Integrity Engineer to help us develop our next generation ASIC packaging to help define, design and verify ASIC packaging to be deployed in a…
Added 19 days ago
Silicon Packaging Engineer (SIPI)
Meta
Menlo Park, CA · Sunnyvale, CA
We are seeking a highly skilled Signal Integrity and Power Integrity (SI/PI) Engineer to own chip-package-system co-design for next-generation AI accelerator and high-performance computing…
Added 21 days ago
Senior Hardware Engineer: Connectivity Modules
General Motors
Sunnyvale, CA
The Senior Hardware Engineer will lead the design, architecture, and system integration of connectivity modules across GM vehicle platforms. This includes defining system architecture,…
Added 21 days ago
Staff Hardware Engineer: Connectivity Platforms
General Motors
Sunnyvale, CA
The Staff Hardware Engineer will own the system architecture and technical direction for connectivity modules across multiple vehicle platforms. This includes defining scalable…
Added 22 days ago
Silicon Packaging Engineer (SIPI)
Meta
Sunnyvale, CA · Menlo Park, CA
We are seeking a highly skilled Signal Integrity and Power Integrity (SI/PI) Engineer to own chip-package-system co-design for next-generation AI accelerator and high-performance computing…
Added 22 days ago
Signal Integrity Engineer
Global Foundries
Richardson, TX
We are seeking a highly experienced Principal Engineer, Signal Integrity & Power Integrity Leader with strong experience in signal integrity, power integrity, die-package-board co-design,…
Added 22 days ago
Senior Staff Applications Engineer
Altium
Austin, TX
As a Senior Staff Application Engineer for the Renesas Performance Computing Power Emulation Engineering team, you will be part of a fast-paced power management team supporting pre-silicon…
Added 23 days ago
Senior Hardware Design Engineer
Broadata Communications
Torrance, CA
We are seeking a hands-on Senior Hardware Design Engineer to design, simulate, bring up, and validate complex mixed-signal and high-speed digital hardware for BCI multimedia, video-over-IP,…
Added 24 days ago
Senior Staff Engineer Field Application Engineering
Infineon
Washington · Andover
…integration. Drawing on Infineon's portfolio of radiation-hardened and radiation-tolerant semiconductors - MOSFETs, GaN power devices, gate drivers, and integrated power ICs - you will…
Added 24 days ago
Principal Analog Design Engineer
Micron Technology
Richardson, TX · Richardson
We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…
Added 24 days ago
Simulation Engineer & Computational Modeling
CADFEM India Pvt Ltd
Lake Forest, CA
on SI/PI, electromagnetic analysis, and system-level modeling to evaluate and optimize product performance, reliability, and
Added 25 days ago
Firmware Engineer – SerDes PHY (all levels)
Qualcomm Canada ULC
ON, CA
…boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Software Engineer,…
Added 25 days ago
Senior mixed-signal electrical engineer (Board Level)
ASML US, LP. (US31)
San Jose, CA
Perform modeling, simulation, and performance validation:

Principal Product Engineer

Microsoft · WA, United States · CA, United States · TX, United States · OR, United States · Redmond, WA, United States · Mountain View, CA, United States · Austin, TX, United States · Hillsboro, OR, United States · Redmond, United States · Mountain View, United States · Austin, United States · Hillsboro, United States · $142,800 to $304,200 USD / year

Apply About employer

Microsoft

Principal Product Engineer

WA, United States
CA, United States
TX, United States
OR, United States
Redmond, WA, United States
Mountain View, CA, United States
Austin, TX, United States
Hillsboro, OR, United States
Redmond, United States
Mountain View, United States
Austin, United States
Hillsboro, United States

$142,800 to $304,200 USD / year

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Job details

Pay: $142,800 to $304,200 USD / year
Apply by: Apr 25, 2027
Posting language: English
Posted: Oct 27, 2026

Original job description

Overview

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission. The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and elivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for experienced engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Principal Product Engineer to join the team.

Responsibilities

The position will have responsibility for product/test engineering for new product development and manufacturing.

The position requires someone with experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.
Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and Performance tuning during post-Si phase in partnership with platform teams.
Drive ATE test program implementation to optimize for SOC power/TDP. Work closely with platform/system engineers to drive necessary correlation work to enable such optimizations.
Drive product manufacturing fuse requirements and end to end data flow for fusing across various test sockets.
Successful candidates should have strong project leadership skills to manage external vendors, drive cross functional teams and drive sub-projects as part of larger development programs.
They should also have excellent knowledge of ATE test program development including test method development, test bring-up, characterization, debug, and yield analysis.
The candidate should also have knowledge of DFT, silicon fabrication process, product Q&R, and basic transistor theory.
The candidate would benefit from a background in various product market areas such as high-performance computing, AI, GPUs, CPUs.
Overall product engineering role taking product from definition to launch.
Adaptability (responds, explores, constructive attitude)
Growth Mindset (It starts with a belief that everyone can grow and develop)
Customer Focus (anticipates needs and proactively meets expectations)
Drive for results (actively pursues outcome, delivers on commitments)
Influence for impact (communicates, networks, persuades, influences)
Judgement (scope problem, builds & applies knowledge)

Qualifications

Required Qualifications:

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.

Other Requirements:

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

Preferred Qualifications

8+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU’s) and/or high power SoCs/chips.
8+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction).
5+ years of experience in product and test engineering, ATE test program development and debug (Advantest V93K experience is a plus)
Excellent presentation and communication skills, with the ability to influence, engage, and communicate effectively with stakeholders at all levels.
Experience in:
Leading cross functional teams and understanding program/project management.
Managing supply chain, vendors / partners, and Integrated Circuit production.
Experience in system/customer requirements gathering and interfacing.
Si configuration (SKU) management and internal supplier/customer interfacing
End-to-end product development flow and driving sample delivery milestones across the life cycle (Quality & Quantity)
Knowledgeable in power / performance modelling for ATE binning optimization in both pre- and post-silicon phases of the program. In-depth understanding of ATE test program power/performance binning implementation including required characterization data collection.
Knowledgeable in yield recovery definition (redundancy and repair for logic, array, analog) and their implementation (test programs, test content, SKU). Drive implementation partnering with cross-functional teams.
System and Platform validation background is a plus. Experience working across various platforms (ATE/RVP/Customer boards) for product validation and characterization.
Experience with failure analysis, qualification, and yield analysis

#SCHIE #CSME #SMPE

Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

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More about this job

Skills

Bing
Microsoft 365
Microsoft Teams
Microsoft Azure
Packaging
Leadership
DFT
Adaptability
Electrical engineering
Computer engineering
Computer science
Integrated circuits
Communication skills
Project management
Supply chain management
Requirements gathering
Execute software tests

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