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Added 17 hours ago
Cloud Hardware Development, Packaging, Network Product Development - Optics
Amazon
Cupertino, CA
We are looking for a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development (NPD) team. In this role, you will enable the components…
Added 8 days ago
Manager, Strategy & Investments – Integrated Optics
GLOBALFOUNDRIES U.S. INC.
United States
We’re scaling a new photonics and advanced packaging business at the intersection of cutting-edge technology, major investment decisions, and a rapidly expanding network of customers,…
Added 9 days ago
KC
Lead Platform Infrastructure Engineer
KLA Corporation
Milpitas, CA
- $186,200 to $316,500 USD / year
The Semiconductor Products and Customers (Semi PC) business unit designs, builds and sells KLA’s product portfolio to help chip manufacturers meet high-quality standards for technologies…
Added 19 days ago
System Hardware Board Design Engineering Lead (Onsite)
Cisco Systems, Inc.
Milpitas, CA
The Cisco Service Provider Routing Hardware Engineering team develops next-generation hardware by adhering to IEEE standards and industry best practices. Our engineers drive innovation…
Added 21 days ago
O
Senior Network Developer - Optical Engineering
Oracle
Nashville, TN
- $91,400 to $187,000 USD / year
The Senior Optical Engineer will be joining the Optical Network Engineering team which is responsible for building and scaling Oracle's Optical Transport Network. The team is focused on…
Added 22 days ago
KC
Senior HPC Software & Systems Architect
KLA Corporation
Milpitas, CA
- $186,200 to $273,067 USD / year
The Semiconductor Products and Customers (Semi PC) business unit designs, builds and sells KLA’s product portfolio to help chip manufacturers meet high-quality standards for technologies…
Added 22 days ago
KC
HPC Linux Systems Engineer
KLA Corporation
Milpitas, CA
- $136,300 to $199,900 USD / year
The Semiconductor Products and Customers (Semi PC) business unit designs, builds and sells KLA’s product portfolio to help chip manufacturers meet high-quality standards for technologies…
Added 24 days ago
M
Principal Optical Network System Engineer
Microsoft
CA · WA · OR · Mountain View, CA · Redmond, WA · Hillsboro, OR · Mountain View · Redmond · Hillsboro
- $142,800 to $304,200 USD / year
The Platform Systems Engineering (PSE) team is seeking a Principal Optical Network System Engineer to lead the architecture, engineering, productization, and deployment of optical…
Added 24 days ago
M
Principal Optical Engineer
Microsoft
CA · WA · TX · NC · OR · Mountain View, CA · Redmond, WA · Austin, TX · Raleigh, NC · Hillsboro, OR · Mountain View · Redmond · Austin · Raleigh · Hillsboro
- $142,800 to $304,200 USD / year
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent…
Added 24 days ago
A
Director of Product Line Management (US - Remote)
AXON-Networks
Irvine, CA
- $200,000 to $250,000 USD / year
We are seeking a Director of Product Line Management to define, build, and scale a portfolio of telecom enterprise services and network products. This leader will own the strategy and…
Added 25 days ago
System Hardware Board Design Engineering Lead (Onsite)
Cisco Systems, Inc.
Milpitas, CA
The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our…
Added 25 days ago
Integrated Photonics Technical Leader - Acacia (Hybrid)
Cisco Systems, Inc.
Holmdel, NJ
This role provides exposure to the complete commercial PIC development cycle - from device concepts and first prototypes to product qualification and high-volume manufacturing. You will…
Added 25 days ago
Hardware Engineering Technical Leader
Cisco Systems, Inc.
Milpitas, CA
The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our…
Added 25 days ago
Director, Network Solutions Architecture
Eridu AI
Saratoga, CA
…Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of…
Added 25 days ago
Director, Manufacturing and Test Engineering
Celestica International LP
Richardson, TX
Advanced Process & Equipment Development: Identify, scope, and manage customer-specific process and equipment development projects from concept to full production launch. Break physical and…
Added 25 days ago
O
Senior Network Engineer - Optical
Oracle
Austin, TX · Nashville, TN
- $102,300 to $209,500 USD / year
The Senior Optical Engineer will be joining the Optical Network Engineering team which is responsible for building and scaling Oracle's Optical Transport Network. The team is focused on…
Added 25 days ago
Senior Cloud Hardware Engineer, Mechanical, Network Product Development - Optics
Amazon Data Services, Inc.
Cupertino, CA
We are looking for a Sr. Cloud Hardware Development Engineer (CHDE) with mechanical engineering expertise to join our Network Product Development (NPD) team. In this role, you will enable…
Added 25 days ago
Director Product Line Management (Co Packaging Optical Solution)
Lumilens
San Jose, CA
- Drive execution of product development program across development team from of the optical hardware product for high-speed Optical network.
Added 25 days ago
O
Principal Optical Engineer
Oracle
Nashville, TN
- $114,600 to $234,600 USD / year
The Principal Optical Engineer will be joining the Optical Network Engineering team which is responsible for building and scaling Oracle's Optical Transport Network. The team is focused on…
Added 25 days ago
O
Principal Optical Engineer - Remote
Oracle
Nashville, TN
- $114,600 to $234,600 USD / year
The Principal Optical Engineer will be joining the Optical Network Engineering team which is responsible for building and scaling Oracle's Optical Transport Network. The team is focused on…
Added 25 days ago
Mechanical NPI Engineer
Arista Networks
Santa Clara, CA
As a Mechanical NPI Engineer, you will partner with Hardware, Mechanical, and Thermal Engineering leaders to advance product development, manufacturing readiness, and supplier strategy for…
Added 26 days ago
Senior Supplier Development Engineer
Arycs Technologies, Inc.
Los Gatos, CA
…bandwidth per watt, deterministic performance, and flexible network evolution for AI, cloud, telecom, and edge infrastructure. Designed for real world deployment, Arycs Technologies enables…

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Principal Optical Engineer

Microsoft · CA, United States · WA, United States · TX, United States · NC, United States · OR, United States · Mountain View, CA, United States · Redmond, WA, United States · Austin, TX, United States · Raleigh, NC, United States · Hillsboro, OR, United States · Mountain View, United States · Redmond, United States · Austin, United States · Raleigh, United States · Hillsboro, United States · $142,800 to $304,200 USD / year

Apply About employer

Microsoft

Principal Optical Engineer

CA, United States
WA, United States
TX, United States
NC, United States
OR, United States
Mountain View, CA, United States
Redmond, WA, United States
Austin, TX, United States
Raleigh, NC, United States
Hillsboro, OR, United States
Mountain View, United States
Redmond, United States
Austin, United States
Raleigh, United States
Hillsboro, United States

$142,800 to $304,200 USD / year

Apply About employer

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Job details

Pay: $142,800 to $304,200 USD / year
Apply by: Apr 4, 2027
Posting language: English
Posted: Oct 6, 2026

Original job description

Overview

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Cloud Hardware Systems Engineering (CHSE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are seeking a Principal Optical Engineer to drive the architectural design, production roadmap, engineering efforts for next-generation optical interconnects in hyperscale AI infrastructure.

This role will serve as an architect/engineer responsible for Cloud/AI optical interconnects, and rack-scale fiber management. The candidate will work across silicon, systems, networking, platform architecture, datacenter engineering, and external ecosystem partners to bring innovative optical technologies from concept through large-scale production deployment.

The ideal candidate combines deep expertise in optical systems with architecture, ecosystem, and execution skills, and can influence platform-level decisions across multiple generations of AI infrastructure.

#SCHIE

Responsibilities

This individual will serve as a technical leader for near-package optics (NPO), co-packaged optics (CPO), silicon photonics, and advanced packaging. The role will define multi-generation architectures and guide technologies from early feasibility through qualification, manufacturing ramp, and deployment in hyperscale AI systems.

Own the end-to-end architecture and multi-generation roadmap for NPO and CPO optical interconnects used in AI scale-up networks.
Translate system and network requirements into specifications for bandwidth density, reach, latency, energy per bit, optical-link budget, signal integrity, thermal limits, reliability, serviceability, manufacturability, and cost.
Define silicon-photonic subsystem architectures, including optical engines, modulators, photodetectors, laser-source strategies, coupling interfaces, fiber attach, electronic-photonic integration, and control and monitoring functions.
Build system models and budgets that connect photonic-device performance, SerDes and electrical channels, package parasitics, thermal behavior, controls, and network-level performance.
Provide hands-on technical leadership in laboratory characterization and debug, including optical and electrical measurements, link bring-up, design-of-experiments, margin analysis, failure analysis, and correlation of simulation with measured data.
Define verification, qualification, reliability, and manufacturing-test strategies at wafer, die, package, module, board, rack, and system levels
Guide proof-of-concept designs through product definition, design reviews, qualification, manufacturing readiness, supply-chain ramp, and fleet deployment; lead root-cause and corrective-action efforts when issues arise.
Drive technical alignment across silicon, packaging, signal integrity, thermal, mechanical, firmware, networking, manufacturing, and reliability teams.
Set technical direction with foundries, OSATs, component suppliers, equipment vendors, and strategic partners; assess technology readiness, supply continuity, cost, yield, and roadmap alignment.
Influence industry standards and ecosystem roadmaps, mentor engineers, and communicate complex architectural decisions and risks to technical and business leadership.

Qualifications

Required Qualifications:

Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 7+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience.

Other Requirements:

Ability to meet Microsoft, customer, and/or government security screening requirements is required for this role. These requirements include, but are not limited to, the following specialized security screening:

•

Microsoft Cloud Background Check. This position is required to pass the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter.
This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

Preferred Qualifications:

Technical experience architecting or developing silicon photonics, VCSELs, optical engines, NPO, CPO, or closely related optical interconnects products.
Hands-on laboratory experience characterizing and debugging photonic devices, optical links, or integrated optical modules using relevant optical and high-speed electrical test equipment and data-analysis methods.
Experience leading architecture or product development across multiple disciplines and phases of the lifecycle, with demonstrated ownership of requirements, design tradeoffs, technical reviews, validation, and issue resolution.
Experience communicating technical decisions, risks, and recommendations to cross-functional engineering teams, suppliers, and stakeholders.
Doctorate Degree in Electrical Engineering, Optical Engineering, Photonics, Applied Physics, Materials Science, Mechanical Engineering, or related field AND 8+ years of technical engineering experience OR Master's Degree in a related field AND 10+ years of technical engineering experience OR Bachelor's Degree in a related field AND 14+ years of technical engineering experience OR equivalent experience.
Demonstrated ownership of NPO, CPO, or optical I/O from concept through productization or production deployment.
Experience with advanced photonic or semiconductor packaging, including optical coupling and fiber attach, electrical interfaces, thermal design, mechanical tolerances, assembly processes, and package-level test considerations.
Deep knowledge of silicon photonic components and integration, including modulators (MRM or MZM), photodetectors, waveguides, couplers, multiplexers, laser integration, process variation, wafer-level test, and photonic design-kit constraints.
Expertise in heterogeneous integration and advanced packaging technologies such as chiplets, interposers, 2.5D/3D integration, flip-chip, hybrid bonding, high-density substrates, fine-pitch assembly, and co-design of optical, electrical, thermal, and mechanical interfaces.
Experience with driver/TIA, package and board signal integrity, and end-to-end link-budget and power modeling.
Experience defining DFT, wafer and package test, screening, qualification, reliability, failure-analysis, and high-volume manufacturing strategies for photonic or semiconductor products.
Experience with AI infrastructure, GPU or accelerator fabrics, Ethernet, InfiniBand, UALink, NVLink or other high-bandwidth scale-up and scale-out interconnect ecosystems.
Experience working with silicon foundries, photonics foundries, OSATs, laser suppliers, fiber-attach and connector vendors, and contract manufacturers to drive roadmap, yield, cost, and supply-chain readiness.
Record of technical influence through standards bodies, industry consortia, patents, publications, or delivery of differentiated commercial products.

Hardware Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

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Skills

Bing
Microsoft 365
Microsoft Teams
Microsoft Azure
Photonics
Packaging
Leadership
Supply chain management
Firmware
Electrical engineering
Computer engineering
Mechanical engineering
Debugging
Data analysis
Optical engineering
Materials science
Assembly
DFT

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