Product Pathfinding Engineer- HIG-TPG

Req ID:

JR112710 Product Pathfinding Engineer- HIG-TPG

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron Technology is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team!

In this role you will be tasked with the development of JEDEC-HBM or alternative Near Memory DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product Engineers are the key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments. This is critical to Micron as it serves the company's charter to be the most efficient producer of DRAM memory.

In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group) or equivalent experience, we innovate and integrate end-to-end front-end and backend processes. We develop inventive solutions, debug various tests, and apply qualification techniques. Our goal is to build the lowest power per bit solutions that improve customer experience in ML (Machine Learning) and AI (Artificial Intelligence).

Responsibilities:

• Initiate collaborations with customers, TD, Test, and Manufacturing to capture key requirements and findings to ensure the success of next-generation product development.
• Work closely with other PE groups like System Engineering, Component Validation, and Media Health teams. Together, plan responses to future technology node changes. Ensure adequate test coverage for the upcoming Alpha product.
• Ensure all silicon findings are resolved in line with the encouraged timelines for issue closure for the designs your team is handling.
• Forge strong alliances with Build, Verification, Product Architecture, System Compatibility Group, and Silicon Strategy teams to deliver products in an effective and efficient manner.
• Identify and orchestrate ongoing improvement initiatives in the realm of build readiness to ensure swift implementation of learned lessons.
• Work closely with the Product Leadership Team to ensure build readiness is fully included in the overall product leadership strategy. Ensure these strategies align with product objectives and timelines.

Minimum Qualifications:

• Strong foundation in Electrical or Computer Engineering with proven industry experience in high-speed datapath design, logic development, and advanced circuit analysis.
• Demonstrated ability to solve complex technical challenges using exceptional analytical, debugging, and problem-solving skills.
• Consistent track record of delivering high-quality results and driving excellence in current and previous areas of responsibility.
• Proven success collaborating across multi-functional teams to solve complex problems and achieve shared business objectives.
• Excellent communication, presentation, and interpersonal skills, with the ability to influence partners and thrive in a highly collaborative environment.

Preferred Qualifications:

• Demonstrated technical leadership with the ability to guide projects, influence decisions, and drive successful outcomes across engineering teams.
• Familiarity with DRAM architecture, design, and related semiconductor technologies.
• Strong understanding of how product yield, quality, and manufacturing efficiency impact business performance and revenue.
• Experience collaborating with multi-functional teams across multiple geographic locations and engineering subject areas.
• Proven ability to thrive in a global, fast-paced environment while balancing technical excellence, teamwork, and business objectives.

Job Profile(s):

Product Development Engineer 5

Relocation Level: TBD

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