Process Integration Engineer, APTD
- Boise, United States
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Job details
- Apply by
- Experience
- OR Master’s degree with 2+ years of semiconductor experience;
- Posting language
- English
- Posted
Original job description
Req ID:
JR115208 Process Integration Engineer, APTD
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging Technology Development (APTD) team is developing the packaging and integration technologies that will power future generations of memory products. We bring together engineers, scientists, and innovators who thrive on solving complex technical challenges and turning breakthrough ideas into scalable manufacturing solutions. Working across device engineering, package design, reliability, and manufacturing, we help shape the future of High Bandwidth Memory (HBM) and advanced memory technologies.
Position Overview:
As a Process Integration Engineer, you will play a key role in developing and integrating advanced semiconductor process flows that enable next-generation memory solutions. This position offers the opportunity to lead challenging technical programs, solve complex integration issues, and influence technology decisions from concept through manufacturing transfer. You will work closely with cross-functional teams, use data-driven approaches to guide decisions, and help deliver innovative technologies that balance performance, yield, reliability, manufacturability, and cost.
Responsibilities:
- Lead process integration projects supporting new technology development programs
- Partner with process development, device engineering, package design, product engineering, reliability, and manufacturing teams to solve integration challenges
- Use AI-enabled tools, statistical analysis, and engineering data to accelerate problem solving and decision-making
- Design, implement, and analyze experiments to improve process performance, yield, variability, and reliability
- Identify yield limiters and root causes through analysis of metrology, defect, parametric, probe, reliability, and test data
- Drive corrective actions from root cause identification through implementation and validation
- Develop and improve integration flows that balance performance, manufacturability, quality, reliability, cost, and schedule requirements
- Support technology qualification, manufacturing transfer, and development activities across multiple sites
Minimum Qualifications:
- Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field with 4+ years of semiconductor industry experience; OR Master’s degree with 2+ years of semiconductor experience; OR PhD in a related field
- Experience in process integration, process development, or device development, including experiment design, execution, and analysis
- Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, or emerging memory architectures
- Experience using JMP or similar statistical analysis tools to drive engineering decisions
- Demonstrated ability to solve complex technical problems using data-driven methods, statistical analysis, DoE, and root-cause investigation
Preferred Qualifications:
- Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, bonding, or chiplet integration
- Experience supporting technology development, qualification, and transfer into high-volume manufacturing
- Experience using yield, reliability, electrical, or process data to identify challenges and guide technical decisions
- Experience developing statistical models, correlation studies, and yield analyses to drive process improvements
- Experience applying AI or machine learning tools to engineering workflows, analytics, and yield improvement initiatives
Job Profile(s):
Semiconductor Process Engineer 3 - Semiconductor Process Engineer 5
Relocation Level: TBD
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- If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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More about this job
Skills
- Packaging
- Statistics
- Problem solving
- Decision making
- Electrical engineering
- Chemical engineering
- Materials science
- Mechanical engineering
- Manage quantitative data
- Machine learning
- Documentation