Jobs in the United States

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Added 4 hours ago
PMTS Hardware Development Eng.
Advanced Micro Devices, Inc
Santa Clara, CA
…high-speed electrical interfaces, ASIC integration, package and board design, signal integrity, power integrity, thermal and mechanical design, firmware, diagnostics, and system-level…
Added 12 hours ago
SerDes Applications Engineer
LSI Corporation
United States
SerDes Applications engineer for ASIC Product Division (APD). Work as part of a team of highly skilled applications engineers providing first class support to customers from pre-sales to…
Added 1 day ago
KT
Hardware Engineering Intern (EE)
Keysight Technologies, Inc.
Santa Rosa, CA
- $39.53 to $42.57 USD / hour
We are seeking an Electrical Engineer who is excited to grow their hardware-design skills while helping design, integrate, and validate high-performance electronic hardware for advanced…
Added 2 days ago
M
Principal Product Engineer
Microsoft
CA · OR · NC · TX · Mountain View, CA · Hillsboro, OR · Raleigh, NC · Austin, TX · Mountain View · Hillsboro · Raleigh · Austin
- $142,800 to $304,200 USD / year
Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and…
Added 4 days ago
ASIC Packaging SI/PI Engineer (Hybrid)
Cisco Systems, Inc.
San Jose, CA
SI/PI Simulation and Validation: Experience in pre- and post-layout signal and power integrity (SI/PI) analysis. This includes experience with simulation using industry-standard EDA tools…
Added 6 days ago
Power Conversion Senior Manager
Blue Origin Personnel, LLC
Huntsville, AL
We are seeking a Senior Manager to lead the Power Conversion team, which develops power electronics hardware and embedded systems for a new generation of advanced power systems. You will…
Added 7 days ago
High-Speed Signal Integrity Engineer
Advanced Micro Devices, Inc
Santa Clara, CA
We are looking for a dynamic and motivated Signal Integrity Engineer to join our Server Platform Signal and Power Integrity (SIPI) team. As a member of AMD's Server Platform organization,…
Added 7 days ago
IC
Pre-si Power and Performance System Validation Engineer
Intel Corporation
TX · CA · OR
- $52,000 to $200,000 USD / year
Minimum Qualifications, you must possess the minimum qualifications below to be initially considered for this position
Added 7 days ago
A
Remote PCB Layout Engineer (Cadence Needed)
Actalent
Waukesha, WI
- $50 to $75 USD / hour
Partner with hardware and signal integrity/power integrity engineers to develop constraints, perform pre- and post-layout simulations, and design power delivery networks.
Added 9 days ago
A
Senior PCB Layout Engineer
Actalent
Waukesha, WI
- $50 to $75 USD / hour
Partner with hardware and signal integrity/power integrity engineers to develop constraints, perform pre- and post-layout simulations, and design power delivery networks.
Added 12 days ago
Principal Analog Design Engineer
Micron Technology, Inc.
Richardson, TX
We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…
Added 16 days ago
TI
ASIC RTL/SoC Design Engineer
TETRAMEM INC
San Jose, CA
- $110,000 to $300,000 USD / year
Thoroughly comprehend both internal and external requirements, conducting Power, Performance, and Area (PPA) analysis to optimize design trade-offs
Added 19 days ago
I
Pre-Si Power Performance Val & Opt Engineer (Contract)
Intel
Hillsboro, OR
- $52,000 to $200,000 USD / year
Minimum Qualifications, you must possess the below minimum qualifications to be initially considered for this position
Added 19 days ago
M
Principal Product Engineer
Microsoft
WA · CA · TX · OR · Redmond, WA · Mountain View, CA · Austin, TX · Hillsboro, OR · Redmond · Mountain View · Austin · Hillsboro
- $142,800 to $304,200 USD / year
Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and…
Added 21 days ago
Principal Electrical Engineer
Oracle
Santa Clara, CA
Designs, develops, and integrates complex electrical systems for hardware products, ensuring they meet functional, performance, power efficiency, security, and reliability requirements.…
Added 21 days ago
ASIC Packaging Signal/Power Integrity Hardware Engineer (Hybrid)
Cisco Systems, Inc.
San Jose, CA
We are seeking a qualified Signal and Power Integrity Engineer to help us develop our next generation ASIC packaging to help define, design and verify ASIC packaging to be deployed in a…
Added 22 days ago
Silicon Packaging Engineer (SIPI)
Meta
Menlo Park, CA · Sunnyvale, CA
We are seeking a highly skilled Signal Integrity and Power Integrity (SI/PI) Engineer to own chip-package-system co-design for next-generation AI accelerator and high-performance computing…
Added 24 days ago
Senior Hardware Engineer: Connectivity Modules
General Motors
Sunnyvale, CA
The selected candidate is expected to report to Warren, MI or Sunnyvale, CA at least three days per week (Tuesday–Thursday)
Added 24 days ago
Staff Hardware Engineer: Connectivity Platforms
General Motors
Sunnyvale, CA
The selected candidate is expected to report to Warren, MI or Sunnyvale, CA at least three days per week (Tuesday–Thursday)
Added 25 days ago
Silicon Packaging Engineer (SIPI)
Meta
Sunnyvale, CA · Menlo Park, CA
We are seeking a highly skilled Signal Integrity and Power Integrity (SI/PI) Engineer to own chip-package-system co-design for next-generation AI accelerator and high-performance computing…
Added 25 days ago
Signal Integrity Engineer
Global Foundries
Richardson, TX
We are seeking a highly experienced Principal Engineer, Signal Integrity & Power Integrity Leader with strong experience in signal integrity, power integrity, die-package-board co-design,…
Added 25 days ago
Senior Staff Applications Engineer
Altium
Austin, TX
As a Senior Staff Application Engineer for the Renesas Performance Computing Power Emulation Engineering team, you will be part of a fast-paced power management team supporting pre-silicon…
Added 26 days ago
Senior Hardware Design Engineer
Broadata Communications
Torrance, CA
We are seeking a hands-on Senior Hardware Design Engineer to design, simulate, bring up, and validate complex mixed-signal and high-speed digital hardware for BCI multimedia, video-over-IP,…
Added 27 days ago
Senior Staff Engineer Field Application Engineering
Infineon
Washington
…integration. Drawing on Infineon's portfolio of radiation-hardened and radiation-tolerant semiconductors - MOSFETs, GaN power devices, gate drivers, and integrated power ICs - you will…
Added 27 days ago
Principal Analog Design Engineer
Micron Technology
Richardson
We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…

Micron Technology

Principal Signal Integrity Engineer, Pathfinding

Boise, United States
Folsom, United States
Richardson, United States
San Jose, United States

$119,000 to $320,000 USD / year

Apply on careers.micron.com About employer

Applications open in a new tab.

Job details

Pay: $119,000 to $320,000 USD / year
Apply by: Mar 21, 2027
Experience: 10+ years of industry experience in signal or power integrity analysis applied to high-speed interface technologies
Posting language: English
Posted: Sep 22, 2026

Original job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Principal Signal Integrity Engineer - Interface Pathfinding

About the Role

At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing.

Micron’s Interface Pathfinding team operates at the leading edge of that mission - serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio.

As a Principal Signal Integrity Engineer, you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption.

What You’ll Work On

Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep - spanning electrical modeling, channel analysis, and substrate evaluation - with an emphasis on original analysis rather than execution of established playbooks.

Key signal integrity domains include:

Interconnect Modeling - Generating and validating electrical models for packages, substrates, and interconnects used in forward-looking feasibility studies
Substrate & Packaging Evaluation - Assessing next-generation substrate technologies and providing strategic direction on their signal integrity implications
Channel & I/O Co-Optimization - Performing SI analysis during feasibility studies and driving I/O + channel co-optimization, including coordination with supporting organizations
Design Rule Development - Driving progressive design rules that enable package and system-level performance scaling
Link Budgeting & Sim-to-Silicon Correlation - Establishing forward-looking link budgets and developing methodologies that connect simulation predictions to measured silicon outcomes

What You’ll Own

Interconnect Modeling: Own the generation and validation of interconnect models - from field solver extraction through time- and frequency-domain circuit simulation - serving as the authoritative source for model quality on the team.
Technology Evaluation: Lead SI assessment of forward-looking substrate and packaging technologies, translating physical characteristics into channel performance projections and strategic recommendations.
Feasibility Analysis: Drive SI analysis during pathfinding studies, including I/O and channel co-optimization, and provide direction to supporting organizations when analysis is distributed.
Design Rule Definition: Develop and champion progressive package and system-level design rules grounded in electromagnetic analysis and simulation data.
Link Budgeting: Define forward-looking link budgets and establish the sim-to-silicon correlation methodologies that give the team and product programs confidence in pre-silicon predictions.
Cross-Disciplinary Engagement: Collaborate across Signal Integrity, Circuit and Chip Design, Packaging R&D, and System Integration - translating SI findings into actionable guidance for partner teams.
Design Documentation: Author analysis reports, modeling methodology documents, and design rule specifications that serve as the authoritative reference for the team and follow-on programs.

What You Bring

Required

MS or PhD in Electrical Engineering or related field (MS with strong electromagnetic/SI fundamentals accepted; PhD preferred but not sufficient on its own - demonstrated hands-on modeling and simulation capability is what differentiates)
10+ years of industry experience in signal or power integrity analysis applied to high-speed interface technologies
Extensive experience applying electromagnetic and transmission line theory to SI/PI analysis of differential and single-ended interfaces
Extensive experience with time- and frequency-domain simulation tools - ADS, HSPICE, SPECTRE, or equivalent
Deep experience with electromagnetic field solvers - Q3D, SIWAVE, HFSS, or equivalent - including solver setup, mesh strategy, and result validation
Working knowledge of hardware measurement tools - oscilloscopes, TDR, VNA - and their application to SI characterization
Comfortable with broad ownership, cross-discipline collaboration, and making analytical decisions with real program consequences
Strong written and verbal communication skills - this role produces modeling reports, link budgets, and design rule documents

Preferred

Familiarity with memory I/O architectures and their signal integrity constraints
Experience with advanced packaging technologies - 2.5D/3D integration, embedded die, or high-density organic substrates - and their electromagnetic modeling challenges
Post-silicon characterization experience - correlating simulation predictions to measured TDR, insertion loss, eye diagrams, or BER results
Some familiarity with modeling optical links
Willingness to learn and apply Artificial Intelligence -based methods to streamline modeling and simulation workflows
Prior experience in a pathfinding or advanced development environment where analysis methodology is actively developed, not inherited

Why This Role

You will do original signal integrity analysis on problems that matter - developing the interconnect models and channel solutions that define what high-speed memory and die-to-die interfaces can achieve.
You will work alongside genuinely exceptional engineers - spanning analog design, chip design, packaging R&D, and system integration - in an environment where SI analysis directly shapes architectural decisions.
The team is intentionally small and senior - decisions get made quickly, bureaucracy is minimal, and your technical judgment will be trusted.
You are joining an active program with real momentum - your analytical leadership will directly shape its trajectory and scope.
This is a long-term opportunity - strong execution early creates compounding impact as the program scales.

A Note to All Candidates

This role is part of a deliberate effort to build a long-term, high-caliber team around a compelling high-speed interface technology program. We are looking for engineers who want to own something, build something, and grow with a program. If that description resonates, we’d like to hear from you.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$119,000.00 - $320,000.00 a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Apply on careers.micron.com About employer

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ML
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Jobs in the United States