Jobs in the United States

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Micron Technology

HBM Design Architect

Richardson, United States

Apply on careers.micron.com About employer

Applications open in a new tab.

Job details

Apply by: May 3, 2027
Experience: BS in Electrical Engineering, Physics, Materials Science, or related field with 7+ years of relevant experience;
Posting language: English
Posted: Nov 4, 2026

Original job description

Req ID:

JR116834 HBM Design Architect

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron’s High Bandwidth Memory (HBM) Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. Our Roadmap and Pathfinding group operates at the intersection of device technology, process, packaging, and product architecture, with a mission to enable next-generation memory technologies for product intercept.

As an HBM Design Architect, you will lead the technical enablement of novel memories and integration technologies - such as DRAM, gain-cell memory, stacked DRAM, and scaled-pitch hybrid bonding - grounded in a deep understanding of mainstream DRAM and HBM products. You will translate technology capabilities into product architectures, identify critical product requirements at risk, and drive de-risking plans with design, process, packaging, and product teams!

Responsibilities

Lead architecture and feasibility assessments for emerging memories (DRAM, gain cell, stacked/vertical DRAM) and advanced integration (hybrid bonding, fine-pitch TSV)
Apply mainstream DRAM/HBM product knowledge - array architecture, timing parameters, bandwidth, power, RAS, and JEDEC requirements - to define what a new technology must deliver to be product-viable
Translate device and process characteristics (retention, variability, cell/array physics, BEOL and bonding constraints) into product-level requirements for bandwidth, latency, power, thermals, density, and reliability
Identify technology–product gaps, define technology targets, and drive de-risking plans including test vehicles, DOEs, and modeling/simulation strategies
Partner with process integration, device, packaging, and design teams to define technology-to-product intercept points and decision criteria
Lead system-technology co-optimization (STCO) studies spanning array architecture, periphery/CMOS-under-array, interconnect, PDN, and thermal trade-offs
Develop roadmap proposals and present recommendations to technical leadership and cross-site working groups (LLM)

Minimum Qualifications

BS in Electrical Engineering, Physics, Materials Science, or related field with 7+ years of relevant experience; MS with 5+ years; or PhD with 3+ years
Solid grounding in mainstream DRAM and/or HBM product architecture and design (array, periphery, datapath, timing, power)
Deep understanding of DRAM or emerging memory cell and array operation (sensing, retention, disturb, variability)
Working knowledge of semiconductor process technology and its impact on device and circuit behavior

Preferred Qualifications

PhD or equivalent experience with 10+ years in DRAM/HBM build, memory technology, or pathfinding
Direct experience with vertically coordinated DRAM technologies, gain-cell structures (2T0C/IGZO or similar), stacked memory builds, or other emerging memory programs
Experience with hybrid bonding, TSV-based 3D integration, or advanced packaging technology development

Job Profile(s):

Systems Design Engineer 5

Relocation Level: TBD

Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Apply on careers.micron.com About employer

More about this job

Skills

Product comprehension
Packaging
Product knowledge
Leadership
Electrical engineering
Materials science
Documentation

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Work requirements

Jobs in the United States