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  • DRAM Pathfinding & Process Integration Engineer

    Micron Technology

    Albany

    • $159,000 to $271,000 USD / year

    JR115039 DRAM Pathfinding & Process Integration Engineer

  • DRAM Pathfinding & Process Integration Engineer

    Micron Technology, Inc.

    Albany, NY

    • $159,000 to $271,000 USD / year

    As a DRAM Pathfinding & Process Integration Engineer, you will lead early-phase technology investigation and process integration for next-generation DRAM architectures.

  • CVD Equipment Development Engineer, Advanced Memory Pathfinding

    Micron Technology, Inc.

    Albany, NY

    • $159,000 to $271,000 USD / year

    Join Micron’s DRAM Technology Development organization and play a role in improving the equipment capabilities necessary for future memory technologies! Based at the NY CREATES Albany…

  • CVD Equipment Development Engineer, Advanced Memory Pathfinding

    Micron Technology

    Albany

    • $159,000 to $271,000 USD / year

    JR115042 CVD Equipment Development Engineer, Advanced Memory Pathfinding

  • Principal Firmware Developer, HBM

    Micron Technology

    Folsom

    • $181,000 to $308,000 USD / year

    Provide technical leadership from early concept and architectural pathfinding through silicon bring-up, qualification, customer enablement, and product sustainment.

  • Senior Heterogenous Integration Process Engineer

    Tokyo Electron U.S. Holdings, Inc.

    ALBANY, NY

    …continue to engage with you.Job DescriptionSenior Heterogenous Integration Process EngineerLocation of position: Albany, NYTEL Technology Center, America (TTCA) is TEL's advanced R&D center…

  • SMTS Process Engineer RDA /Metrology

    Micron Technology, Inc.

    Boise, ID

    This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable…

  • Senior Heterogenous Integration Process Engineer

    Tokyo Electron U.S. Holdings, Inc.

    ALBANY, NY

    …continue to engage with you.Job DescriptionSenior Heterogenous Integration Process EngineerLocation of position: Albany, NYTEL Technology Center, America (TTCA) is TEL's advanced R&D center…

  • Principal Foundry Interface Design Engineer, HBM

    Micron Technology

    Folsom · Richardson

    …technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups,…

  • Principal Engineer Advanced DRAM PI

    Micron Technology

    Boise

    …technology by driving the development of first in industry Advanced DRAM solutions! You will collaborate across process integration, device engineering, materials science, characterization,…

  • Process Integration Engineer - DRAM, DMTS

    Micron Technology

    Boise

    JR87299 Process Integration Engineer - DRAM, DMTS

  • Principal HBM Design Architect

    Micron Technology

    Richardson

    As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You…

  • DMTS Process Development Engineer, Advanced Packaging

    Micron Technology

    Boise

    JR112474 DMTS Process Development Engineer, Advanced Packaging

  • Sr Process Integration Engineer, DRAM

    Micron Technology

    Boise

    JR102428 Sr Process Integration Engineer, DRAM

  • New College Grad - HBM Design Architect | MS or PhD

    Micron Technology

    Richardson

    Graduate research, internship, thesis, dissertation, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D…

  • Principal HBM Design Architect

    Micron Technology

    Richardson

    …memory and semiconductor solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will design, simulate, optimize, and floorplan advanced DRAM circuits for…

  • Principal Foundry Interface Design Engineer, HBM

    Micron Technology

    Folsom · Richardson

    …technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups,…

  • Systems Software Engineer, (Linux, CUDA)

    Micron Technology, Inc.

    Richardson, TX

    As a Systems Software Engineer in Micron’s Storage and Memory Systems (SMS) group within TPG Pathfinding, you will design, develop, and demonstrate innovative system‑level software that…

  • Sr Process Integration Engineer, DRAM

    Micron

    Boise, ID

    As a Process Integration Engineer in the Advanced DRAM organization, you will develop the innovative solutions required to produce the most advanced Memory products on the planet! You will…

  • Sr Process Integration Engineer, DRAM

    Micron Technology, Inc.

    Boise, ID

    As a Process Integration Engineer in the Advanced DRAM organization, you will develop the innovative solutions required to produce the most advanced Memory products on the planet! You will…

  • SMTS Process Engineer RDA /Metrology

    Micron

    Boise, ID

    This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable…

  • Principal HBM Design Architect

    Micron Technology, Inc.

    Richardson, TX

    As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You…

  • Principal HBM Design Architect

    Micron Technology, Inc.

    Richardson, TX

    …memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for…

  • Principal HBM Design Architect

    Micron Technology, Inc.

    Richardson, TX

    …memory and semiconductor solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will design, simulate, optimize, and floorplan advanced DRAM circuits for…

  • Principal Foundry Interface Design Engineer, HBM

    Micron Technology, Inc.

    Folsom, CA · Richardson, TX

    …technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups,…