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LR
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Sacramento, CA
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Chicago, IL · Raleigh, NC · Charlotte, NC · Cincinnati, OH · Cleveland, OH · Columbia, SC · Columbus, OH · Dallas, TX · Baltimore, MD · Richmond, VA · Rochester, NY · Rosemont, IL · Boston, MA · St. Louis, MO · Salt Lake City, UT · San Antonio, TX · Seattle, WA · Albany, NY · Stamford, CT · Tampa, FL · Atlanta, GA · Toledo, OH · Austin, TX · Tulsa, OK · Denver, CO · Des Moines, IA · Detroit, MI · Boca Raton, FL · Buffalo, NY · Florham Park, NJ · Fort Worth, TX · Greensboro, NC · Hartford, CT · Houston, TX · Grand Rapids, MI · Jacksonville, FL · Kansas City, MO · Las Vegas, NV · Little Rock, AR · Louisville, KY · Birmingham, AL · Fayetteville, AR · Melville, NY · Miami, FL · Milwaukee, WI · Minneapolis, MN · Nashville, TN · New Orleans, LA · NY · Oklahoma City, OK · Philadelphia, PA · Phoenix, AZ · Pittsburgh, PA · Portland, OR
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Micron Technology

Memory Package Integration Architect

Boise, United States
San Jose, United States

$143,000 to $398,000 USD / year

Apply on careers.micron.com About employer

Applications open in a new tab.

Job details

Pay: $143,000 to $398,000 USD / year
Apply by: May 11, 2027
Experience: 6+ years of Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design
Posting language: English
Posted: Nov 12, 2026

Original job description

Req ID:

JR115880 Memory Package Integration Architect

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs - turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further!

This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron.

Responsibilities:

Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach
Drive long‑term memory technology packaging strategy and influence industry standards
Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products
Serve as a technical interface to internal partners, customers, BUs, senior leaders.
Develop AI based multi-physics solutions for efficiency gains

Minimum Qualifications:

Master’s degree or equivalent practical experience in EE, CE, CS, or related field
6+ years of Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design
Deep understanding of memory timing, signaling, power, package process technology
working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools
Experience applying AI or LLMs for engineering efficiency

Preferred Qualifications:

Master’s degree or PhD in a related technical field
Recognized technical leadership across multiple products
Experience in Signal and Power integrity analysis and mechanical and reliability analysis, thermal analysis
Expertise in memory systems architecture

Job Profile(s):

Product Development Engineer 5 - Hardware Engineering MTS

Relocation Level: TBD

Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$143,000.00 - $398,000.00 a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Apply on careers.micron.com About employer

More about this job

Skills

Packaging
EDA
Ansys
Leadership
Documentation

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Work requirements

Jobs in the United States