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Integration Manager, SME
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Ft Belvoir, VA
…understand their market data through the synchronization of process innovation, human dynamics, analysis, and the integration of data technology capabilities, to ensure functional…
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Principal Cyber Security Analyst
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…Subject Matter Expert (SME) for cyber development efforts. This engineer has a strong understanding of the requirements capture process and the full lifecycle of technical cyber development…
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Storage Engineer – Enterprise Data Center & Cloud Services
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Newington, VA · Springfield, VA
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ENGINEER SYSTEMS 2
Huntington Ingalls Industries
Newport News, VA
…together at the forefront of technology, manufacturing, and integration of the most powerful and survivable naval ships in the world. Want to be part of the team? Apply today! We look…
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PROJECT MANAGEMENT ANALYST 3
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ENGINEER MECHANICAL 4
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…together at the forefront of technology, manufacturing, and integration of the most powerful and survivable naval ships in the world. Want to be part of the team? Apply today! We look…
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Software Test Engineer (Integrated Training Systems) - 30882
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DevOps Cloud Engineer - TS/SCI with Polygraph
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Lead Principal Software Development Engineer
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ENGINEER 1
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Microchip - USA

Engineer II - Physical Design

Chandler, AZ, United States

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Job details

Posting language: English
Posted: Oct 29, 2026

Original job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description:

Join the Physical Design team as a Engineer II-Physical Design supporting semiconductor synthesis, floorplanning, placement, clocking, routing, timing, power, physical verification, documentation, and tapeout-readiness activities. This role is best suited for candidates with 2.5–5 years of relevant experience in ASIC or SoC physical design, synthesis, floorplanning, place and route, timing closure, physical verification, or a closely related area.

In this role, you will independently execute defined physical-design assignments and coordinate assigned deliverables, partner with architecture, RTL design, verification, DFT, analog, package, methodology, CAD, product, test, manufacturing, and leadership teams, and help deliver robust performance, power, area, physical-verification closure, reliability, and tapeout readiness.

Responsibilities:

Develop and maintain defined ASIC or SoC physical-design blocks, constraints, scripts, flows, and design data.
Translate approved architecture and RTL requirements into synthesis, floorplan, placement, clock, routing, timing, power, and verification objectives.
Execute implementation, regression, extraction, timing, power, physical-verification, and applicable signoff checks.
Troubleshoot flow, constraint, timing, congestion, power, signal-integrity, physical-verification, and integration issues.
Analyze reports, logs, results, defects, risks, dependencies, and technical tradeoffs; recommend actions.
Maintain design configuration, scripts, run records, waiver evidence, release data, traceability, and technical documentation.
Coordinate assigned deliverables across architecture, RTL design, verification, DFT, analog, package, methodology, CAD, product, test, and manufacturing teams.
Support automation, reuse, corrective action, and continuous improvement.

Requirements/Qualifications:

Minimum qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, Physics, or a related field with 2.5–5 years of relevant experience in ASIC or SoC physical design, synthesis, floorplanning, placement, clock-tree synthesis, routing, extraction, static timing analysis, power integrity, physical verification, EDA flows, or closely related equivalent experience.

Qualified candidates should demonstrate analytical thinking, semiconductor physical-design judgment, structured problem solving, timing and power analysis, debugging and root-cause analysis, technical documentation, evidence-based communication, cross-functional collaboration, quality focus, and the ability to work with complex architecture, RTL, constraints, libraries, layout, timing, power, physical-verification, reliability, and manufacturing information.

Successful candidates are expected to demonstrate:

Employment stability, reliability, and sustained accountability in prior roles.
Effective teamwork and cross-functional collaboration.
Integrity and accuracy in representing qualifications, experience, and credentials.

Preferred Qualifications:

Experience with ASIC or SoC physical design, synthesis, floorplanning, placement, clock-tree synthesis, routing, extraction, static timing analysis, power integrity, or physical verification.
Experience with EDA tools, scripting, automation, design constraints, low-power implementation, variation analysis, design-for-test, advanced process nodes, or tapeout flows.
Experience resolving timing, congestion, power, signal-integrity, physical-verification, integration, reliability, or manufacturability issues.
Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, Physics, or a related field.

Travel Time:

0% - 25%

Physical Attributes:

Hearing, Seeing, Talking, Works Alone, Works Around Others

Physical Requirements:

100% inside, 80% sitting, 10% standing, 10% walking Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster.

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.

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