Silicon Packaging Technology Engineer
- Sunnyvale, CA, United States
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Job details
- Experience
- 12+ years of experience in advanced silicon packaging development, process integration, and manufacturing
- Posting language
- English
- Posted
Original job description
Summary:
Reality Labs is delivering Meta's vision through AI-powered wearable products. The compute performance, power efficiency, and form factor requirements demand custom silicon with cutting-edge packaging solutions. We are seeking a Silicon Packaging Technology Engineer to join our team and drive advanced packaging technology from concept through productization for next-generation consumer hardware.
Required Skills:
Silicon Packaging Technology Engineer Responsibilities:
- Lead development and roadmap creation for advanced and disruptive packaging technologies (hybrid bonding, TSV, fan-out, SiP, flip chip, SMT, solder ball attach, and assembly processes)
- Establish and manage relationships with foundries, OSATs, substrate suppliers, and material suppliers to support package development activities
- Influence and align OSAT and foundry partners' roadmaps with Meta's custom silicon packaging roadmap
- Collaborate cross-functionally with internal teams (silicon design, architecture, system, thermal, mechanical) and external partners (design houses, OSATs, substrate vendors) to ensure manufacturability, integration, and reliability
- Support test vehicle (TV) design, process feasibility, simulation, and design rule/DFM checks with emphasis on thermo-mechanical reliability
- Drive Design of Experiments (DOEs) for initial builds, product qualification, and sustaining activities
- Lead triage efforts for unexpected inline process, equipment, and quality issues
- drive root cause failure analysis (FA) and corrective actions with partners
- Evaluate and address chip-package interaction (CPI) effects, board-level reliability (BLR), and component-level reliability (CLR) through simulation, testing, and data analysis
- Track technology gaps, reliability risks, and yield issues
- compile and maintain POR, TOR, FMEA, and related KPIs
- Stay updated on advanced packaging technologies and market trends and identify emerging technologies
- Travel both domestically and internationally up to 10% of the time
Minimum Qualifications:
Minimum Qualifications:
- Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
- 12+ years of experience in advanced silicon packaging development, process integration, and manufacturing
- Ability to work with mechanical and thermal constraints to co-optimize package architecture for demanding form factors
- Demonstrated cross-functional collaboration with internal teams and external partners (foundry, OSAT, substrate vendors, ODMs)
- Experience taking products from concept to prototyping and production, including manufacturing specifications, vendor qualifications, and yield/cost optimization
- Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a relevant technical field
Preferred Qualifications:
Preferred Qualifications:
- Master's or PhD degree in a relevant engineering discipline
- Experience with board-level and component-level reliability testing and qualification (JEDEC standards)
- Strong DOE methodology, statistical data analysis, and process characterization skills
- Experience driving failure analysis (FA) - including physical FA techniques, fault isolation, and root cause determination
- Excellent problem-solving and communication skills
- the ability to influence cross-functional stakeholders
- Track record of successful complex package product qualification with OSATs
- Experience with a broad range of packaging technologies: WLCSP, fan-out RDL, WoW, CoW, PoP, SiP, flip chip, and 3D stacking
- Strong understanding of chip-package interaction (CPI), thermo-mechanical stress, and warpage management
- Ability to work independently, manage multiple programs, and travel internationally (typically once per quarter)
Public Compensation:
$212,000/year to $294,000/year + bonus + equity + benefits
Industry: Internet
Equal Opportunity:
Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment.
Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@meta.com.
More about this job
Skills
- Packaging
- Assembly
- Data analysis
- Computer science
- Computer engineering
- Packaging processes
- Collaboration
- Materials science
- Electrical engineering
- Mechanical engineering
- Chemical engineering
- Problem solving
- Communication skills
- Work independently