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Added 17 days ago
Senior Power Systems Engineer, Lunar
Vast
Long Beach, CA
Vast is looking for a Senior Power Systems Engineer, Lunar, reporting to the Senior Vice President, Lunar Programs, to support the development of the systems that will be required for…
Added 17 days ago
Senior Principal Software Engineer (Foundational Platform)
Palo Alto Networks
Santa Clara, CA · San Jose, CA · San Francisco, CA
Core Framework & Standards Development: Contribute to shared internal Go, Node, Python frameworks, core client SDKs, event-driven async patterns, and micro-frontend platform tooling.
Added 17 days ago
Electromagnetics (EM) and Packaging Design Engineer
Texas Instruments
Dallas, TX
Kilby Labs is seeking a highly motivated and experienced electromagnetic modeling engineer to support various TI product development, including Silicon Photonics, RF filters and 2.5D/3D…
Added 17 days ago
IC
WPM C4 Quality and Reliability Engineer
Intel Corporation
OR
- $89,010 to $125,660 USD / year
You must possess the below minimum qualifications to be initially considered for this position
Added 17 days ago
Staff Engineer, Semi Packaging Engineering
Analog Devices Inc.
MA
Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
Added 17 days ago
Staff Engineer, Semi Packaging Engineering
Analog Devices Inc.
CA
We are seeking an experienced Packaging Engineer to lead the development and production implementation of advanced packaging solutions for module products. The engineer will own package…
Added 17 days ago
Design Release Engineer - SLM (Smart Lighting Module)
ALTEN Technology USA
Auburn Hills, MI · Troy, MI
The Smart Lighting Module (SLM) Design Release Engineer (DRE) role at Auburn Hills, Michigan is a multi-disciplinary automotive engineering position. This role bridges mechanical design,…
Added 20 days ago
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Packaging Research and Development Engineer
Intel
Phoenix, AZ
- $133,800 to $188,890 USD / year
You must possess the below minimum qualifications to be initially considered for this position · The candidate must possess one of the following:
Added 20 days ago
Electrical Manufacturing NPI Engineer
Arista Networks
Santa Clara, CA
As an Electrical NPI Engineer, you will partner with the HW/Mech/Thermal Engineering team on new product development, manufacturing readiness for the high performance network equipment.
Added 20 days ago
IC
Module Engineering - Day Shift 5 or 7
Intel Corporation
AZ
- $99,030 to $139,810 USD / year
Shift 5: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Sunday–Tuesday and alternating Wednesdays) · Shift 7: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Thursday–Saturday and alternating Wednesdays)
Added 20 days ago
Product Engineer- Engine System Cooling
Prestige Engineering
Clinton Twp, MI
Added 21 days ago
Battery Mechanical Engineer
MAGNIX USA INC
Everett, WA
About the role: As a Battery Mechanical Engineer at magniX, you will lead and contribute to the design, specification, and integration of advanced lithium-ion battery packs for electric and…
Added 21 days ago
ASIC Package Engineer
Meta
Austin, TX
Meta is looking for an experienced ASIC Package Engineer to join its ASIC Packaging team. This role owns the technology development and qualification readiness of the package-to-board…
Added 21 days ago
Engineering & Productization Manager – Fabrication & Manufacturing
Loenbro
Dallas, TX
Reporting to the Senior Vice President of Manufacturing, this role leads the technical development and productization of fully integrated modular solutions for Loenbro's targeted end…
Added 21 days ago
Senior Principal Engineer, Hardware Application Engineering - Signal Integrity & Power Integrity
MSI - (Marvell Semiconductor Inc.) US
Santa Clara, CA
As Senior Principal Engineer for Signal Integrity and Power Integrity, you will be the senior technical authority responsible for ensuring that customer platforms built on Marvell's…
Added 21 days ago
SMTS Quantum Integration Engineer
GLOBALFOUNDRIES U.S. INC.
NY
The Quantum Integration Engineer (SMTS) is a senior technical contributor within the Quantum Product Development organization responsible for development and integration of semiconductor…
Added 21 days ago
Senior PA Design Engineer (10575)
Qorvo US, Inc.
San Jose, CA
…our planet. Overview As a Staff Power Amplifier (PA) Design Engineer, you will be involved in the design and development of high-efficiency and high-linearity Cellular Power Amplifiers…
Added 22 days ago
Staff Package Design Engineer
Renesas
Tempe, AZ
Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
Added 22 days ago
Software Engineer
GE HealthCare
Waukesha, WI
As a Software Engineer, you will own the design, development, and delivery of next‑generation compute solutions for Magnetic Resonance Imaging (MRI) scanners. Working across global…
Added 22 days ago
Staff Module Design Engineer (10901)
QORVO TEXAS LLC
Richardson, TX
…and power our planet. We are looking for a Staff Electrical Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged…
Added 22 days ago
Senior/Principal RF Test Engineer, Texas Institute for Electronics
UNIVERSITY OF TEXAS AT AUSTIN
Austin, TX
…(2740 GHz), and W-band (75110 GHz) microsystems at wafer, die, module, and system levels.Perform S-parameter characterization, on-wafer probing, noise figure measurements, and power sweeps…
Added 22 days ago
Senior Power Integrity Engineer, Platforms Infrastructure
Google
Sunnyvale, CA
Engage with power module suppliers and industry partners to drive the development and evaluation of emerging power delivery technologies.
Added 22 days ago
Sr. controls engineer team leads
Church & Dwight Co., Inc.
York, PA
…Have the Power to Win. ABOUT THE OPPORTUNITY: 1. Sr Controls Engineer 2. Monday - Friday Hours may vary Come join our York, PA facility where we manufacture and distribute products such as…
Added 22 days ago
Packaging Integration Engineer (2027 New College Graduate)
GlobalFoundries
ROUND LAKE, NY
Must have at least an overall 3.0 GPA and proven good academic standing
Added 22 days ago
Quantum Integration Engineer PMTS
GlobalFoundries
ROUND LAKE, NY
The Quantum Integration Engineer (PMTS) will serve as a principal technical contributor enabling GlobalFoundries' quantum computing roadmap. This individual will provide critical…

ASIC Package Engineer

Austin, TX, United States

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Job details

Experience: 8+ years of experience in semiconductor packaging with direct ownership of package-to-board assembly and reliability
Posting language: English
Posted: Oct 22, 2026

Original job description

Summary:

Meta is looking for an experienced ASIC Package Engineer to join its ASIC Packaging team. This role owns the technology development and qualification readiness of the package-to-board attach process for Meta's custom AI/ML and networking silicon - the critical interface where a larger than reticle sized, large-body advanced package meets the motherboard Meta designs. The engineer will lead the development and optimization of package interaction with board attach processes. The Meta Infrastructure team designs, builds, brings up, tests, and integrates custom and general-purpose silicon-based hardware systems that power Meta's platforms, deployed in data centers worldwide. Designs are published through the Open Compute Project Foundation. We are building a deep competency in packaging technology to support the rapid development of custom silicon and to develop scalable packaging solutions that are optimal for our next-generation AI/ML products and system-level performance. As die sizes grow past 3.3x reticle and packages move to lidless/lidded and asymmetric stackups, board technology development for next gen ASIC is very important to achieve desired yield due to challenges with package warpage, thermo-mechanical stresses, and solder-joint reliability. The person in this role serves as the primary packaging expert for package to board technology development, working shoulder-to-shoulder with Product Quality Engineering (PQE), Supplier Quality Engineering (SQE), and module design teams to turn it into a fully qualified, statistically controlled, high-yield manufacturing process.

Required Skills:

ASIC Package Engineer Responsibilities:

Own package-to-board interaction technology development for Meta's large-body advanced packages - how the package, substrate, and PCB behave together through assembly and in the field
Characterize and mitigate package warpage and coplanarity across the reflow window for large-body and lidless packages
Drive board-level reliability (BLR) strategy for ASIC packages in partnership with quality teams - thermal cycling, drop/shock, bend, and vibration
Define and execute mechanical and electrical test vehicle (MTV/ETV) strategies to de-risk package-board interaction ahead of A0 silicon availability, including solder-joint evaluation by X-ray, cross-section, and dye-and-pry at the ODM
Represent package-board interaction and board-assembly constraints in silicon/package/PCB/system co-design and product design reviews
Collaborate with package design and module design teams to ensure design for manufacturability (DFM) considerations are incorporated into package and board development
Develop and implement package-board interaction process specifications, design rules, and manufacturing guidelines for new package technologies
Evaluate and qualify new package-board interaction equipment, materials, and processes to support technology roadmap requirements
Partner with PQE, SQE, and ARD teams to establish quality standards, qualification criteria, and reliability requirements for package-board interaction processes
Establish statistical process control (SPC) methodologies and yield improvement initiatives for package-board interaction assembly operations
Own package-board interaction content in FMEAs, control plans, and key-characteristic definitions
support ODM line qualification and control-run gates with PQE
Create, conduct, and analyze Designs of Experiments (DOE) for package-board interaction development and sustaining activities
Drive supplier engagement and qualification for package-board interaction-related materials and equipment

Minimum Qualifications:

Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, or equivalent practical experience
8+ years of experience in semiconductor packaging with direct ownership of package-to-board assembly and reliability
package-board interaction process engineering or electronics manufacturing background
Experience with package board technology processes including solder paste printing, pick-and-place, reflow soldering, and inspection methods
Experience working with package assembly and ODM suppliers and driving process qualification and yield improvement programs
Experience with failure analysis techniques for solder joint reliability and package-board interaction-related defects
Experience collaborating with quality engineering teams (PQE/SQE) to establish process controls and qualification requirements
Experience with statistical process control, process capability analysis, and Design of Experiments
Willingness to travel internationally, typically once per quarter

Preferred Qualifications:

Experience with reflow temperature profiling, solder alloy and paste material selection, and low-temperature solder processes
Experience with AI/HPC or networking hardware at data-center scale
Experience with high-temperature warpage characterization and thermo-mechanical or finite element modeling (FEM) of packages and solder joints
Hands-on experience with SPI, AOI, and X-ray inspection systems and associated data analysis
Experience with large-body FCBGA, flip-chip, and 2.5D/3D advanced packages and their interaction with board-assembly constraints
Master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline
Knowledge of packaging and assembly industry standards
Experience with ODM, CM/EMS, OSAT, and substrate supplier engagement and audit

Public Compensation:

$178,000/year to $250,000/year + bonus + equity + benefits

Industry: Internet

Equal Opportunity:

Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment.

Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@meta.com.

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More about this job

Skills

Packaging
Manufacturing processes
Printed circuit boards
Assembly
Statistical process control
SPC
Materials science
Mechanical engineering
Electrical engineering
Process engineering
Inspection
FEM
Data analysis
EMS

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Work requirements

Jobs in the United States