Jobs in the United States

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Added 1 min ago
Control Systems Engineer (Instrumentation & Controls)
HDR
Folsom, CA · Walnut Creek, CA
The Northern California Control Systems and Cybersecurity team supports a diverse portfolio of projects across industrial automation, operational technology (OT), SCADA, instrumentation and…
Added 8 mins ago
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Senior Core Infrastructure Engineer
Oracle
Nashville, TN
- $79,200 to $209,500 USD / year
…Implements standard replication and synchronization, develops automation/IaC for troubleshooting and maintenance, and applies advanced security controls (encryption, access, remediation)…
Added 8 mins ago
Controls Project Designer
IMEG Consultants Corp.
Columbus, OH
Are you Ready to Engineer Your Career? At IMEG, one of the largest design consulting firms in the U.S., we strive to provide exciting and rewarding career opportunities to our team members.…
Added 8 mins ago
Building Automation System Engineer
Merck
Rahway, NJ
Minimum 2–4 years of experience with building automation or control systems.
Added 15 mins ago
Control Systems Engineer (Instrumentation & Controls)
HDR
Folsom, CA · Walnut Creek, CA
The Northern California Control Systems and Cybersecurity team supports a diverse portfolio of projects across industrial automation, operational technology (OT), SCADA, instrumentation and…
Added 16 mins ago
Control Systems Engineer (Instrumentation & Controls)
HDR
Folsom, CA · Walnut Creek, CA
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Added 25 mins ago
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United States
Develop automation and reusable engineering patterns to improve IAM delivery, reduce manual processes, and strengthen control consistency.
Added 25 mins ago
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Build Your Robotics Career. Explore the Country as a Robotics Field Service Engineer or Technician
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- $25 to $32 USD / hour
Familiarity with industrial automation components such as sensors, motors, drives, safety circuits, and control systems
Added 31 mins ago
Lead DevOps Engineer St. Louis, USA
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Added 34 mins ago
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Added 37 mins ago
Electrical Design & Verification Engineer (DVE), Leo Optical ISL Development
Amazon Kuiper Manufacturing Enterprises LLC
Redmond, WA
The Design Verification Engineer will be a member of the Avionics team, focusing on the design verification of the various electrical functions of high-performance communication systems.
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Software Engineer Internship – AI Platform Team
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Added 46 mins ago
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Greenville, SC
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Added 47 mins ago
Senior Electrical Engineer (Power & Mixed-Signal)
Anduril Industries
Costa Mesa, CA
…turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy,…
Added 52 mins ago
Quality Engineer
Conti Electric Inc
Sterling Heights, MI
reliability of our electrical control products throughout the manufacturing process. You will
Added 53 mins ago
*Engineering Lead Analyst - CONVERSION*
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Added 58 mins ago
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- $28 to $33 USD / hour
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- $55 to $75 USD / hour
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Electrical Controls Design Engineer
Actalent
Arlington, TX
- $40 to $50 USD / hour
Dallas-Fort Worth, TX 2+ Years of Experience We're seeking an Electrical Controls Design Engineer to support industrial automation projects from concept through startup. This role combines…
Added 58 mins ago
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Added 58 mins ago
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Full-stack Engineer 5
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L3Harris Technologies

Senior Specialist, Senior Microelectronics Failure Analysis Engineer

Palm Bay, FL, United States

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Job details

Posting language: English
Posted: Nov 2, 2026

Original job description

Job Title: Senior Specialist, Senior Microelectronics Failure Analysis Engineer

Job Code: 47053 Job Location: Palm Bay, Florida – On Site Job Schedule: 9/80 – Employees work 80 hours over nine days in each two-week period, with every other Friday off.

Job Description

L3Harris is seeking a Senior Specialist, Microelectronics Failure Analysis Engineer to investigate component failures and provide actionable insights that improve product quality and reliability. This role will lead investigations involving microelectronic components or circuit level assemblies that fail during manufacturing, qualification, testing, or field operation.

The engineer will develop investigative plans, perform hands-on electrical and physical analysis, and interpret evidence to identify failure mechanisms and establish root cause. Core techniques include optical microscopy, X-ray inspection, cross-sectioning, scanning electron microscopy (SEM), photoemission microscopy, electrical testing, decapsulation, and delayering.

This position requires strong technical judgment, laboratory proficiency, and the ability to communicate complex findings clearly to both technical and non-technical audiences. The successful candidate will collaborate with design, manufacturing, quality, reliability, and supplier teams to recommend corrective actions and verify their effectiveness.

Essential Functions

Lead microelectronic failure investigations from initial assessment and test planning through root cause determination, reporting, and corrective action verification.
Establish analysis strategies based on device construction, failure symptoms, operating history, and available evidence, sequencing techniques to preserve critical information.
Use optical microscopy and X-ray inspection to evaluate component condition, package integrity, internal structures, and potential assembly defects.
Perform electrical testing and characterization to reproduce reported failures, identify abnormal device behavior, and isolate suspect circuits or connections.
Apply photoemission microscopy and liquid crystal hotspot detection to isolate leakage related phenomena on integrated circuits.
Prepare samples through decapsulation, cross-sectioning, and controlled delayering to expose internal features while minimizing preparation-induced damage.
Examine exposed structures using SEM to characterize defects in semiconductor devices, metallization, bond wires, interfaces, and package interconnects.
Correlate electrical measurements, imaging results, physical observations, and manufacturing or field history to distinguish failure symptoms from underlying causes.
Evaluate potential mechanisms such as electrical overstress, electrostatic discharge, corrosion, contamination, delamination, metallization damage, and interconnect fatigue.
Partner with engineering, manufacturing, quality, reliability, and suppliers to translate investigation findings into practical design, material, or process improvements.
Assess follow-up test results and analysis data to determine whether corrective actions address the identified failure mechanism.
Produce clear technical reports that document methods, supporting evidence, conclusions, limitations, and recommended next steps.
Present detailed findings to technical teams and provide concise, accessible summaries for program leadership, customers, and non-technical stakeholders.
Manage concurrent investigations, communicate priorities and progress, and escalate technical risks or resource constraints.
Develop and improve laboratory procedures, sample preparation methods, and analysis workflows.
Provide technical guidance and mentoring to engineers and laboratory personnel.
Maintain traceable investigation records and follow applicable laboratory safety, chemical handling, ESD control, and equipment procedures.

Qualifications

Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related technical discipline and a minimum of six years of relevant experience; graduate degree and a minimum of four years of relevant experience; or, in lieu of a degree, a minimum of ten years of relevant experience.

Preferred Additional Skills

Experience analyzing analog, digital, mixed-signal, RF, power, or discrete semiconductor components.
Hands-on experience investigating failures in semiconductor devices, integrated circuits, or microelectronic packages.
Demonstrated proficiency in electrical testing and physical failure analysis, including optical microscopy, X-ray inspection, cross-sectioning, SEM, photoemission microscopy, decapsulation, and delayering.
Working knowledge of semiconductor device operation, fabrication processes, packaging technologies, and common failure mechanisms.
Experience integrating results from multiple analytical techniques to develop evidence-based root cause conclusions.
Demonstrated ability to write technical reports and communicate investigation results to technical and non-technical audiences.
Ability to work independently and collaborate across multidisciplinary teams.
Familiarity with advanced packaging, including flip-chip devices, ball grid arrays, stacked die, and multichip modules.
Experience with complementary techniques such as energy-dispersive X-ray spectroscopy (EDS), scanning acoustic microscopy, or thermal imaging.
Knowledge of physics-of-failure principles and methods for distinguishing component defects from assembly, application, or environmental causes.
Experience supporting aerospace, defense, or other high-reliability electronics programs.
Proficiency with data analysis and automation tools such as Python, MATLAB, or LabVIEW.
Strong organizational skills and experience balancing multiple investigations with competing priorities.
Active security clearance.

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More about this job

Skills

Microelectronics
Inspection
SEM
Reporting
Assembly
Hotspot
Integrated circuits
Leadership
Sample preparation
Coaching
Handle chemicals
Electrical engineering
Materials science
Packaging
Write technical reports
Work independently
EDS
Data analysis
Python
The MathWorks MATLAB
LabVIEW
Organizational skills

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