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  • Principal Analog Design Engineer

    Micron Technology, Inc.

    Richardson, TX

    We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…

  • HBM SIPI, Senior Engineer

    Micron Technology, Inc.

    Richardson, TX

    …communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and…

  • Process Integration DRAM, PI Engineer

    Micron Technology, Inc.

    Boise, ID

    Partner with PI Module Owners, Process Area Owners, PI Conversion Coordinators, and Change Management teams to ensure alignment and execution of module support tasks.

  • HBM SIPI, Senior Engineer

    Micron Technology

    Richardson

    …communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and…

  • Principal Analog Design Engineer

    Micron Technology

    Richardson

    We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…

  • HBM SIPI, Staff Engineer

    Micron Technology

    Richardson · Folsom

    • $121,000 to $297,000 USD / year

    …communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and…

  • Engineer, DRAM PI

    Micron Technology

    Boise

    As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron’s core memory technology serving AI-enabled customers. The…

  • Principal Analog Design Engineer, HBM

    Micron Technology

    Richardson

    We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role…

  • Intern - DRAM PI

    Micron Technology

    Boise

    As a Process Integration Engineer, you will contribute to the development of next-generation DRAM technologies by collaborating with process, materials, device, and design engineering…

  • Principal Engineer Advanced DRAM PI

    Micron Technology

    Boise

    …technology by driving the development of first in industry Advanced DRAM solutions! You will collaborate across process integration, device engineering, materials science, characterization,…

  • New College Grad - Process Integration Engineer

    Micron Technology

    Boise

    JR114667 New College Grad - Process Integration Engineer (Evergreen)

  • Intern - CMOS Process Integration

    Micron Technology

    Boise

    As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next…

  • FE CPIE PI Principal/Staff Engineer

    Micron Technology

    Boise

    The Frontend Central Product Integration Engineering (PIE) team delivers best‑in‑class yield, quality, and cycle time through innovation and strong cross‑functional teamwork. Supporting…

  • Principal/MTS Wet Process Development Engineer, DRAM Wet Process (Evergreen)

    Micron Technology

    Boise

    JR103801 Principal/MTS Wet Process Development Engineer, DRAM Wet Process (Evergreen)

  • Intern - ID1 ATE PI Engineer

    Micron Technology

    Boise

    Micron is seeking a highly motivated Process Integration Engineer Intern for a 6-month internship supporting advanced DRAM technology development and manufacturing. This position provides…

  • Principal Design Engineer, HBM

    Micron Technology

    Richardson

    Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing…

  • Intern - DRAM Device Engineer

    Micron Technology

    Boise

    As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next…

  • Intern - ID1 ATE PI Engineer

    Micron Idaho Semiconductor Manufacturing (Triton) LLC

    Boise, ID

    Micron is seeking a highly motivated Process Integration Engineer Intern for a 6-month internship supporting advanced DRAM technology development and manufacturing. This position provides…

  • Principal Engineer, Signal-Integrity and Power-Integrity

    SK hynix America

    San Jose, CA

    SK hynix America is seeking a Principal Engineer to lead the Signal‑Integrity and Power‑Integrity (SIPI) strategy for next‑generation advanced packaging technologies. In this role, you will…

  • Advanced Package Design Engineer

    SK hynix America

    San Jose, CA

    We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance,…

  • Principal Engineer, SOC Design

    Samsung Semiconductor

    San Jose, CA

    The DRAM Development Lab (DDL) is part of Samsung’s Memory Business Unit, the industry's technology and volume leader in DRAM, HBM and NAND Flash. DDL’s vision is to solve key problems of…

  • New College Grad - Process Integration Engineer

    Micron Idaho Semiconductor Manufacturing (Triton) LLC

    Boise, ID

    Micron’s Process Integration (PI) team is at the forefront of technology development and manufacturing excellence. We focus on optimizing semiconductor processes to improve yield, reduce…

  • Principal/MTS Wet Process Development Engineer, DRAM Wet Process (Evergreen)

    Micron Technology, Inc.

    Boise, ID

    As a Principal/ MTS Wet Process Development Engineer, you will lead critical process innovation and integration for next-generation nodes. This role shapes wet process technology direction,…

  • Principal Engineer Advanced DRAM PI

    Micron Technology, Inc.

    Boise, ID

    …technology by driving the development of first in industry Advanced DRAM solutions! You will collaborate across process integration, device engineering, materials science, characterization,…

  • Principal Design Engineer, HBM

    Micron Technology, Inc.

    Richardson, TX

    Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing…