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Senior Hardware Engineer, Radar Systems
HRL Laboratories
…and engineers with expertise in RFIC and MMIC circuit design, advanced packaging, antenna design, system prototyping, signal processing, integration and characterization to build advanced…
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Senior Electrical Engineer, RF PCB Specialist
HRL Laboratories
Expertise in conventional and advanced microelectronic packaging/integration and thermal management
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Microelectronics Chief Engineer
The MITRE Corporation
MITRE’s Electronic Systems Development department seeks a Microelectronics Chief Engineer to provide technical leadership for the microelectronics capability within the Signals &…
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Cable Fabrication Technician
Columbus Technologies and Services Inc
As an Cable Fabrication Technician III, you will be supporting the Electronic Manufacturing, Packaging, & Technical Services Section, which provides engineering services that include the…
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Electronic Fabrication Technician
Columbus Technologies and Services Inc
As an Electronic Fabrication Technician III, you will be supporting the Electronic Manufacturing, Packaging, & Technical Services Section, which provides engineering services that include…
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Staff Engineer Microelectronics Packaging Technology
TTM Technologies, Inc.
…mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market,…
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Thermal R&D Engineer
HRL Laboratories
The Thermal R&D Engineer will drive innovation in advanced thermal management technologies and serve as a focal technical contributor across multidisciplinary programs. A strong heat…
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Staff Engineer Microelectronics Packaging Technology
TTM Technologies, Inc.
…mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market,…
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Postdoctoral Fellow (PREP0004280) - #Faculty
Johns Hopkins University
We are seeking a highly motivated researcher to advance measurement science for next-generation hybrid advanced packaging. This role will contribute to the development of novel surface and…
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Microelectronic Design Engineer
Eccalon LLC
We are seeking a highly skilled and experienced Microelectronic Design Engineer to join our semiconductor design team. You will be responsible for the design, development, simulation, and…
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Senior ASIC Physical Design Engineer
Niobium
At Niobium Microsystems, we develop high performance microelectronic products to enable the secure collection, processing, and distribution of critical data. We are a trusted partner of…
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Process Engineer II - Wire & Ribbon Bonding(1st shift)
BAE Systems
BAE Systems is looking for a Bonding Process Engineer II to work in a fast-paced manufacturing environment at their Nashua, New Hampshire facility. Working closely with multi-disciplinary…
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Process Engineer II - Wire & Ribbon Bonding(Fri-Sun Days)
BAE Systems
BAE Systems is looking for a Bonding Process Engineer II to work in a fast-paced manufacturing environment at their Nashua, New Hampshire facility. Working closely with multi-disciplinary…
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Staff Engineer – Microelectronics Packaging Technology
TTM Technologies, Inc.
As a Staff Engineer – Microelectronics Packaging Technology, you will be part of a multidisciplinary advanced technology team developing highly integrated System-In-Packages (SiP) and…
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Staff Mission Systems Engineer, Electronic Assemblies, Active Clearance
Anduril Industries
Anduril’s Air Dominance and Strike (AD&S) team is seeking a Mission Systems Engineer to join our team with a strong background in integration and packaging of electronics assemblies both at…
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Senior Mission Systems Engineer, Electronic Assemblies, Active Clearance
Anduril Industries
Anduril’s Air Dominance and Strike (AD&S) team is seeking a Mission Systems Engineer to join our team with a strong background in integration and packaging of electronics assemblies both at…
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Materials Microelectronics Engineer
MIT Lincoln Laboratory
The group seeks an engineer/scientist to conduct research and development to advance the state-of-the-art in microelectronic devices from first-of-a-kind demonstrations to prototypes…
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Wide Bandgap Semiconductor Device and Process Integration Engineer
MIT Lincoln Laboratory
The group seeks an engineer/scientist to conduct research and development to advance the state-of-the-art in ultra-wide bandgap semiconductor devices from first-of-a-kind demonstrations to…
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