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Module Development Engineer

Intel Corporation

OR

• $133,800 to $188,890 USD / year

Intel's advanced packaging technology development organization is seeking a Module Development Engineer to support the development of next-generation semiconductor packaging technologies,…

WPM Integration: Defect Engineer

Intel Corporation

OR

• $103,730 to $146,440 USD / year

As a WPM Advanced Packaging Defect Reduction Engineer, you will play a pivotal role in protecting yield and elevating defect performance across some of the world's most advanced…

Warehouse Lead Industrial Engineer - Ryder Last Mile (remote)

Ryder System

Salem, OR

…improvement methods to support new and existing operations. The Lead Engineer will identify, lead and drive change within the operation through data driven CI, Engineering, and Automation…

WPM C4 Quality and Reliability Engineer

Intel Corporation

OR

• $89,010 to $125,660 USD / year

…manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep and…

Intel Foundry Module Development Engineer - CMP

Intel Corporation

OR

• $133,800 to $255,200 USD / year

…manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain…

Entry Process Integration Engineer

Jireh Semiconductor

Hillsboro, OR

• $89,000 to $100,000 USD / year

Jireh is looking for an entry level Process Integration Engineer. We are looking for those newly graduated with advanced degrees (Master's or PhD) in Electrical Engineering. As a Process…

Staff Manufacturing Engineer, Reliability

Gateway Recruiting

Oregon, OR

Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.

Sort/Test Quality & Reliability Engineer (QRE)

Intel Corporation

OR

• $120,860 to $231,670 USD / year

As a Sort/Test Quality & Reliability Engineer, you will lead quality and reliability readiness for tester hardware, test modules, test processes, manufacturing systems, and…

Principal Optical Engineer

Microsoft

OR · Hillsboro, OR

• $142,800 to $304,200 USD / year

We are seeking a Principal Optical Engineer to drive the architectural design, production roadmap, engineering efforts for next-generation optical interconnects in hyperscale AI…

Principal Engineer, Hybrid Bonding Module

Intel Corporation

OR

• $211,400 to $298,440 USD / year

As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling next-generation advanced packaging technologies that enable…

Semiconductor Research Integration Engineer

Intel Corporation

OR

• $141,910 to $200,340 USD / year

As a Semiconductor Research Engineer, you will drive cutting edge design, simulation, development, and implementation activities for scientific research projects. On a day to day basis, you…

Low Yield Analysis Engineer on Shift

Intel Corporation

OR

• $99,030 to $139,810 USD / year

…failures. In this electrical-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and…

Senior Advanced Packaging Defect Inspection Engineer

Intel Corporation

OR

• $115,110 to $219,550 USD / year

We are seeking a Senior Module Development Engineer who combines deep hands-on expertise in next-generation metrology equipment with a broad, current awareness of where the semiconductor…

Advanced Packaging Module Development Engineer

Intel Corporation

OR

• $133,800 to $255,200 USD / year

We are seeking a highly motivated and technically skilled Process Integration Engineer to join our dynamic team in Hillsboro, Oregon. In this critical role, you will be at the intersection…

LTD Product Development Engineer

Intel Corporation

OR

• $141,910 to $200,340 USD / year

As an LTD Product Development Engineer, you will play a pivotal role in advancing our technology. This position involves developing and validating (with design and on silicon) test programs…

Module Development Defect Metrology Engineer

Intel Corporation

OR

• $155,520 to $219,550 USD / year

As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor manufacturing and packaging technologies at Intel. Your work will focus on…

Advanced Packaging TD Plating Module Engineer

Intel Corporation

OR

• $133,800 to $255,200 USD / year

As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. Your day-to-day responsibilities will focus on developing and…