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Director, fcCSP BU (Advanced Packaging Product Engineer)
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track…
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Senior Staff Advanced Packaging Design Engineer
MSI - (Marvell Semiconductor Inc.) US
…integrity, mechanical integrity, processability, manufacturability, and reliability. This work involves high-speed signaling and complex power delivery networks (PDNs) that require…
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Packaging Research and Development Engineer
Intel
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of…
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Hardware Engineer - EEE Component Engineer
Aerospace
As a Hardware Engineer – EEE Component Engineer here at Honeywell Aerospace, you will be a key contributor to the design and development of cutting-edge hardware solutions. You will play a…
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Semiconductor Packaging Research Engineer
Intel
Position Summary: The Semiconductor Packaging Research Engineer drives technology research for advanced packaging and heterogeneous integration. The role is suited for candidates with…
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Principal Package Design Engineer
Renesas Electronics
Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded…
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Senior Staff Package Design Engineer
Renesas
Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded…
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Hardware Engineer - EEE Component Engineer
Honeywell Aerospace
As a Hardware Engineer – EEE Component Engineer here at Honeywell Aerospace, you will be a key contributor to the design and development of cutting-edge hardware solutions. You will play a…
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Senior Substrate Layout Engineer
Mercury Systems
In this role, our team is looking for a Senior Substrate Layout Engineer who will lead complex HDI PCB and substrate layout efforts for advanced microelectronic solutions used in aerospace,…
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Yield Development Engineer
Intel Corporation
Intel is looking for highly motivated individuals with strong technical background and capabilities to drive rapid continuous improvements in safety, quality, yield, reliability, cost,…
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Defect Characterization Low Yield Analysis Engineer
Intel Corporation
As a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and yield improvement strategies for advanced…
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Cloud Hardware Development, Packaging, Network Product Development - Optics
Amazon Data Services, Inc.
We are looking for a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development (NPD) team. In this role, you will enable the components…
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Package Development Engineer
onsemi
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package…
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