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Substrate Packaging Research and Development Engineer
Intel Corporation
As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and…
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ATD MIHL Equipment Development Engineer
Intel Corporation
Join Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies. In this role, you will…
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Warehouse Lead Industrial Engineer - Ryder Last Mile (remote)
Ryder System
…(PIT) applications; racking and other storage solution designs, packaging equipment; conveyor and sortation equipment; and other automation solutions (e.g. AS/RS). Advanced,…
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Packaging Module Development Engineer
Intel Corporation
As a successful candidate, you must possess · You must possess the below minimum qualifications to be initially considered for this position
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Mechanical Design Engineer
Viasat, Inc.
This is a hybrid role based out of Tempe, AZ (three days in office)
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Advanced Packaging Development Engineer
Intel Corporation
As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor…
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Packaging Research and Development Engineer
Intel
You must possess the below minimum qualifications to be initially considered for this position · The candidate must possess one of the following:
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Module Engineering - Day Shift 5 or 7
Intel Corporation
Shift 5: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Sunday–Tuesday and alternating Wednesdays) · Shift 7: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Thursday–Saturday and alternating Wednesdays)
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Module Engineer On Shift (MEOS)
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Module Engineering - Day Shift 5 or 7
Intel Corporation
Shift 5: (Day shift compressed work week) 6 AM-6 PM (Sunday-Tuesday and alternating Wednesdays) · Shift 7: (Day shift compressed work week) 6 AM-6 PM (Thursday-Saturday and alternating Wednesdays)
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ATD Laser Development Engineer
Intel Corporation
Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique…
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Module Development Engineer - RF Test
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Packaging Module Equipment Development Engineer
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Manufacturing Equipment Technician (MTE) - Back End Nights Shift - Shift 6
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Module Engineer On-Shift (MEOS) – Night Shift (6)
Intel Corporation
Hours: 6:00 PM – 6:00 AM (Night Shift) · You must possess the below minimum qualifications to be initially considered for this position
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Module Engineer On-Shift (MEOS) – Night Shift (4)
Intel Corporation
Hours: 6:00 PM – 6:00 AM (Night Shift) · You must possess the below minimum qualifications to be initially considered for this position
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Module Engineer On-Shift (MEOS) – Day Shift (5)
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Module Engineer On-Shift (MEOS) – Day Shift (7)
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Defect Characterization Low Yield Analysis Engineer
Intel Corporation
You must possess the below minimum qualifications to be initially considered for this position
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Sr Manufacturing Engineer
General Dynamics Mission Systems, Inc
We are seeking a highly skilled Manufacturing Engineer to support the Micro-Electronics value stream in a Low Volume, Medium Mix, High Value manufacturing facility for spaceflight hardware.…
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