Find work in the United States.
A simpler way to find your next job.
Added
Packaging Module Development Engineer
Intel Corporation
Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology &…
Added
Packaging Module Development Engineer
Intel Corporation
Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role,…
Added
Mechanical Design Engineer
Viasat, Inc.
The day to day work encompasses electronics packaging, cabling, thermal analysis down to the component junction level, structural analysis, and qualification testing. You will ensure the…
Added
Advanced Packaging Development Engineer
Intel Corporation
As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor…
Added
Packaging Module Equipment Development Engineer
Intel Corporation
We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and optimizing the…
Added
Packaging Research and Development Engineer
Intel
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of…
Added
Module Engineering - Day Shift 5 or 7
Intel Corporation
We are seeking a Foundry Packaging Module Engineer to join our operations in Chandler, Arizona. In this role, you will develop and optimize assembly processes and equipment, applying…
Added
Packaging Module Development Engineer
Intel Corporation
We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to advancing technology and foundry capabilities by…
Added
Staff Package Design Engineer
Renesas
Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
Added
Packaging Module Development Engineer
Intel Corporation
We are seeking a Packaging Module Development Engineer to join our team in Chandler, Arizona. This unique hybrid position sits at the intersection of metrology engineering, data analytics,…
Added
Principal Package Design Engineer
Renesas Electronics
10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
Added
Senior Staff Package Design Engineer
Renesas
10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
Added
Packaging Module Development Engineer
Intel Corporation
The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield…
Added
Module Engineer On Shift (MEOS)
Intel Corporation
…day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at the…
Added
Sr Staff Product Engineer
Renesas Electronics
…Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly…
Added
Module Engineering - Day Shift 5 or 7
Intel Corporation
Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize…
Added
ATD Laser Development Engineer
Intel Corporation
Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique…
Added
Packaging Module Development Engineer
Intel Corporation
The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly…
Added
Module Development Engineer - RF Test
Intel Corporation
As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. You will play a pivotal role in the design and manufacturability…
Added
Packaging Module Equipment Development Engineer
Intel Corporation
Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module…
Added
TD Media and Collaterals Development Engineer
Intel Corporation
As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve…
Added
Radio Frequency Test Process Engineer
Intel Corporation
We are seeking a talented and driven Module Development Engineer to join our Sort Test Technology Development (STTD) team within Intel's Advanced Packaging Technology Manufacturing (APTM)…
Added
Manufacturing Equipment Technician (MTE) - Back End Nights Shift - Shift 6
Intel Corporation
Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (APTD: SWA) team, a leader in innovative substrate packaging solutions that support Intel's global…
Added
Module Engineer On-Shift (MEOS) – Night Shift (6)
Intel Corporation
Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a…
Added
Module Engineer On-Shift (MEOS) – Night Shift (4)
Intel Corporation
Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a…