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  • Senior Mechanical Engineer, Design

    RTX Corporation

    tucson, AZ

    The Advanced Airframes Department is seeking a Senior Mechanical Engineer to join our team at our Tucson, Arizona location. In this on-site role, you will play a pivotal part as a member of…

  • Intel Foundry LTD Product Yield Development Engineer

    Intel Corporation

    AZ

    • $141,910 to $269,100 USD / year

    …employees drive breakthrough research, develop next generation process and packaging technologies, while also running high volume manufacturing operations in its state-of-the-art facilities…

  • Packaging Module Equipment Development Engineer

    Intel Corporation

    AZ

    • $85,200 to $139,810 USD / year

    We are seeking a Packaging Module Equipment Development Engineer to join our onsite team in Chandler, Arizona. In this role, you will be at the forefront of advancing Intel's assembly and…

  • Material Flow / Process Engineer - Logistics

    Magna Steyr USA Inc.

    Mesa, AZ

    The Engineer, Supply Planning, is responsible for designing, planning, and implementing optimized material flow, packaging, and equipment processes within Division Mesa. This role ensures…

  • Senior PDK Physical Verification Engineer

    Intel Corporation

    AZ

    • $149,600 to $284,580 USD / year

    …innovation. In this highly visible role, you will develop and deploy advanced density fill methodologies and Process Design Kit (PDK) solutions that directly impact Intel's most advanced…

  • Silicon Packaging Design Engineer

    Intel

    Phoenix, AZ

    • $105,650 to $149,150 USD / year

    As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that…

  • Packaging Module Development Engineer

    Intel Corporation

    AZ

    • $133,800 to $188,890 USD / year

    Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology &…

  • Sr. Quality Assurance Engineer

    Moog Inc

    Phoenix, AZ

    • $130,000 to $150,000 USD / year

    Onsite – Phoenix, AZMoog, Inc. is a global leader in motion control across land, sea air and space, pioneering advanced solutions to drive cutting edge innovation for our valued customers.

  • Staff Engineer, Ultra-Pure Water

    Peoria, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Staff Engineer, Facilities Controls System

    Peoria, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Sr. Engineer, Facilities Mechanical Process

    Peoria, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Sr. Engineer, Business Solutions Group

    Tempe, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Senior Safety Engineer

    Peoria, AZ

    Amkor Technology Arizona is seeking a highly motivated Senior EHS Engineer to support the development, implementation, and continuous improviement of EHS programs for one of the most…

  • MES and Factory Automation Engineer

    Peoria, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Director, fcCSP BU (Advanced Packaging Product Engineer)

    Tempe, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Director, Design Manager

    Peoria, AZ

    …headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and…

  • Advanced Packaging Development Engineer

    Intel Corporation

    AZ

    • $133,800 to $188,890 USD / year

    As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor…

  • Packaging Module Equipment Development Engineer

    Intel Corporation

    AZ

    • $133,800 to $188,890 USD / year

    We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and optimizing the…

  • Senior Staff Advanced Packaging Design Engineer

    MSI - (Marvell Semiconductor Inc.) US

    Chandler, AZ

    The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal, and system requirements of next-generation…

  • Packaging Research and Development Engineer

    Intel

    Phoenix, AZ

    • $133,800 to $188,890 USD / year

    Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of…

  • Full Stack Engineer II

    Republic Services

    Phoenix, AZ

    POSITION SUMMARY: The Full Stack Engineer II serves as a technical resource and participates in all phases of the development life cycle. The Full Stack Engineer II analyzes business logic…

  • Module Engineering - Day Shift 5 or 7

    Intel Corporation

    AZ

    • $99,030 to $139,810 USD / year

    …Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of global customers. We collaborate with world-class engineers, contribute…

  • Packaging Module Development Engineer

    Intel Corporation

    AZ

    • $133,800 to $188,890 USD / year

    We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to advancing technology and foundry capabilities by…

  • Embedded Software Engineer

    Actalent

    Tucson, AZ

    • $67.31 to $95 USD / hour

    Job DescriptionThe Embedded Software Engineer plays a key role in developing payload software, external interfaces, and operating system deployments for space sensor payloads. This role…

  • Embedded Software Engineer

    Actalent

    Tucson, AZ

    • $67.31 to $95 USD / hour

    Job DescriptionThe Embedded Software Engineer plays a key role in developing payload software, external interfaces, and operating system deployments for space sensor payloads. This role…