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Intel Corporation

WPM Integration: Defect Engineer

NM, United States
OR, United States

$103,730 to $146,440 USD / year

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Job details

Pay: $103,730 to $146,440 USD / year
Posting language: English
Posted: Nov 6, 2026

Original job description

Job Details:

Job Description:

The Wafer Packaging Manufacturing organization is a global team at the heart of Intel's advanced packaging technology and high-volume manufacturing. Our vision is clear: optimize advanced packaging HVM processes end-to-end to maximize yield, quality, and customer satisfaction. WPM spans a broad and critical portfolio - including EMIB and Foveros wafer processing, TSV reveal, C4 bumping, Die Prep, and Wafer Level Assembly - supporting Intel's most strategic technologies across multiple sites worldwide

As a WPM Advanced Packaging Defect Reduction Engineer, you will play a pivotal role in protecting yield and elevating defect performance across some of the world's most advanced semiconductor packaging processes. Partnering with module engineering, QNR, manufacturing operations, and yield teams across our global network, you will bring together HVM manufacturing expertise with the technical rigor of a development organization to deliver impactful, lasting solutions. At WPM, we are more than a team - we are an organization that learns, grows, and succeeds and fails together, fostering a culture of trust, continuous improvement, and shared accountability where every individual's contribution drives our collective success.

Key Responsibilities

Own assigned advanced packaging layer(s), ensuring all POR defect inspection, classification, and review operations are properly established with healthy inspection recipes and NPI procedures defined.
Drive ADC implementation to ensure accurate defect classifications and maintain defect classification specs and Defect Menagerie for all assigned layers.
Partner with metro tool owners to set up and maintain SPC charts for every defect mode and layer, create OCAPs for Metro MTs and module engineering to respond to OOC events and defect tracers.
Own process health and product quality for the WPM manufacturing line, including defect performance, yield trends, excursions, and baseline process changes.
Own defect excursions through resolution, including containment, wafer/lot risk assessment, disposition, root cause, downstream impact, quality events, and non-POR material.
Drive systematic defect reduction and process improvement using process/metrology data, SORT data, DOEs, FRECLs, ATVs, and experiments with process modules.
Co-lead cross-functional defect health reviews, including IMTs, Focus Teams, and Task Forces covering tracers, trends, OOCs, wafers-at-risk, excursions, and corrective actions.
Extract, analyze, and correlate data to improve defects, yields, and VF matching, identifying key toolsets driving defects through analysis, MBPS, and FA.
Quantify chronic defect gaps to goal, document roadmaps to close gaps, and ensure defect health dashboards are operational and incorporated into factory business processes.
Communicate defect metrics and findings to module and factory stakeholders through weekly summaries and strategic quarterly reviews, while providing defect training to technicians, peers, and module teams.

Behavioral traits:

Proven ability to lead problem-solving initiatives and process improvement projects.
Exceptional communication skills for effectively collaborating across multidisciplinary teams.
Passion for mentoring and fostering technical growth within teams.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship

Minimum Qualifications

Bachelor's degree in engineering or a related field and 3+ years of experience OR Master's degree in engineering or a related field and 2+ years of experience OR PhD in engineering or a related field with no prior professional experience.
Experienced mentioned above should be a combination of the following areas:
Data extraction, synthesis, and analysis using tools such as SQL and Python.
Technology transfer and new product introduction (NPI) activities in semiconductor manufacturing.
Expertise in failure analysis and data mining techniques to identify trends and drive actionable improvements.

Preferred Qualifications

Strong understanding of semiconductor process flow, equipment, and process characterization techniques.
Experience with design of experiments (DOE), statistical process control (SPC), and process capability analysis.

We are looking for motivated individuals eager to make a meaningful impact in shaping Intel's manufacturing leadership. If you are excited about driving innovation and delivering groundbreaking solutions, we encourage you to take the next step and join our team.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, New Mexico, Albuquerque

Additional Locations:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $103,730.00-146,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. *

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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More about this job

Skills

Assembly
Packaging
Packaging processes
Process improvement
Inspection
SPC
Hazard assessment
Microsoft Teams
Business processes
Problem solving
Communication skills
Coaching
SQL
Python
Data mining
Statistical process control
Leadership

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