Jobs in the United States

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Added 2 mins ago
RA
Sr Staff Functional Safety Engineer
Rivian and Volkswagen Group Technologies
Irvine, CA · Palo Alto, CA
- $218,200 to $327,400 USD / year
…will define and own the safety concept for zonal ECUs, 48V power distribution, and infotainment platforms, balancing safety, performance, and cost. You will also mentor engineers and set…
Added 4 mins ago
MK1 EPS Test Engineer III
Blue Origin Personnel, LLC
United States
As an EPS Test Engineer on the Lunar Core Components team, you will serve as the test engineer for one or more Electrical Power System (EPS) Products across the MK1 Lunar Lander Vehicle.…
Added 4 mins ago
Software Development Engineer III - Network & SDN - TeraWave
Blue Origin Personnel, LLC
Cupertino, CA
As a Software Engineer for Network Architecture and SDN at TeraWave, you contribute technical expertise to the design and implementation of the network that operates our multi-orbit…
Added 4 mins ago
Senior Software Engineer - TeraWave PoP Control-Plane Network Services
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Cupertino, CA
We are looking for a Senior Software Engineer to architect and build the PoP Control-Plane Network Services - the software layer that manages, routes, and controls a dynamic mesh network of…
Added 4 mins ago
Principal Software Engineer – TeraWave Vehicle Platforms (Infrastructure)
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Sr Engineer IT Digital
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…every Team Member’s journey. What fuels us? Our belief in the power of…
Added 12 mins ago
Field Engineer III - Mechanical
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Baytown, TX · Baytown
…high-quality construction execution. As a Mechanical Field Engineer III, you will work directly at the project site to interpret design requirements, evaluate field conditions, resolve…
Added 14 mins ago
VD
Senior AI Engineer
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Basking Ridge, NJ · Irving, TX
- $101,000 to $194,000 USD / year
…Where the true you can learn, grow, and thrive. At Verizon, we power and empower how people live, work and play by connecting them to what brings them joy. We do what we love - driving…
Added 14 mins ago
Principal Forward Deployed AI Engineer
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…Where the true you can learn, grow, and thrive. At Verizon, we power and empower how people live, work and play by connecting them to what brings them joy. We do what we love - driving…
Added 14 mins ago
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Principal Engineer - AI/ML Engineering
Verizon Data Services LLC
Basking Ridge, NJ
- $120,500 to $231,000 USD / year
…Where the true you can learn, grow, and thrive. At Verizon, we power and empower how people live, work and play by connecting them to what brings them joy. We do what we love - driving…
Added 14 mins ago
Distinguished Forward Deployed AI Engineer
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Basking Ridge, NJ · Irving, TX · Temple Terrace, FL
…Where the true you can learn, grow, and thrive. At Verizon, we power and empower how people live, work and play by connecting them to what brings them joy. We do what we love - driving…
Added 21 mins ago
IC
• Senior Packaging Module Development Engineer
Intel Corporation
AZ
- $133,800 to $255,200 USD / year
You must possess the below minimum qualifications to be initially considered for this position
Added 22 mins ago
Sr. Physical Design Flow & Methodology Engineer
Lightmatter
Boston, MA
We’re looking for a Physical Design Flow & Methodology Engineer to help build the tools, flows and automation our physical design teams use to tape out high-performance ASICs and…
Added 22 mins ago
SerDes Applications Engineer
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United States
SerDes Applications engineer for ASIC Product Division (APD). Work as part of a team of highly skilled applications engineers providing first class support to customers from pre-sales to…
Added 25 mins ago
Manufacturing Engineer, AWS Power Electronics
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…manufacturing engineering to the next level. As a Senior Manufacturing Engineer on the AWS Board Core Design team (Core Components Group), you will develop, deploy, qualify, and…
Added 27 mins ago
Principal Transmission Engineer
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Added 27 mins ago
Principal Transmission Engineer
Westwood Professional Services Inc
United States
Westwood Professional Services, Inc. is seeking a Principal Transmission Engineer to join our team in our team. Westwood has a highly experienced and dynamic team of individuals dedicated…
Added 27 mins ago
Principal Transmission Engineer
Westwood Professional Services Inc
United States
Westwood Professional Services, Inc. is seeking a Principal Transmission Engineer to join our team in our team. Westwood has a highly experienced and dynamic team of individuals dedicated…
Added 27 mins ago
Principal Transmission Engineer
Westwood Professional Services Inc
United States
Westwood Professional Services, Inc. is seeking a Principal Transmission Engineer to join our team in our team. Westwood has a highly experienced and dynamic team of individuals dedicated…
Added 27 mins ago
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Principal Transmission Engineer
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- $140,000 to $180,000 USD / year
Westwood Professional Services, Inc. is seeking a Principal Transmission Engineer to join our team in our team. Westwood has a highly experienced and dynamic team of individuals dedicated…
Added 40 mins ago
Staff SerDes Characterization Engineer, Platforms
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Added 41 mins ago
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Added 42 mins ago
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Added 42 mins ago
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- $48.67 to $58.67 USD / hour
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Added 44 mins ago
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Develop and maintain a CI performance dashboard in Power BI and Tableau to provide real-time visibility into KPIs, support AS9100/ISO 9001 compliance, and enhance data-driven…

Intel Corporation

• Senior Packaging Module Development Engineer

AZ, United States

$133,800 to $255,200 USD / year

Apply on intel.wd1.myworkdayjobs.com About employer

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Job details

Pay: $133,800 to $255,200 USD / year
Apply by: Feb 11, 2027
Posting language: English
Posted: Nov 11, 2026

Original job description

Job Details:

Job Description:

At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's mission of delivering high-performance, cost-effective products that power the future of computing.

We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a key part in advancing Intel's IC substrate and packaging technologies. You will develop, optimize, and implement innovative processes, materials, and equipment configurations to enable next-generation packaging solutions. Combining physical experimentation with statistical data analytics and process modeling, your work will directly impact manufacturing efficiency, product quality, and reliability across Intel's advanced packaging portfolio.

Key Responsibilities:

Process & Material Optimization: Develop and refine packaging processes and materials to meet stringent quality, reliability, yield, and cost targets.
Workflow & Equipment Definition: Define and establish equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies.
Experimental Characterization (DOE): Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze complex material and equipment interactions.
Data Analytics & Process Modeling: Apply statistical methods, deep data analytics, and engineering scripting tools to optimize manufacturing processes, drive material enhancements, and resolve IC substrate development challenges.
Continuous Improvement: Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
Cross-Functional Problem Solving: Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting initiatives.
Technical Documentation & Transfer: Author technical documentation, including white papers and process specifications, to enable seamless technology transfer and knowledge sharing across global teams.

As a Successful Candidate, You Will Bring:

Technical Leadership & Influence: Strong leadership skills to guide cross-functional engineering efforts and drive technical alignment across diverse teams.
Analytical Problem Solving: Deep analytical mindset with a passion for combining empirical data and theoretical modeling to solve complex materials and processing challenges.
Clear Technical Communication: Concise written and verbal communication style to author specifications, publish internal white papers, and present findings to stakeholders.
Adaptability & Ownership: Self-directed engineer who thrives in a dynamic R&D environment and takes full accountability for project milestones.

Apply today to join Intel Arizona's Substrate Packaging Technology Development team. Take ownership of next-generation materials and processes, collaborate with world-class scientists, and build a rewarding engineering career.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field, with 6+ years of related experience; OR
Master's degree in the above fields, with 4+ years of related experience; OR
PhD in the above fields, with 2+ years of related experience.
Relevant experience can be any of the following:
Design of Experiments (DOE), statistical data analysis, and process control tools.
Understanding of IC substrate and/or advanced packaging processing principles.
Engineering programming tools like JMP, Python, MATLAB, or similar software for process modeling and/or data analysis.

Preferred Qualifications

3+ years of experience in:
Dielectric materials formulation (structure/property relations expertise) and/or processing.
Finite Element Analysis (FEA) modeling tools such as COMSOL, Ansys, etc.
Machine learning or artificial intelligence applications for engineering scenarios.
Designing experimental setups to validate modeling and simulation outputs.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. *

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Apply on intel.wd1.myworkdayjobs.com About employer

More about this job

Skills

Packaging
Data analysis
Packaging processes
Workflow
Manufacturing processes
Process improvement
Problem solving
Troubleshooting
Documentation
Leadership
Communication skills
Adaptability
Military drill
Materials science
Mechanical engineering
Chemical engineering
Control engineering
Python
The MathWorks MATLAB
FEA
Ansys

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Work requirements

Jobs in the United States