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Added 3 mins ago
TC
Advanced Energy Intern
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- $20 to $28 USD / hour
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Added 3 mins ago
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Portland, OR · Richland, WA · Seattle, WA
- $112,500 USD / year
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Added 8 mins ago
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Research Engineer II - Building Energy Modeling
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Portland, OR · Richland, WA · Seattle, WA
- $89,300 USD / year
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UNAVAILABLE · Portland, OR · Seattle, WA · Richland, WA
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Intel Corporation

Packaging Module Equipment Development Engineer

AZ, United States

$85,200 to $139,810 USD / year

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Job details

Pay: $85,200 to $139,810 USD / year
Apply by: Jan 29, 2027
Posting language: English
Posted: Oct 29, 2026

Original job description

Job Details:

Job Description:

At Intel, we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging solutions across Intel's diverse product portfolio. Through close collaboration with cross-functional teams, our group drives innovation in manufacturing processes, enhances product reliability, and contributes to Intel's broader mission of delivering world-class semiconductor technologies to global markets.

We are seeking a Packaging Module Equipment Development Engineer to join our onsite team in Chandler, Arizona. In this role, you will be at the forefront of advancing Intel's assembly and packaging technologies. You will develop innovative processes and refine equipment to enable next-generation packaging solutions that drive manufacturing efficiency, product reliability, and technological innovation. Working hands-on with advanced tools and materials, your contributions will directly support Intel's technology roadmap and global leadership in the semiconductor industry.

Key Responsibilities:

Assembly Process & Equipment Development: Develop, optimize, and qualify packaging assembly processes and hardware configurations to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
Statistical Process Characterization: Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to define process and equipment specifications, documenting improvements through technical reports and white papers.
Design-for-Manufacturability (DFM): Verify the manufacturability of physical package layouts and oversee the end-to-end lifecycle of manufactured package processes, procedures, and production flows.
Supplier & Material Management: Establish material specifications for contract assemblers and raw material vendors, partnering with supplier quality and procurement teams to enforce strict adherence to process and qualification standards.
Early Risk & Quality Screening: Create new acceleration methods, analytical tools, and quality screens to identify and mitigate potential packaging quality and reliability risks early in the development cycle.
Reliability Benchmarking: Set reliability requirements based on a fundamental understanding of failure mechanisms, influencing package design, material selection, and process development.
Global Standardization & Consultation: Deliver standardization across product qualification methods and manufacturing quality systems, providing technical consultation to internal partner groups and responding to customer requests.

As a Successful Candidate, You Will Bring:

Analytical Problem Solving: Strong troubleshooting mindset focused on innovating and continuously improving equipment and processes using structured experimental methods.
Cross-Functional Collaboration: Clear, direct communication style to consult on packaging challenges and align priorities across technology development, procurement, and external vendor teams.
Proactive Project Execution: Self-motivated and organized approach to driving complex, time-critical technical projects from concept through high-volume manufacturing.
Adaptability & Ownership: Thrives in a fast-paced, hands-on onsite lab and factory environment, taking full ownership of technical risk mitigation and product milestones.

Apply today to join Intel Arizona's Packaging Module Development team. Take ownership of cutting-edge assembly technologies, collaborate with world-class engineers, and build a rewarding career at the forefront of semiconductor innovation.

Qualifications:

This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

A Bachelor's, Master's in Engineering, Physics, Chemistry, or a related STEM discipline.

Preferred Qualifications:

6+ months of:
Hands-on semiconductor experience or academic research supporting or developing manufacturing equipment.
Experience working with dispense, mold, and/or cure packaging equipment technologies.
Experience applying Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Experience with semiconductor fabrication processes, equipment sustaining, change control management, or quality data systems.
Experience managing and delivering results for complex, time-critical technical projects.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00-139,810.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. *

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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More about this job

Skills

Packaging
Assembly
Manufacturing processes
Leadership
Statistical process control
SPC
Packaging processes
Procurement
Quality control systems
Problem solving
Troubleshooting
Collaboration
Communication skills
Adaptability
Military drill
Research

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