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Added 2 mins ago
Information Assurance Security Engineer - Top Secret
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WA · Redmond, WA · Redmond
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Senior Hardware Engineer
Microsoft
WA · CA · OR · Redmond, WA · Mountain View, CA · Hillsboro, OR · Redmond · Mountain View · Hillsboro
- $119,800 to $261,000 USD / year
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Added 34 mins ago
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Added 51 mins ago
Manufacturing Engineering Staff
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Added 51 mins ago
Principal Software Engineer
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Added 52 mins ago
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Engineer Signal Image Processing 2
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Cincinnati, OH
- $40 to $50 USD / hour
We are seeking a highly skilled Sr. Principal Digital Signal Processing Engineer to develop advanced signal processing solutions supporting mission-critical applications. This role is ideal…
Added 52 mins ago
Front End Web Applications Developer (Mid-Level) (5664)
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Added 1 hour ago
Lead Systems Design Engineer
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Remote, United States
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Remote, United States
- $190,000 to $215,000 USD / year
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Added 1 hour ago
Staff Embedded Software Engineer – AUTOSAR, Platform Software
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Advanced skills in on-chip debugging and hardware-software troubleshooting
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Design Verification Engineer
Microsoft
NC · Raleigh, NC · Raleigh
- $102,100 to $219,200 USD / year
…success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a…
Added 1 hour ago
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Member of Technical Staff, Microsoft Robotics (Robot Learning)
Microsoft
WA · Redmond, WA · Redmond
- $102,100 to $219,200 USD / year
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Added 2 hours ago
RF Engineer Sr Principal
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United States
We are seeking a Lead Engineer to drive the end-to-end software engineering function for mission and enterprise applications across classified environments. This role is accountable for…
Added 2 hours ago
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Intel Corporation

NM Wafer Packaging Manufacturing Advanced Packaging Engineer

NM, United States

$103,730 to $198,820 USD / year

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Job details

Pay: $103,730 to $198,820 USD / year
Posting language: English
Posted: Nov 5, 2026

Original job description

Job Details:

Job Description:

The Role and Impact

Note: This position requires regular onsite presence to perform essential job responsibilities. New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.

Key Responsibilities

Responsibilities include, but are not limited to:

Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
Support and sustain development and pilot production lines during early test vehicle and production phases.
Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.

Desired Behavioral Traits

The successful candidate will demonstrate:

A strong commitment to safety and a proactive approach to promoting a safe work environment.
The ability to thrive in a dynamic environment with evolving priorities and technical challenges.
A results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability.
Excellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives.
The ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels.
Proven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities.
A continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence.

Qualifications:

Minimum Qualifications

Bachelor's degree in a STEM or related engineering discipline with 4+ years of relevant semiconductor industry experience; or
Master's degree in a STEM or related engineering discipline with 3+ years of relevant semiconductor industry experience; or
PhD in a STEM or related engineering discipline with relevant academic or research experience in semiconductor technologies, electronics, mechanical engineering, manufacturing processes, or closely related fields.

Relevant experience may include:

Semiconductor processing and manufacturing
Process characterization and optimization
Manufacturing process control methodologies
Continuous process improvement initiatives
Equipment maintenance and troubleshooting
Design of Experiments (DOE) and data-driven problem solving

Applicable experience may be obtained through a combination of the areas listed above and does not need to be accumulated separately within each discipline. For candidates qualifying through the PhD pathway, relevant academic research, laboratory work, publications, or dissertation projects may be considered in lieu of additional full-time industry experience.

Preferred Qualifications

Hands-on experience in a semiconductor manufacturing environment, with a focus on process sustaining and/or process development.
Knowledge of statistical analysis and experimental design methodologies, including their application to tool matching, tool qualification, and process optimization.
Understanding of semiconductor process flows (logic and memory) and related metrology techniques and assessments.
Proven project management skills, including experience leading cross-functional teams or task forces to solve complex technical challenges.
Strong communication and collaboration skills, with the ability to work effectively across diverse teams, functions, and geographic regions.

Join us in shaping the future of semiconductor innovation. Apply now and become part of a team that is redefining the limits of technology through advanced manufacturing excellence. Minimum Qualifications

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, New Mexico, Albuquerque

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. *

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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More about this job

Skills

Packaging engineering
Packaging
Assembly
Manufacturing processes
Leadership
Organizational skills
Problem solving
Communication skills
Collaboration
Prioritization
Process improvement
Research
Mechanical engineering
Equipment maintenance
Troubleshooting
Statistics
Project management
Geographic areas

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