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Added 2 mins ago
Sr Director, SW Product Management
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…limitless potential of RISC-V to the highest performance and most data-intensive applications in the world. SiFive’s unrivaled compute platforms are continuing to enable leading technology…
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Added 9 mins ago
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Module Development Engineer
Intel Corporation
OR
- $133,800 to $188,890 USD / year
…delivering Intel's high-performance devices. In this role, you will design experiments, analyze data, and refine process methodologies, ensuring seamless integration and manufacturability.…
Added 9 mins ago
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Module Equipment Development Engineer
Intel Corporation
OR
- $115,110 to $219,550 USD / year
Utilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield
Added 10 mins ago
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Added 11 mins ago
R&D Glass Melting Process - Summer Intern 2027
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Senior Electrical Engineer / HVAC
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Senior Electrical Engineer / HVAC
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Intel Corporation

Module Equipment Development Engineer

OR, United States

$115,110 to $219,550 USD / year

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Job details

Pay: $115,110 to $219,550 USD / year
Experience: Master's degree in relevant STEM fields with 3+ years of domain-specific experience
Posting language: English
Posted: Nov 6, 2026

Original job description

Job Details:

Job Description:

The Role and Impact:

As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel's technological leadership in the semiconductor industry and advance the capabilities of future technologies.

Business Group:

Intel Foundry Technology Development is focused on advancing semiconductor process engineering and delivering world-class manufacturing solutions that power Intel's product innovation. Working within this group, you will collaborate with global teams to develop cutting-edge technologies that enable the design and production of leading-edge devices, helping Intel maintain its leadership in a competitive and fast-paced market.

Key Responsibilities:

Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.
Develop robust Equipment modules that can be transferred seamlessly to high volume manufacturing.
Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes
Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites
Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning
Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps
Utilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield
Partner with cross-functional teams to ensure seamless process integration and manufacturability

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field, with 4+ years of industry experience in semiconductor processing

Master's degree in relevant STEM fields with 3+ years of domain-specific experience

PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ months experience in semiconductor processing

Industry experience in semiconductor processing/domain-specific experience includes one of more of the following:

Proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization
Expertise in process characterization methods and statistical analysis tools, such as JMP, MATLAB, or Python
Familiarity with materials characterization techniques like SEM, TEM, XPS, or ellipsometry

Preferred Qualifications:

Hands-on experience working with equipment troubleshooting, maintenance, or development in collaboration with suppliers
Experience at a Semiconductor manufacturing tool supplier.
Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD
Strong problem-solving skills with the ability to manage multiple tasks in a fast-paced environment
Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared goals

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. *

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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More about this job

Skills

Leadership
Process engineering
Manufacturing processes
Apply advanced manufacturing
Data analysis
Statistical process control
SPC
Research
Materials science
Chemical engineering
Electrical engineering
Statistics
The MathWorks MATLAB
Python
SEM
Troubleshooting
Collaboration
Problem solving

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