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Intel Corporation

Module Development Engineer

OR, United States

$133,800 to $188,890 USD / year

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Job details

Pay: $133,800 to $188,890 USD / year
Education: Doctoral degree
Experience: Master's degree in the same fields with 3+ years of experience in semiconductor manufacturing, process development, or equipment development.
Posting language: English
Posted: Nov 9, 2026

Original job description

Job Details:

Job Description:

The Role and Impact Intel's advanced packaging technology development organization is seeking a Module Development Engineer to support the development of next-generation semiconductor packaging technologies, with a focus on 3D Integrated Circuit (3D IC) technology and advanced manufacturing processes. In this role, you will contribute to the development, evaluation, and optimization of semiconductor manufacturing processes that enable future technology generations. Working closely with engineering and manufacturing teams, you will help develop innovative process solutions, address complex technical challenges, and support the introduction of new technologies into the factory. This position offers the opportunity to work on cutting-edge semiconductor technologies while contributing to Intel's continued leadership in advanced packaging and 3D IC development.

Key Responsibilities

Develop, evaluate, and optimize semiconductor manufacturing processes supporting next-generation 3D IC and advanced packaging technologies.
Support technology development initiatives focused on introducing new processes and manufacturing capabilities for future technology generations.
Conduct process characterization, experimental evaluations, and data analysis to identify opportunities for process improvement.
Apply statistical process control (SPC), design of experiments (DOE), and engineering analysis techniques to evaluate process performance and support technology development.
Troubleshoot manufacturing process and equipment challenges, perform root cause analysis, and implement corrective actions to improve process performance.
Collaborate with cross-functional engineering teams to support process integration, equipment development, and manufacturing readiness.
Participate in the evaluation, qualification, and optimization of manufacturing equipment and process technologies.
Work with engineering and manufacturing teams to identify opportunities for process automation, efficiency improvements, and technical innovation.
Document experimental results, technical findings, and process development activities to support engineering decisions and future technology implementation.
Contribute to the successful development and transfer of next-generation semiconductor packaging processes.

Qualifications:

Minimum Qualifications

Candidates must possess one of the following:

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 4+ years of of experience in semiconductor manufacturing, process development, or equipment development.

Master's degree in the same fields with 3+ years of experience in semiconductor manufacturing, process development, or equipment development.

PhD in the same fields with no prior industry experience required.

Additional Technical Requirement

1+ year of combined experience across the following areas:
Statistical Process Control (SPC) and/or Design of Experiments (DOE).
Semiconductor processing, system controls, or mechanical systems.

Preferred Qualifications

Experience programming or developing engineering solutions using Python and/or MATLAB.
Hands-on experience with robotics, equipment automation, machine vision, or image processing systems.
Experience troubleshooting semiconductor manufacturing equipment or processes, including root cause analysis and corrective action implementation.
Experience with semiconductor packaging processes, including advanced packaging technologies.
Experience with equipment development, automation development, or engineering project management.

We welcome your expertise and creativity to join Intel's dynamic team, where you can make a meaningful impact on the future of semiconductor technology. Apply today and take the next step in your career.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. *

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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More about this job

Skills

Packaging
Apply advanced manufacturing
Manufacturing processes
Leadership
Data analysis
Process improvement
Statistical process control
SPC
Troubleshoot
Root cause analysis
Packaging processes
Materials science
Mechanical engineering
Chemical engineering
Electrical engineering
Mechanical systems
Python
The MathWorks MATLAB
Robotics
Image processing systems
Troubleshooting
Project management

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