Quality Engineer

JOB DESCRIPTION

Job Title: Quality Engineer FLSA Status: Exempt Reports To: Site Director of Quality Department Name: 51 – Quality Assurance Location: Wichita

POSITION SUMMARY (Briefly describe the purpose of the position) Technical quality leader for Integra’s semiconductor wafer probe, assembly, and test operations. Drives problem solving, corrective and preventive action, and continuous improvement to product that meets customer, AS9100, and applicable military and automotive requirements. Serves as a quality interface to customers on RMAs, CARs, and outgoing defectivity issues.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE (List in order of importance)

• Understand semiconductor test methods, standards, and methodology (e.g., MIL-STD-883, MIL-STD-750, JESD47, JESD22), to review and verify device screening, qualification, and reliability testing at Integra.
• Apply statistical methods (Cpk, DOE) and measurement system analysis, including Gage R&R and measurement uncertainty, to monitor process capability, test limits, and measurement systems.
• Interpret customer specifications and complete First Article Inspection Reports (FAIRs) per AS9102.
• Lead cross-functional problem-solving teams (8D) to resolve customer complaints and RMAs, provide effective CAR responses, and verify effectiveness of corrective and preventive actions for material processed in wafer probe, assembly, and final test.
• Disposition nonconforming material through the Material Review Board; investigate processing discrepancies and recommend containment and corrective actions.
• Support the AS9100 Quality Management System: perform assigned internal audits, support customer audits and quality surveys, manage Quality Documentation Manual (QDM) document releases, and train personnel on quality requirements.
• Drive process improvements; create and maintain FMEAs, process flow charts, work instructions, and other quality documentation.
• Flexibility to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE (List as required or preferred)

Education: Bachelor of Science Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or related Engineering discipline required. Electrical Engineering preferred. Experience: At least 3 years’ experience in semiconductor manufacturing, Product Engineering, Test Engineering, or Quality Engineering (wafer probe, assembly, and/or final test) required. Experience with AS9100 and/or ISO 9001, MIL-PRF-38535, MIL-STD-883, MIL-STD-750, 8D corrective action, FMEA, Six Sigma, Lean, or AEC-Q100/IATF 16949 preferred.

Knowledge/Skills:

• Working knowledge of semiconductor manufacturing, test, and reliability concepts, including wafer probe, die/package assembly, burn-in, final test, yield, and failure analysis.
• Strong leadership and technical skills with proven ability to drive complex issues to closure in a timely manner and clearly communicate the result.
• Proficient in statistical analysis and data-driven decision making; experience with tools such as JMP, Minitab, or equivalent.
• Working knowledge of quality system standards and tools: AS9100/ISO 9001, AS9102, 8D, FMEA, and MSA.
• Self-motivated professional with excellent customer service, teambuilding, and interpersonal skills, able to communicate effectively, verbally and in writing, with employees at all levels of the organization, including executives, and with external customers to achieve required results.
• Effectively and efficiently utilize Microsoft Office and other computer products and programs.
• Ability to accurately track, enter, and maintain data.
• Ability to access export-controlled technical data (U.S. person status required per ITAR/EAR).

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SUPERVISORY RESPONSIBILITIES

Total Number of Employees Directly Supervising: _0 _

Number of Subordinate Supervisors Reporting to Position: _0 _

This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified. In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).

I have read the job description, as well as the physical requirements below, and understand the expectations. By signing below, I acknowledge that I am able to perform the essential functions and meet the minimum requirements.

EMPLOYEE___________________________________________ Date ____________

PHYSICAL REQUIREMENTS INCLUDE

In an average workday, employee must (check one frequency for each task):

Task None Occasional Frequent Constant

Stand ☐ ☐ ☒ ☐

Walk ☐ ☐ ☒ ☐

Sit ☐ ☐ ☒ ☐

Bend/stoop ☐ ☒ ☐ ☐

Climb ☒ ☐ ☐ ☐

Reach above shoulders ☐ ☒ ☐ ☐

Squat/crouch/kneel ☐ ☒ ☐ ☐

Push/pull ☒ ☐ ☐ ☐

Lift ☐ ☒ ☐ ☐

Usual amount ☒ <10 lbs ☐ 11-25 lbs ☐ 26-50 lbs ☐ 51+ lbs

Carry ☐ ☒ ☐ ☐

Usual amount ☒ <10 lbs ☐ 11-25 lbs ☐ 26-50 lbs ☐51+ lbs

Employee must use hands for repetitive action such as (please check all):

Task Right Hand Left Hand

Simple grasping ☒ Yes ☐ No ☒ Yes ☐ No

Firm grasping ☒ Yes ☐ No ☒ Yes ☐ No

Fine manipulation ☒ Yes ☐ No ☒ Yes ☐ No

WORKING CONDITIONS INCLUDE

In an average workday, employee is exposed to (check one frequency for each task): Task None Occasional Frequent Constant

General shop conditions ☐ ☐ ☒ ☐

General office environment ☐ ☐ ☐ ☒

Humid, extreme hot/cold temps (non-weather) ☒ ☐ ☐ ☐

Outdoor weather conditions ☒ ☐ ☐ ☐

Fumes or airborne particles ☒ ☐ ☐ ☐

Fluorescent lights ☐ ☐ ☐ ☒

Moving, mechanical parts ☐ ☒ ☐ ☐

Toxic chemicals ☒ ☐ ☐ ☐

Loud noise intensity levels ☒ ☐ ☐ ☐

Risk of electrical shock ☒ ☐ ☐ ☐

Travel for job ☒ ☐ ☐ ☐