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Added 1 min ago
R&D Engineer 2/3
Los Alamos National Laboratory
Los Alamos, NM
This position will be filled at either the R&D Engineer 2 or R&D Engineer 3 level, depending on the skills of the selected candidate. Additional job responsibilities (outlined below) will…
Added 1 min ago
R&D Engineer 4 (Welding Engineer)
Los Alamos National Laboratory
Los Alamos, NM
You will participate in manufacturing process development and execution for gas tungsten arc (GTA) welds, and other high energy density welding processes (laser and electron beam welding)…
Added 1 min ago
Materials Science Post-Bachelor's Engineer
Los Alamos National Laboratory
Los Alamos, NM
The MST-8 Materials Scattering Team is seeking a post-bachelor's engineer to support in situ microstructural characterization using neutron and synchrotron X-ray sources. The successful…
Added 1 min ago
Engineer I-IV
TXNM Energy
Albuquerque, NM
Added 1 min ago
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Associate Support Engineer
Oracle
Santa Fe, NM
- $21.3 to $45.05 USD / hour
Added 1 min ago
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Senior Core Infrastructure Engineer - Nashville, TN
Oracle
Santa Fe, NM
- $79,200 to $209,500 USD / year
Added 2 mins ago
Platform Engineer - Remote
SitusAMC
Santa Fe, NM
Minimum of 6+ years of industry and/or relevant experience, typically with 1+ years in a Senior Associate level role or external equivalent
Added 9 mins ago
Sentinel - Principal / Sr Principal Systems Engineer - 19282
Northrop Grumman
Roy
This requisition may be filled at either the Principal Systems Engineer level (T-03) or Sr Principal Systems Engineer level (T-04).
Added 9 mins ago
Associate Manufacturing Engineer
Northrop Grumman
Palmdale
Northrop Grumman Aeronautics Systems (NGAS) has an opening for an Advanced Automation Manufacturing Engineer Level 1 to join our team of qualified, diverse individuals. This position will…
Added 9 mins ago
Manufacturing Engineer
Northrop Grumman
Palmdale
Northrop Grumman Aeronautics Systems (NGAS) has an opening for an Advanced Automation Manufacturing Engineer Level 2 to join our team of qualified, diverse individuals. This position will…
Added 11 mins ago
Platform Engineer - Remote
SitusAMC
Des Moines, IA
Minimum of 6+ years of industry and/or relevant experience, typically with 1+ years in a Senior Associate level role or external equivalent
Added 12 mins ago
IT Network Engineer Sr.
Ann & Robert H. Lurie Children's Hospital of Chicago
Streeterville, IL
The IT Network Engineer, Senior is primarily responsible for the design, implementation and support of enterprise network infrastructure utilized by Lurie Children’s Hospital. This includes…
Added 18 mins ago
Automation Engineer I/II (MES)
Novo Nordisk
Clayton, NC
Work with business stakeholders and/or project team and vendors to ensure Process Control Systems and Manufacturing Execution Systems for existing and/or new equipment and processes are in…
Added 18 mins ago
Packaging Engineer Co-Op
Coty
Sanford, NC
Kick off a challenging and rewarding engineering career with Coty! Our Supply Chain Packaging Engineer Co-Op assists the Research and Development Packaging team in the definition of…
Added 18 mins ago
Principal Engineer, Automation Engineering -Aseptic Filling SME
J&J Family of Companies
Wilson, NC
The engineer will exercise independent technical judgment, resolve complex automation issues, and provide technical leadership to suppliers, engineers, and technicians. The role partners…
Added 18 mins ago
Technical Support Engineer - Second Shift
NetApp
Morrisville, NC
…for all employees. This means that most roles will have some level of in-office and/or in-person expectations, which will be shared during the recruitment…
Added 18 mins ago
GE Vernova Nuclear Engineer - Stability Analysis 1
GE Vernova
Wilmington, NC
Contribute to team process improvements to drive speed and simplification.
Added 19 mins ago
Senior Infrastructure Security Engineer - CASB and DSPM
Prudential Ins Co of America
Newark, NJ
We are looking for a motivated Senior Infrastructure Security Engineer to support the design, implementation and operation of data security controls across cloud and SaaS environments. This…
Added 23 mins ago
Information Security Engineer – Global Security Infrastructure
Micron Technology
Boise
JR116695 Information Security Engineer – Global Security Infrastructure
Added 23 mins ago
Sr. Engineer – DRAM Failure Analysis
Micron Technology
Boise
JR116981 Sr. Engineer – DRAM Failure Analysis
Added 23 mins ago
Firmware Engineer, Member of the Technical Staff
Micron Technology
San Jose
JR116984 Firmware Engineer, Member of the Technical Staff
Added 23 mins ago
Staff Engineer, Systems Performance
Micron Technology
Richardson
Deploy, performance tune, and test data center solutions using cutting-edge memory and storage. Execute systems level projects to better understand data center workloads and maximize the…
Added 23 mins ago
Staff Structural Engineer
Micron Technology
Boise
As a Structural Engineer, you will provide technical expertise throughout the design and construction lifecycle of major capital projects. You’ll work with design partners, contractors, and…
Added 23 mins ago
New College Grad - Product Yield Enhancement Engineer
Micron Technology
Boise
JR116872 New College Grad - Product Yield Enhancement Engineer
Added 23 mins ago
New College Grad - PCVD Process Engineer
Micron Technology
Boise
JR116753 New College Grad - PCVD Process Engineer

Insight Global

Principal Thermal & Multiphysics Program Manager

Austin, TX, United States

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Job details

Posting language: English
Posted: Oct 1, 2026

Original job description

Job Description

Insight Global is looking for a Principal Thermal & Multiphysics Engineer Program Manager that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. This will be the day-to-day execution and sponsor interface for a large, complex, government-funded program with high visibility and rigorous reporting and tracking responsibilities.

This role is to lead and execute comprehensive thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Responsibilities:

Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates. Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design. Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains. Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows. Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams. Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies. Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums. Other related functions as assigned.

Skills and Requirements

7 or more years of direct, hands-on experience in thermal & multiphysics simulations Program management experience working with customers and EDA vendors Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio. Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows. Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline. MS or PhD in Electrical Engineering, Applied Physics, or related discipline. 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms. Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.). Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal employment opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment without regard to race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request to HR@insightglobal.com.

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Skills

ANSYS Multiphysics
Packaging
Leadership
Microelectronics
Reporting
EDA
Ansys
Program management
Python
Electrical engineering
Computer engineering

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