Lead Thermal Design Engineer

Required Skills & Experience

• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or related technical field; Master’s degree preferred.
• 5–10 years of relevant experience in thermal design, cooling architecture, analysis, and validation of complex hardware systems. ○ 50% design & cooling architecture vs. 50% validations ○ For QTP, the lead engineer should own the thermal assessment for new customer requirements, such as a new PCIe adapter, a higher-power CPU, or a different storage configuration. They should develop the appropriate solution and perform thermal validation. ○ A Lead Engineer is expected to lead a team to successfully execute a complex project, while a Sr. Engineer focuses more on individual deliverables.
• Strong expertise in CFD or equivalent thermal modeling techniques and interpretation of system-level thermal behavior. ○ We use Siemens Flotherm & FloEFD at Taipei site ○ It is needed to understand how to build model and analysis the results
• Experience defining and executing thermal validation plans and driving technical issue closure across product programs.
• Familiarity with server, storage, networking, AI infrastructure, or other high-power electronics products is required. ○ Strongly preferred to have server/AI infrastructure experience
• Strong analytical skills and ability to communicate technical risk, data, and recommendations clearly.
• Demonstrated ability to lead technical efforts across matrixed, cross-functional engineering teams.

Job Description

The Thermal Engineer is responsible for leading thermal architecture, analysis, and validation activities across complex hardware platforms. This role drives cooling strategy, owns thermal risk management, and ensures products achieve performance and reliability targets through disciplined simulation, testing, and cross-functional problem solving.